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New Multimedia Board adds WiFi Connectivity. • 2 tCP/IP Stacks, USB, ... 04. eTech - ISSUE 6. Flexibility gives FPGAs
e

YOUR ELECTRONICS MAGAZINE

06 DesignSpark PCB takes design to

ANOTHER DIMENSION www.rs-components.com

ISSUE 6

Microcontrollers

PIC32 32-bit MCU Families With Ethernet, CAN, USB and 128 KB RAM Offer High-Performance Connectivity

Digital Signal Controllers Analog Memory

Three New PIC32 32-bit MCU families with integrated connectivity • all three families have: - USB Host, device, and On-the-Go - 6 Uarts, 5 I2C™, 4 SPI - 64 KB to 128 KB of raM • MX5 Family: CaN • MX6 Family: 10/100 ethernet MaC • MX7 Family: dual CaN, 10/100 ethernet MaC

Get Started IN 3 eaSY StePS

1. Purchase a new PIC32 ethernet Starter Kit 2. download Free tCP/IP and USB software stacks 3. Purchase a Multi Media expansion Board if you need extra functionality

Part No: dM320004 - rS Stock No: 686-8657

Complete development solution, with software, tools, and boards • • • •

New PIC32 ethernet Starter Kit and PIC32 USB Starter Kit II New Multimedia Board adds WiFi Connectivity 2 tCP/IP Stacks, USB, encryption, Graphics, File Systems CaN libraries in Compiler Part No: dM320005 - rS Stock No: 715-4252

Intelligent Electronics start with Microchip www.rs-components.com The Microchip name and logo, the Microchip logo, MPLAB, PIC and I2C are registered trademarks of Microchip Technology Incorporated in the USA and in other countries. All other trademarks are property of their respective companies. © 2011 Microchip Technology Incorporated. All rights reserved. ME241C-Eng/02.11D

Microchip Direct... 2nd line

Microchip extends its 80 MHz 32-bit PIC32 microcontroller portfolio with three new families that provide up to 128 Kbytes of raM and extensive integrated connectivity options. these are complemented by Microchip’s Free software stacks, making it easier for embedded designers to add connectivity to their applications.

B C P K DESIGNSPAR

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PR

14 USB 3.0 One of the triumphs of the Harry Potter movie franchise is the plethora of magical gizmos it features, springing from the fertile imaginations of J.K. Rowling and the movie special effects department. Yet some of these ideas are no longer so far fetched or magical. The ‘talking newspaper’ seen in some scenes, for example is available today on the iPad. I know, because RS has, from our previous issue made eTech available as a downloadable iPad App, and I’m the one doing the talking. Our theme this issue is connectivity, and that’s particularly appropriate because it is connectivity that is enabling this functionality. A chain of wireless and wired connections carries a voice recording, a video clip, an image or a piece of text from the source, to your iPad (or netbook, Kindle, laptop, smartphone…) No wonder that at RS we’re seeing explosive growth in interest in the products and technologies that create the links in that chain. In this issue of eTech, we’re exposing just a few of those. USB3.0 is poised to transform the relationship between computers and peripherals. ZigBee is seeing increasing uptake as a simple mesh networking protocol. Power over Ethernet simplifies these networks and potentially saves power. The Human Machine Interface (HMI) is the final, and arguably the most important link in that connectivity chain, and we have a major article that looks at how technology pioneered in game consoles is being used in industrial and instrumentation applications.

Terms and conditions: Terms and conditions of sale set out in the current RS Catalogue. This issue is valid from April 2011 to June 2011.

Published by: RS Components Limited. Registered office: Birchington Road, Weldon, Corby, Northamptonshire NN17 9RS. Registered No. 1002091. RS Components Ltd 2010. RS are trademarks of RS Components Limited. An Electrocomponents Company.

Place FSC logo here

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Our mission at RS is to help you Find the right connectivity solutions for your next project, Design them in and then make it simple to Buy the components you need for prototypes and production. Offering eTech on your iPad as well as in print and online is one part of that mission. The new version of DesignSpark PCB described in this issue is another. Watch this space for more! PS:…. and before you ask: yes we are planning to extend our iPad app to other platforms like Android.

Glenn Jarrett Head of Electronics Marketing RS Components

INSIDE eTech 04 05 06 10 12 14 16 18 19 20 22 24 26 28 32 34 36 42

iSAY RS NEWSLINE DESIGNSPARK PCB PRODUCT NEWS THINK GLOBALLY, ACT LOCALLY USB 3.0 OPEN SOURCE HARDWARE USER GROUP CUSTOMER PROFILE POWER OvER ETHERNET PROBE SELECTION MARKET TRENDS RS EDP FAN IS A BLAST DESIGN TIPS: NETWORKER ELECTRONICS ExTRAS POWER OF TOUCH RAPID POWER INDUSTRY NEWS: FRAUNHOFER eTech - ISSUE 6

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iSAY JEAN-LOUIS BRELET, SENIOR MARKETING MANAGER PRODUCT DEFINITION, XILINX SAYS:



Flexibility

gives FPGAs the

advantage



Flexibility gives FPGAs the advantage in growing number of applications.

The

flexibility of programmable components has become more important than ever as electronics adoption continues to grow in more and more applications. For example, in the automotive industry on-board integrated systems are multiplying to provide greater convenience and safety, along with improved pollution control. Cutting-edge electronic modules provide greater functionality at ever-decreasing cost. The standard components (or Application Specific Standard Product (ASSP)) and specific ASIC-type circuits (Application Specific Integrated Circuit) available on this market are however often found to be inadequate for the demands made on them. The needs of manufacturers frequently change between the initial design specification and the arrival of a new vehicle on the market, making demands on the flexibility of the electronics which are difficult to satisfy using ASSPs and ASICs, especially within an accessible price range. The cost of masks set in 40/45 nm technologies reaches millions of dollars. The effect of this is clearly a fall in the number of ASSPs and ASICs. In 2009, the number of new ASIC designs fell by 21%. FPGAs, on the other hand, are entering the world of processors because of their flexibility of use, coupled with the efficiency and performance levels of hardware solutions. SRAM-based programmable components combine the benefits of fast integration and flexibility during the design stage while being adaptable to multiple standards. For instance, the FPGA is now vital in mobile telephone infrastructures. The latest generations being installed are based on 3GPP LTE technology, whose full range of specifications is not yet finalised. Base station suppliers have however already begun to deliver LTE technology,

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while remaining committed to support the existing 3G W-CDMA or CDMA2000 standards. Equipment manufacturers must ensure that these base stations can be easily upgraded when required to adapt to any change in standard. In addition, operators require slight variations in different countries and some parts of the world are intending to use WiMax. To my knowledge, no supplier of fixed and mobile telecommunications infrastructure relies only partially on FPGA solutions. Programmable components are fast becoming the only economically-viable approach for new systems.



...on-board integrated systems are multiplying to provide greater convenience and safety, along with improved pollution control



Share your opinion on this at www.designspark.com/etech

RS NEWSLINES

eTech launches as the first Electronics Industry iPad Magazine App Featuring enhanced interactive content including images, animation and video free of charge This iPad app provides a new way to display product and technology information, extending and enhancing the magazine content with additional images, animation and video, making it a truly interactive customer experience.

beyond the basic page-turner digital magazine, taking full advantage of the device’s off-line viewing capabilities.” Download the latest edition of eTech on iPad through the App Store.

Commenting on the launch, Glenn Jarrett, Head of Electronics Marketing at RS said, “With more and more information sources available to design engineers, it is imperative that RS provides them with news in the format that they find both informative and engaging. eTech for iPad is an industry first and has been developed to go

Supporting R&D of Intelligent Robots in Japan With the use of sensors the Intelligent Robot Laboratory, at Tsukuba University in Japan, develops an autonomously controlled robot. The research and development of the robot required a wide variety of manufacturing knowledge covering from electronic and mechanical components. A target of the Intelligent Robot Laboratory, School of Systems and Information Engineering at University of Tsukuba, is to develop a robotic technology to meet with the social requirements not just spec. requirements. And the robot which is autonomously-controlled and makes decision of how it acts according to the circumstance by collected and previously-stored data with sensors. Dr. Shin’ichi Yuta, from Tsukuba

Dr. Shin’ichi Yuta

University commented, “It was a paradigm shift.” RS features a wide variety of product portfolio, the next day delivery, and longtail products. I was astonished at the speed of delivery of RS Components, not to mention the support provided through regular advice through face-to-face meetings.”

EnBW Engineers build an Automated Cocktail Mixer Four trainees at EnBW in Tuttlingen, Germany, have built an automated cocktail mixer as their final project as they study to become Industrial Electronics Installation Engineers. The engineers built a mixer that could accommodate a large spindle bearing eight bottles. Plexiglass windows and a stepper motor was used to push the

spindle over cog wheels. A PLC and two custom boards were also used. To provide efficient service, an LCD display shows users the cocktails they have selected and an aluminium compression tool driven by a geared motor is used to pour out the required level of liquid from the bottles. For the mixer’s electronic systems, a

large number of small components including transistors, resistors, rectifiers, capacitors, microprocessors and the stepper motors, all of which they obtained quickly and easily using the RS E-Procurement service.

RS announces partnership with board manufacturers BVM and Microsoft RS Components are pleased to announce the partnership with BVM and Microsoft to provide design engineers, exclusive access to a complete range of motherboard kits with Windows Embedded software installed and ready to use. This is the first partnership of its type in the high-volume distribution market place, linking the RS design engineering community (DesignSpark) and the ecommerce trading site users with market-

leading board developer BVM and software giants Microsoft. This joint venture provides engineers with a plug and play solution which is transferable across devices with easy adoption routes, offering a long-term development lifespan. Commenting for BVM, Robert Wainwright, General Manager said “we are committed to working in partnership with both our

customers and suppliers; our business is focused on doing what is best for all stakeholders, to ensure we deliver the best product and service to the end customer. Clearly RS are a great partner to meet these objectives and Microsoft thinks so too.” Find out more on the BVM / Microsoft / RS partnership at www.designspark.com eTech - ISSUE 6

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...3D viewer, enabling engineers to gain a ‘real life’ view of a PCB layout during design...



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DesignSpark PCB Version 2 takes PCB design to

DESIGNSPARKPCB

another dimension By Martin Keenan

The launch of DesignSpark in summer 2010 sent ripples through the engineering world. With free online resources and design support, waves of engineers soon joined the community. One of the biggest success stories since the launch of DesignSpark has been DesignSpark PCB; a completely free and unrestricted professional-grade schematic capture and PCB design environment.

Now,

after just nine months, the number of downloads for DesignSpark PCB has exceeded 60,000; that’s around 300 per working day since its launch! With a commitment to maintaining and improving what is rapidly becoming one of the most important engineering resources to engineers in over 150 countries across the globe, RS has announced Version 2 of DesignSpark PCB. This is the first official revision of the tool and while it remains totally free and unrestricted in its functionality, it boasts a long list of new features. Engineers can download Version 2 today from www.designspark.com/pcb and start enjoying all the new features and existing benefits that large corporate users, as well as SMEs and hobbyists around the world, have already discovered. In fact, the diverse cross-section of DesignSpark PCB users is something RS is particularly proud of; the intention is to develop, support and maintain DesignSpark PCB to remain an industry-leading resource, and with the release of Version 2 comes the addition of many new features that extend the tool’s capability, usability and

functionality, resulting in an even better experience for the many thousands of engineers already using it. The expectation is that this commitment to development will help to further increase its popularity and encourage the DesignSpark community to continue contributing their ideas for future enhancements.

Through the 3D Viewer, engineers can review a three-dimensional representation of their board, at any stage during design, to quickly evaluate the mechanical design. Any adjustments can easily be carried out in the 2D view and checked in the 3D Viewer for near-instant visual feedback.

3D Viewer Added One of the major new features of DesignSpark PCB Version 2 takes PCB design to another dimension – literally! The development team have implemented a 3D Viewer, enabling design engineers to visualise in real time their final project, rendered in a highly accurate, fully detailed 3D view. DesignSpark PCB has always offered the ability to export designs to a CAD environment that offer a 3D representation of the board and its components, for mechanical design. While this is still possible, using a pre-loaded and extensible library of 3D components engineers no longer need to move to a CAD environment, or export an intermediary file, to visualise their design in 3D.

The 3D Viewer is found in the tool bar and along with the ability to view a populated board in 3 dimensions, engineers also have the option to edit individual component settings, to get the most realistic representation possible – all from within the same design environment; DesignSpark PCB. Continued page 08> eTech - ISSUE 6

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There are now some 30,000 registered users of DesignSpark and downloads of the tool number 55,000



< Continued from page 07

New capabilities As well as the breathtaking 3D Viewer, DesignSpark PCB’s Version 2 also introduces a number of new capabilities. These enhancements include being able to automatically create and save a new library as an item, as well as saving the selected components directly to a library from the design view. Simpler and more comprehensive output is enabled through two new features; a new column type allows plain text to be inserted in to reports, while a new bitmap printing option enables greater flexibility. In addition to these capabilities, DesignSpark PCB will also provide a drill indent output option, able to switch between separate plated and unplated drills. Greater usability We live in a connected world, where candid feedback via online portals has become second nature and, as with most wellreceived products, DesignSpark PCB has generated its fair share of on-line debate. Thanks in part to this user feedback some features have been highlighted where usability could be further improved. So in response to this, the first major upgrade to DesignSpark PCB will include a number of usability enhancements, which include new commands in the Project menu that allow sheets within a project to be duplicated or renamed. It will also be easier when adding a new component to return to the dialog box; by simply pressing the

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‘escape’ key. To enable finer gained design, the resolution of angular rotation has also been increased, while the Library Manager function will also offer new ‘move to’ and ‘save to’ commands. More functionality Adding to the enhanced usability, functionality has also received some attention; support for the widely used Excellon drill file format has been extended to support different drill tool numbers across drill files. Other enhancements include the ability to paste copies of components in the same position, as well as add values to all the alternate footprints of a component when editing just one. The success of DesignSpark PCB reinforces the belief that the electronics engineering community needs professional tools and services that aren’t just free to use but offer real value, with an uncompromising commitment to support that only a company like RS can truly offer. With the release of DesignSpark PCB Version 2, RS has reaffirmed its commitment to delivering the best open source experience to its engineering community.

Get more online... Share your experience using DesignSpark PCB on www.designspark.com

Amphenol range increased to over 9,000 connectors at RS New introductions expand the Amphenol portfolio, including renewable energy, industrial, medical, military, data and audio technology markets, all available direct from stock for next-day-delivery

RJField range

XLR Solutions

Ecomate Series

62GB Electroless Nickel

See the full range at : www.rs-components.com

PRODUCT NEWS FIBRE OPTIC CONNECTORS Fibre Optic Transceiver for high speed data rates n The AFCT-5805xxZ transceiver is a high performance, cost effective module for serial optical data communications applications specified for a data rate of 155 Mb/s. It is designed to provide a SONET/SDH compliant link for intermediate reach links operating at +3.3 V or +5.0 V input voltage. Application areas include links for LAN backbone switches and routers, WAN core, edge and access switches and routers, links for add/drop multiplexers and demultiplexers and SONET interconnections Online search term: AFCT-5805

POSITION SENSORS FROM SPECTRASYMBOL Contactless, low profile and high temperature Position Sensors. n Membrane Sensors from SpectraSymbol have transformed the way engineers think about position sensing through a low form-factor (less than 0.5mm), better value compared to other linear sensors, and high adaptability for design constraints. We have now introduced high temperature linear sensor applications with the Hotpot, rising to +85°C in operation or storage, the MagnetoPot for contactless applications and the ThinPot which is half the width of the traditional Softpot product. Online search term: Spectrasymbol

MCx CONNECTORS - FROM CABLINE Specifically designed conectors for LCD applications n Cabline V is used in slimline LCD applications. It is now considered the defacto standard of LVDS panel interface for LCDs with LED backlight. Cabline VS is specially designed for the transmission/shield performance of the Displayport signal which is the embedded standard interface of the FPD and is certified to the latest VESA specification. Online search term: CABLINE

LECROY USB ANALYSERS PCMCIA card USB 2.0 Analysers n The Lecroy USBMobile T2 is a small and affordable hardware-based USB 2.0 protocol analyser family that combines de-facto standard CATC Trace display with powerful analysis features. Features include : portable operation with any PCMCIA compatible PC, CATC trace analysis software, 64 MByte recording memory, High impedance probe, 2 mini AB USB ports, Advanced Triggering and Event reporting. Online search term: Lecroy, USB

vNC2 vINCULUM USB HOST DEvELOPMENT KIT vNC2 vinculum USB Host Development Kit n V2-Eval Board is intended for use as a hardware platform to enable easy evaluation of FTDI“s Vinculum-II VNC2 series of embedded USB Host / Slave controllers. The V2-Eval Board includes all the necessary components required by a user to begin developing USB Host / Slave system applications based on the VNC2 device. There are two USB type A connectors for connecting to USB slave peripherals, FT42232H USB to quad channel UART device for VNC2 programming & debug functions and USB type B connector for connection to PC host via FT4232H. The board supply voltage is +4.75 to +5.25V and supply current is 60mA Online search term: 708-0110

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See more online - Over 5,000 new products are

PRODUCT NEWS MICROMATCH CONNECTORS 1.27mm - Tyco AMP MICRO-MATCH™ IDC Series n This small system of IDC connectors have a contact spacing of 1.27mm, offer a range of wire-to-board & board-to-board intercommunications. The contacts are fully protected by plastic housings, providing high performance and reliability with built in Polarisation. No additional strain relief is required. The contact spring system is in the female board header and not in the wire connector, which compensates for positional tolerances and prevents fretting corrosion. Online search term: idc micro-match 1.27mm

SCHOTTKY DIODES Rectifiers - Schottky Barrier Up to 0.199A n We have increased the range from Vishay and can now provide Small signal schottky diodes for general purpose applications. The diodes feature low turn-on voltage and high breakdown voltage and are protected by a PN junction guard ring against excessive voltage, such as electrostatic discharges. They are available in the DO-35 case with type designation BAT41, and are AEC-Q101 qualified. Online search term: vishay 7103* “Diode Schottky”

USB2.0 HUB CONTROLLERS Industry’s First Single-Chip, USB 2.0 Hub and 10/100 Ethernet Controllers n SMSC are the first company to introduce a fully integrated 2/3/4 port Hi-Speed USB 2.0 hub with 10/100 Ethernet controllers. SMSC’s UniClock™ technology simplifies the clocking scheme and reduces system BOM cost by using a single 25MHz crystal for both USB and Ethernet connectivity − without the need for extra components when adding USB hubs. They have built-in ±8kV/15kV contact/air discharge ESD protection on both USB and Ethernet PHYs . Multiple Operation Systems are supported including: Windows® 7, Windows XP, Windows Vista®, Windows CE, Windows Mobile®, Linux® and Mac®. Online search term: 716-0449

THERMAL INTERFACE KIT Comprehensive Thermal Interface Sil-Pad kit n Bergquist is a world leader for Sil-Pad materials to meet critical needs of a rapidly changing electronics industry. This universal kit comprises of different forms of Sil-Pad, Q-Pad and GapPad insulators with the necessary accessories required to attach them to the PCB. The thermally conductive insulators, continue to be a clean and efficient alternative to mica, ceramics or grease for a wide range of electronic applications. They provide excellent thermal performance, eliminates the mess of grease, is more durable than mica and the“total applied cost” compares favourably with other alternatives. Online search term: 127-057

added at www.rs-components.com every month

GDT 2 AND 3 ELECTRODE SURGE ARRESTERS Surge Arrestors from Epcos n Excessive voltages and the resulting surge currents can damage or even destroy communications equipment, data transmission and energy supply systems. Gas-filled surge arresters offer optimal protection in these cases. They limit surge voltages quickly and safely to uncritical values and reliably discharge any dangerous currents that may occur. We have now have full portfolio of Epcos devices that are very smal,l have a fast response time and stable performance over the lifetime with extremely low capacitance. Online search term: epcos GDT

eTech - ISSUE 6

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Think globally, act locally Wireless Personal Area Networks: Zigbee or IEEE 802.15.4? Certification, Standards and Alliances.

While

electromagnetic radiation in the form of radio waves has been exploited for over a century, without the incredible success of mobile phones its real commercial potential may yet remain unrealised. While cellular technology provided a focus for R&D as well as a return on that investment, it has encouraged and enabled the development of an ever widening array of wireless technologies. Though the basic principles remain unchanged, the various regulations and protocols that are applied to them continue to define the world around us. Perhaps unsurprisingly, wireless technologies that operate in the unlicensed part of the spectrum have seen the greatest amount of interest and as those frequencies become increasingly congested so too does the need for encoding techniques and protocols that are able to cope with the ‘noise’ from other devices.This, along with the need for reliable interoperability, has led to the evolution of industry standards, governed by independent bodies which attempt to accommodate both the commercial and technical requirements of developers and consumers alike. One such standard is IEEE 802.15.4, often referred to by its ‘brand name’ of ZigBee. It sits

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alongside other standards from the same group (802.15) which defines wireless personal area networks (WPAN), and is itself a subset of the more overarching group, 802, which defines local area networking in general and is not restricted to wireless technologies. While the standard defines the physical (PHY) and media access (MAC) layers, it is the set of protocols developed to exploit the underlying network architecture that is actually known as ZigBee. Although the ‘brand’ name and the standard are often synonymous, early adopters were prone to using the PHY/MAC technology with proprietary protocols, rather than ZigBee itself, largely due to manufacturers wishing to protect their market share from competitors with compatible solutions. However, while this may have initially stymied the adoption of ZigBee in some applications areas, it has not impeded the development and adoption of IEEE 802.15.4 compliant solutions. Today there are a number of chipsets and even single-chip solutions available on the market. RS stocks a number of compliant solutions from manufacturers including Texas Instruments, Freescale, Microchip and Atmel.

The right profile The real power of the 802.15.4 standard is its ability to create networks using multiple nodes within the immediate area, and to use this network to exchange relatively small amounts of data in a power-efficient way. This contrasts with other WPAN technologies, such as WiFi and Bluetooth where, although capable of creating ad hoc networks or peerto-peer connections, their higher bandwidth and more demanding power requirements will likely preclude them from encroaching on the burgeoning application areas where ZigBee is now being applied. A significant boost to ZigBee’s appeal – and prerequisite for interoperability and certification – is the development and application of profiles. These effectively define the application area for a ZigBee device and today there exist a number of profiles which cover health care, home automation, smart metering and most recently remote control. The profile for remote control, which was created after the ZigBee Alliance agreed to cooperate with the RF4CE Consortium, is now beginning to see widespread deployment in consumer electronics. It effectively replaces

the older IR style remote control with an RF device, which doesn’t rely on a clear lineof-sight to operate. More significantly, the integration of ZigBee into consumer devices will not only allow a single remote to control multiple devices, but also enable those devices to communicate directly, to share information about the use and distribution of multimedia, and even shut down equipment automatically when it isn’t being used.



Low power, short range wireless communication is expected to support greener living...



Atmel recently announced that its ATmega128RFA1 single-chip wireless microcontroller has been certified by the ZigBee Alliance to the ZigBee Remote Control standard, which was developed for the

ZigBee RF4CE specification. It means device manufacturers can now integrate Atmel’s solution secure in the knowledge that it will be compatible and interoperable with other devices that have been certified to the same standard. Low power, short range wireless communication is expected to support greener living through the secure exchange of data using intelligent sensors to control our immediate environment which, in turn, could help the global environment too.

Find the latest Zigbee ranges at www.rs-components.com

Get more online... Share your thoughts on Zigbee adoption at www.designspark.com eTech - ISSUE 6

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SuperSpeed or Supersede? Will USB 3.0 ring the death knell for slower serial interfaces?

USB 3.0

has arrived; at over 10 times faster than USB 2.0 it promises to provide quicker file transfer between enabled devices, feeding consumers’ insatiable appetite for storing, streaming and sharing high bandwidth data such as multimedia files.



Over 10 times faster than USB 2.0 it promises to provide quicker file transfer between enabled devices 14

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As with previous incarnations of the universal serial bus, and holding fast with its underlying premise of ease of use, USB 3.0 (or SuperSpeed USB as it has become known) will provide backwards compatibility with USB 2.0, even though it is electrically and mechanically quite different. In order to reach the blisteringly high 5Gbit/s bandwidth it uses two differential pairs; one for transmitting and one for receiving, as opposed to the single differential pair for tx/rx as used in USB 2.0. To accommodate this without sacrificing compatibility, the specification adds four additional wires to the cable assembly. This, in turn, necessitates a different connector profile but in order to make it physically compatible with the existing USB user base, the additional connections are located at the back of the connector, behind the existing USB 2.0 connections. This clever innovation does have some implications, however. It means that only Standard-A receptacles (the ones most frequently found on PCs) will accept both USB 2.0 and SuperSpeed 3.0 Standard-A plugs. Standard-B, Powered-B, Micro-B and Micro-AB receptacles (the ones now commonly found on portable devices) will only offer backwards

compatibility; USB 2.0 receptacles won’t be able to accept USB 3.0 plugs as they are physically larger, however USB 3.0 receptacles will accept USB 2.0 plugs thanks to the connector’s design. Beyond the physical differences, the protocol used by SuperSpeed is significantly different from its predecessors, although this will be largely transparent to the user. It will require a new generation of controllers and drivers, the availability of which will be significant in helping USB 3.0 realise its full potential. The SuperSpeed interface uses full duplex transfer, thanks to the use of two independent differential channels. Also, the use of a packet based protocol makes the data routable between host and device, as opposed to the broadcast method used in USB 2.0, all of which contributes to achieving the higher bandwidth speeds. Predominantly this no longer relies on polling, or asking each peripheral whether it has data to send, meaning the bus is only active when data is being moved, which has the added benefit of improving power management, which is now addressed at every layer of the interface to deliver a significant power saving. For instance, at the link layer there are four link states, which can be selected to trade off the power consumed against the latency of the interface. Also, the USB 3.0 specification increases the amount of power that a host can distribute, from 500mA to 900mA.

external hard drive manufacturers are already announcing products, such as Buffalo Technology’s latest range of USB 3.0 enabled storage solutions which was announced at the recent Consumer Electronics Show (CES) in Las Vegas. CES 2011 was also the venue for a number of other announcements around USB 3.0, such as Genesys Logic’s introduction of a range of controllers including a 4-port hub controller, flash card reader controller and a SATA bridge controller. VIA Labs also used CES 2011 to demonstrate its range of USB 3.0 controllers. Speculation that USB 3.0 will displace USB 2.0 has, inevitably, caused some providers to question whether it is commercially viable to continue to invest in USB 2.0 development. The answer is almost certainly yes, because although SuperSpeed offers many benefits, it is unlikely to be cost-competitive in all applications. The undeniable appeal of USB coupled with the benefits of SuperSpeed and its compatibility with USB 2.0 may even regenerate the market for USB in general, as no other serial interface offers the same level of convenience or, with the advent of SuperSpeed, the same high bandwidth.

Support for the new USB 3.0 receptacle will, of course, take time but there are a number of PCI bus expansion cards available for PCs that offer the new interface, while newer PCs, laptops and other devices will be able to support the standard natively. Software support will come in the form of drivers, which will need to be added to all the operating systems in circulation, although initially this may also involve peripheral manufacturers developing drivers for the relevant OS, too. With high speed serial communications comes a need for comprehensive test and measurement during the development phase and in response to this need, leading T&M companies including LeCroy and Tektronix now offer automated test suites for USB 3.0, along with the necessary probes and interface hardware for their respective oscilloscopes. The primary appeal of USB 3.0 is its high speed and as it becomes more widely adopted, it will create opportunities for high speed peripherals;

Find the latest USB 3.0 ranges at www.rs-components.com

Get more online... Share your thoughts on USB 3.0 Superspeed at www.designspark.com eTech - ISSUE 6

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Images from OSHUG events

Introduction to

Open Source Hardware by Andrew Back, Open Source Hardware User Group

Within the last few years the open source hardware movement has been subject to explosive growth, as hobbyists to established multi-national organisations have come to realise the inherent potential of engaging in open collaboration and liberal licensing of hardware design artefacts. What started as a niche phenomenon is now a multimillion dollar industry that continues to grow and that shows no signs of slowing down.

As

the name suggests open source hardware (OSHW) adopts the principles and methodologies employed in the development of open source software and applies them to hardware development. As with the development of open source software there is no rigid formula, however, a fundamental principle is that design artefacts will be made available at zero cost and via a liberal licence. These may be, for example, schematics, CAD files, PCB layouts or C or HDL source code. Through publishing these via an open source licence the copyright holder grants anyone the right to study, modify and improve the design, and for them in turn to subsequently make it or a derivative work available in a similar manner to third parties.

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eTech - ISSUE 6



...hobbyists to established multi-national organisations have come to realise the inherent potential of engaging in open collaboration and liberal licensing of hardware design artefacts...



It is important to note that not all open source designs must start out that way and there is no reason why proprietary technology cannot be “open sourced”, that is provided that you hold all the rights to the design. However, most OSHW projects are open from the offset and are often the result of collaboration that crosses organisational and geographic boundaries. With public resources such as mailing lists, version control systems, wikis and bug trackers typically being employed in support of their development. The poster child of the OSHW movement is without a doubt the Arduino microcontroller platform, and the success it has enjoyed is in no small part due to its open nature and the fact that this aspect has served to foster a substantial ecosystem. Which has not only benefited third parties through the creation of new business opportunities, but has also enabled the platform to secure significant market share. Whilst its highly active and ever growing community of users and a culture of sharing has enabled globalscale support. Arduino is just the tip of the iceberg and you’d be mistaken if you thought that OSHW was only concerned with simple systems. The movement boasts, for example, multiple cutting edge softwaredefined radio (SDR) projects, high performance embedded computing platforms, low cost desktop 3D printers and an affordable USB protocol analyser project, to name but a few out of hundreds. As was initially the case with open source software, OSHW has its own share of detractors. It may be difficult to at first see how it could work when the replication costs for hardware are so much greater than those associated with software. However, it offers the potential to democratise the hardware development process, reduce development costs, drive reuse, simplify business relationships in collaborative environments and to create opportunities for new entrants. By its very nature it supports learning and for this and other reasons it is also gaining favour in education. The numbers speak for themselves and as of May 2010 there were already at minimum thirteen OSHW companies with >$1m revenue. While this might sound like small change, let us remember the humble beginnings of the multi-billion dollar open source software industry.

For information on the Open Source Hardware User Group visit http://oshug.org

Get more online... DesignSpark regularly covers OSHW developments. Find out about the latest initiatives at www.designspark.com eTech - ISSUE 6

17

CUSTOMER PROFILE

Q

uick

uestions

Key Facts

Company Name

Bytec Group

Year established

2007

Location

Redhill. Surrey

Number of employees

30

Key market

Medical and rugged keyboards, Displays and HMI

Website

www.bytecmedical.co.uk

Interviewee name

James Barr

Interviewee position

Senior Product Designer

What is your latest product? MediKey Mk2 Infection control keyboard What differentiates your products? High level of water ingress protection, rugged enclosure and multipoint gesture touchpad. What new technologies does your product employ? Anti-Microbial silver ion additive is included in the plastic and rubber covers. Brand new ‘widescreen’ format touchpad. How did you equip yourselves with knowledge of this new technology? We have a dedicated team of electronics engineers who routinely investigate new technologies to keep well informed on new innovations. Give an example of the impact one of your products has on, or the benefits it provides to, the end user. Sold predominantly to the healthcare industry our Medi-Key keyboard takes on board years of research gained through sales into the medical sector. As a HMI (Human Machine Interface) solution it incorporates a touchpad and full size keyboard but with the crucial advantage of being able to be ‘deep cleaned’ (submerged in soapy water), essential to help prevent cross contamination between different users and spread of contagious diseases. How do you learn about new technologies? We regularly monitor trade press, websites and have a network of industry contacts who offer advice and keep us updated on new technologies.

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eTech - ISSUE 6

How do you gain new skills? Seminars and webcasts offer good opportunities for training on specific activities (mostly relating to software), but also the everyday activity of ‘design’ uncovers new challenges which push us all to explore all avenues of reference media to solve a problem. What RS service do you find most useful in your job and why? The fast delivery of goods is essential. When you discover you need something specific to complete a prototype you can most often find it in RS online and have it the next day. What technology do you foresee having the biggest impact on your next product? There is always evolution within our designs, sourcing of electronic and mechanical components and having access to a wide selection to choose from in one place is very important. For example new switches which have better functionality or a smaller form factor than previously help to give our designers the freedom to explore new options. What is the biggest threat to your business? Many sales are into funded organisations. There is always the worry that budget cuts will affect our customers’ spending power. Where do you see your industry in 5 years? The medical industry on the whole tends to be fairly constant. It is in the most part an industry (alongside military) which weathers recessions well and has good opportunities to grow as technology becomes less expensive or more mature over time.

Power over Ethernet started out as a proprietary technology developed by network equipment vendors such as Cisco, to deliver power to voIP (voice over Internet Protocol) phones without using separate power supplies. Other manufacturers soon realised the advantages of sending DC power over the network: especially, cheaper cabling and higher data rates than alternative USB and AC powerline technologies.

POWER OvER ETHERNET

SIMPLIFYING THE EQUATION These

are benefits not only for IP telephones, but also for security cameras with pan/ tilt/ zoom functions, embedded computers, Ethernet switches, thin clients and even LCD displays. Such diversity also brought the need for standardisation.

Figure 2. Typical PoE powered access point: the access point’s PSU needs are supplied via the Ethernet cable using the PoE splitter seen on the side of the Ethernet wall socket

RJ-45 Input (Data Only)

IEEE 802.3af-2003 The original IEEE 802.3af-2003 standard defined the implementation of sending power as well as data over Ethernet cabling. Category 5 cables contain four twisted pairs, but only two are used for data transfer in either 10BASE-T or 100BASE-TX. This leaves two pairs available to carry DC current. Power is delivered to the end device (PD) either by PoE enabled Ethernet switches (endspans) or by injection from a midspan power supply.

IEEE 802.3at Updated in 2009, IEEE 802.3at uses phantom power techniques to allow powered pairs to also carry data. This extends its use to 1000BASE-T, which uses all four cable pairs for Gigabit/s data. In real-life applications, PoE Plus or PoE+ is able to deliver 25.5W at 44V and up to 350mA down a standard Category 5 Cable using two twisted pairs. [Midspan manufacturers such as Phihong have extended this capability by delivering power through unused data pairs as well as the network cables in use.] PoE support from RS RS stocks many components to support PoE designs including ICs from Texas Instruments, National Semiconductor, Linear Technology and STM Electronics. In addition, our range includes off-the-shelf solutions such as powered device (PD) interfaces from Murata, PoE enabled microcontrollers from Olimex and Phihong’s range of midspan injectors and splitters.

RJ-45 Output (Data & Power)

Pin

Symbol

Description

Symbol

Description

1

RX+

Data Receive(+)

RX+

Data Receive(+)

2

RX-

Data Receive(-)

RX-

Data Receive(-)

3

TX+

Data Transmit(+)

TX+

Data Transmit(+)

4

NC

No Connection

+Vdc

DC power(+)

5

NC

No Connection

+Vdc

DC power(+)

6

TX-

Data Transmit(-)

TX-

Data Transmit(-)

7

NC

No Connection

-Vdc

DC power(-)

8

NC

No Connection

-Vdc

DC power(-)

Figure 1. Example configuration with an original data-only versus a PoE solution

To learn more about PoE see the Design Tips section in this issue on Pages (28,29 and 30) for an Elektor reference design.

Get more online... Simply go to www.rs-components.com and search for “PoE”. eTech - ISSUE 6

19

PROBE SELECTION?

NO PROBLEM. By Trevor J Smith, Market Development Manager, Tektronix

Test and measurement with oscilloscopes is key aspect of electronics design. Of course, the first priority is choosing the correct scope for the task, but probe selection should not be overlooked either. Using the wrong probe can potentially compromise measurements and ultimately derail the final design.

Fundamentally, the probe needs to provide a connection of adequate quality between the signal source and oscilloscope input. The ideal probe would offer convenient and easy physical connection and absolute signal fidelity with zero signal source loading and total immunity from noise. For miniaturized circuitry, such as high-density surface mount technology (SMT), connection ease and convenience are promoted through subminiature probe heads; and most suppliers offer a range of probe-tip adapters specifically designed for SMT devices. At the other end of the spectrum, applications such as industrial power circuitry demand physically larger probes with greater margins of safety, in order to handle high voltages and heavier-gauge wires. Oscilloscopes can also have different input connector types and input impedances. For example, most scopes use a simple BNCtype input connector; others may use SMA connectors; and still others broaden the options to include support for readout, trace ID, probe power or other special features.

20

eTech - ISSUE 6

Delivering signals faithfully Beyond these requirements, the ideal probe needs to take the signal at the probe tip and faithfully deliver it unchanged to the oscilloscope input. This is impossible to achieve in practice, but designers should strive to minimise attenuation, maximise bandwidth, and deliver as close as possible to linear phase at the voltages and frequencies of interest. For accurate amplitude measurements the bandwidth of the measurement system should as a general rule be five times greater than the frequency of the waveform being measured; and in measuring pulse rise or fall times, the rise time of the probe and oscilloscope together should be three to five times faster than that of the pulse being measured. Analysing the system bandwidth or rise times from the individual oscilloscope and probe bandwidths is far from simple, so manufacturers of quality oscilloscopes specify these values based on specific combinations of ‘scope and recommended probe models. Using a probe that is not on the oscilloscope’s recommended list runs the risk of unpredictable measurement results.

BNC and SMA type connectors and special features.

Standard BNC Probes. Probes with a plain BNC connector will connect with virtually all Tektronix oscilloscopes. Low cost passive probes generally have a plain BNC connector.

TekProbeTM Level 1 BNC Probes. TekProbe Level 1 BNC connector equipped probes communicates scale information to the oscilloscope so that the oscilloscope correctly conveys accurate amplitude information.

In addition to imposing bandwidth and risetime constraints, the real-life probe also acts as a load at the test point, which can change the signal that the circuit or signal source sees. Especially at higher frequencies, capacitive loading reduces bandwidth and increases rise times for the overall measurement system. This effect can be minimized by selecting probes with low tip capacitance values. A further consideration is the probe’s inductance, which interacts with capacitance to cause ringing at a certain frequency. The impact is reduced by designing probe grounding so that the ringing frequency occurs beyond the bandwidth limit of the probe+oscilloscope system. A complex decision? Not any more. Probe selection doesn’t stop there. It should also factor-in the type of signal being measured: voltages, logic, currents, optical

TekProbeTM Level 2 BNC Probes. The TekProbe Level 2 BNC shares the scale information of the Level 1 but also provides power for a whole host of active electonic probe designs.

TekVPI® Probes. TekVPI equipped probes offer advances in power management and remote control. TekVPI probes are an ideal choice for applications where computer control is important.

signal or vibrations, for example. By selecting a probe appropriate to the type of signal, direct measurement results will be attained more quickly.

TekConnect® Probes. Probes with TekConnect interface support the highest bandwidth active probes offered by Tektronix. The TekConnect interface is designed to support probe requirements >20 GHz.

RS also carries a constantly expanding library of manufacturer’s technical briefs, application notes and other resources will help get the most out of probes and other equipment.

Moreover, designers need to consider the amplitudes of the signals being measured. Are they within the dynamic range of the ‘scope? If not, a probe is required that can adjust dynamic range. Generally, this will be through attenuation with a 10X or higher probe. If all this sounds over-complex, there is plenty of help available to guide users through the selection process. RS and Tektronix have recently announced a new on-line, interactive tool that enables users to select by series, model number, or standards/application, then fine tune the search with specific testing requirements. The list of matching products updates with each step.

Get more online... Specialised probes provide a convenient physical connection to high density SMT boards.

RS and Tektronix have announced an online interactive probe selection tool, available at: www.rs-components.com eTech - ISSUE 6

21

MARKET TRENDS

European Market Watch Wireless Market Moves to Cash in on M2M Boom Machine-to-machine is the focus as mobile communications seeks ubiquitous presence By Francis Sideco With the arrival of the second decade of the 21st century, the global wireless business is shifting its focus from the so-called ubiquity of coverage to the ubiquity of presence through the proliferation of communications technology into a range of non-handset devices. While much attention has been heaped upon devices like netbooks, e-readers and tablets, one of the most critical areas underpinning the ubiquitous presence revolution will be wireless connections for Industrial MachinetoMachine (M2M) communications, an area that will generate huge growth opportunities for the wireless supply chain, according to new IHS iSuppli research. This was one of the many topics in the wireless market that was discussed during iSuppli’s 2010 European Briefing, held on Dec 1-3, at the Hotel Concorde in Berlin, Germany, during Day One’s topic Ubiquitous Connectivity and the Renewed Economy. Worldwide shipments of Wireless Wide Area Networking (WWAN) modules are set to rise by a factor of 10 from 2009 to 2014. In contrast, global mobile handset shipments will increase by only 40 percent during the same period. During the past 10 years, the wireless industry has managed to extensively deploy data-capable digital networks, leading to the nearubiquity of wireless subscriptions, with worldwide subscriptions for wireless services reaching 5 billion in September, equalling 73.4 percent of the earth’s population. However, in 2010, the wireless industry now stands at the threshold of venturing outside of its traditional market of handsets and insinuating itself into every aspect of the human condition – including communications between the machines that support our day-to-day activities. Major markets expected to adopt wireless M2M technology include utilities, automotive and healthcare. In healthcare, for instance, wireless M2M allows cardiac patients to be outfitted with a device that collects and uploads data to a medical center. This enables heart patients to engage in normal day-to-day activities while undergoing medical diagnoses that previously required a trip to the hospital. In utilities, wireless M2M can be used for automated meter reading, advanced metering infrastructure and smart grids. iSuppli estimates that for every household, at least three types of meters can be connected: electric, gas and water.

22

eTech - ISSUE 6

M2M devices in most cases use similar – if not the exact same – products and solutions employed in the handset and non-handset wireless device market for their communications requirements. This represents a major opportunity for the whole wireless value chain, at all node, to expand its total available market with relatively minor modifications to its existing products, if at all. However, there are also important differences M2M and consumer wireless devices. First, M2M now is mainly oriented toward 2G wireless service – unlike the 3G-centric mobilized consumer devices – even though M2M is beginning to transition to 3G. Second, among consumers, the main concern is high speed and performance. On the M2M side, the overriding consideration is rugged design. Companies that can manage these differences whole leveraging their existing wireless technology stand to benefit enormously from the arrival of the M2M market.



Worldwide shipments of Wireless Wide Area Networking (WWAN) modules are set to rise by a factor of 10 from 2009 to 2014



s

y ela

R

i

Sw

s

e tch

o

t ho

P

s o M

Range extends to more than

1,000 products...

Energy, Environment, Automotive, Transportation, Industry

DESIGN REvIEW

CONNECTING THE ANALOGUE WORLD TO

RS EDP

Analogue Input Module: Setting up the Anti-Aliasing Filter Get the Specification Before the considering the analogue input to a digital system, the designer must have available a certain amount of numerical data:

f > 2f S

max

: No Aliasing

Signal Power

f < 2f S

: Aliasing

max

Signal Power

• The maximum frequency component of the analogue signal

Aliased Frequencies

• The Dynamic Range of the analogue signal (ratio of the maximum to the minimum input signal level) • The required Signal-to-Noise ratio of the digitized signal The first point is what concerns us here when deciding on the cut-off frequency of the input analogue low-pass-filter. Decide on the sampling rate The sampling rate is set according to the Nyquist criterion which states that it must be at least twice that of the maximum frequency component present in the analogue signal. This ensures accurate reproduction of the signal, but a much higher rate will ease the design of a vital circuit that precedes the ADC: the Anti-Aliasing filter.

Fig.1 Aliasing Signal Power

Sampling rate MUCH greater than Nyquist Lower Order, shallow roll-off LPF required

Signal Power

Sampling rate JUST greater than Nyquist High Order, steep roll-off LPF required

Fig.2 Designing the Anti-Aliasing Filter: Cut-off and Roll-off

24

eTech - ISSUE 6

DESIGN REvIEW Design considerations for the Anti-Aliasing Filter The frequency plots in Fig.1 provide a graphical representation of aliasing. In this example we are going to sample a signal which has a maximum frequency component of fmax (the band in green) using a sampling frequency of fs. The plot on the left shows all the new frequencies present in the nonaliased sampled signal. Note that we now have new bands of frequencies (in blue) each with a width of 2 x fmax and centred on the sampling frequency ƒs and its harmonics. This is a correctly sampled signal because fs > 2 x fmax. By contrast the plot on the right shows extensive aliasing where the various bands overlap leading to the production of erroneous frequencies in the green baseband. The practical problem is that few ‘raw’ signals have a nice, clean fmax. In order to avoid aliased components being produced, a lowpass anti-aliasing filter needs to be placed in circuit before the ADC. Fig.2 shows the trade-off between sampling rate and the order of the low-pass filter. The designer can massively over-sample and then use a simple low-order filter or select a lower rate and then be faced with the need for a complex multi-pole type. However the ability of the DSP device to process the algorithm between consecutive samples must be considered before the sampling rate is set. It can save a lot of trouble later if the DSP program is tested and timed on a suitable development system before the sampling rate is fixed and the filter designed. Anti-Aliasing Filters on the Analogue Input Module (EDP-AM-AN16) Sallen-Key filters are used on the Analogue Input module which provides filter circuits for up to 16 input channels. Eight have simple passive 1-pole filters, six have fixed cut-off (12kHz) 2-pole Sallen-Key filters with a roll-off of -40dB/decade and two have 2-pole filters whose cut-off frequency can be set by digital potentiometers. These two filters on channels AN0 and AN1 can be cascaded by means of a solder-link to provide a single 4-pole filter on AN0 with -80dB/decade roll-off.

Programming the Digital Potentiometers The potentiometers are programmed from an I2C serial bus with two allocated to each filter controlling the resistive components which set the cut-off frequency. [1] Advantage is taken of a simplification of the Sallen-Key filter which occurs when the two resistances and two capacitances are in the ratio 2 to 1. [2]

Resources [1] Software drivers for the AN16 module together with full code listings of sample programs can be downloaded from the EDP Design Centre on the DesignSpark website at: http://www.designspark.com/design-centre. [2] Analysis of the Sallen-Key Architecture, TI Application Report, SLOA024B. Share your views on this article at www.designspark.com

dB 2-Pole Filters, AN0 or AN1 Roll-off = -40dB/decade

0

20

4-Pole Filter, AN0 + AN1 Roll-off = -80dB/decade

40

60

100

1000

10000

100000

1000000

f Hz

Filter cut-off range AN0 or AN1

Fig. 3 Frequency response of digitally-controlled filters on AN0 and AN1

Rf = 6772556u/Fcut_off; R2_Pot = 12000u*Rf/(12000u-Rf); R1_Pot = R2_Pot/2u;

/* Calculate filter R2 resistor value */ /* Digital pot in parallel with 12k resistor */ /* R1 resistor value = R2/2 */

Set_resistance(1u,R1_Pot); Set_resistance(2u,R2_Pot);

/* Call AN16 driver and set Pot channel 1 */ /* Call AN16 driver and set Pot channel 2 */

Listing 1. C code for calculating the AN0 filter resistance values

Get more online... See the latest on EDP at www.designspark.com/theme/rs-edp eTech - ISSUE 6

25

How unlocking information from a fan is a

blast!

Communication may sound like an odd way to address growing energy concerns and rising prices but communicating with fans can do just that.

ebm-papst

manufactures around one million fans and motors per week and increasingly these are electronically commutated or EC fans. These fans offer much higher efficiency than AC fans and their onboard electronics offers communication to a level that was previously impossible. However, many end-users still consider fans as dumb, unintelligent devices and are missing out on the vital information which is available to keep a system running. Whether a cooling system is looking after a data centre or keeping perishable goods in perfect condition, downtime is costly and time consuming. All fans move air and air contains contaminants such as dust and other airborne particles which can clog filters and leave deposits that will reduce a system’s efficiency. These issues can be managed by using speed control to optimise air flow rate to the minimum required. Fan speed control also brings other advantages such as reducing power consumption and increasing life expectancy. It can also allow other parts of the system to run more efficiently too, by stabilising head pressure in a refrigeration circuit for example. By communicating with the onboard electronics of EC fans, closed loop speed control has never been easier. Using an RS-485 interface supporting the Modbus RTU protocol, ebm-papst EC fans provide both speed control, through pulse width modulation (PWM) and 0-10volt input signals, and speed monitoring. Unlike the more familiar RS-232, RS-485 can be configured to act as a simple network allowing

26

eTech - ISSUE 6

multiple devices to be connected on one single cable that can be up to 1200 metres long. The hardware needed for RS-485 is also very low cost using simple screw terminals in most cases and typically just one driver IC connected directly to a microprocessor. RS-485 is found as a common interface on PLC controllers and on industrial PCs making it quick and easy to connect them to fans and other devices. Modbus is also a very common protocol used by leading PLC manufacturers and building management systems (BMS). The Modbus interface on larger ebm-papst fans covers speed setting, speed monitoring and condition monitoring information such as hours run and fault status with appropriate alarm outputs. This information can be collected and analysed to allow maintenance personnel to detect potential problems and implement preventive maintenance. Communication with fans can bring many benefits, as can communication with any device. However putting this information to good use is key for business and engineers alike if they are to have an advantage in today’s markets.

Find out more about the ebm-papst range of fans available from RS at www.rs-components.com

Get more online... Share your thoughts on fan technology at www.designspark.com

Latest RS-Introductions Latest introductions to the RS-offering include cost/performance optimizations, range extensions, solutions for railway applications and other innovations to meet state of the art customer requirements.

A snapshot of the continuous TRACOPOWER DC/DC converter innovation program:

www.rs-components.com

TRA-1

1W

SIP package, semi-regulated, 1500 VDC I/O-isolation

TRV-1

1W

SIP package, semi-regulated, 3000 VDC I/O-isolation

TMR-3E

3W

SIP package, 2:1 input, cost optimized design, remote On/Off

THL-3WI

3W

DIP package, 4:1 input, remote On/Off, input filter to meet EN 55022 class A

THL-3WISM

3W

SMD package, 4:1 input, remote On/Off, input filter to meet EN 55022 class A, cost optimized design

TSR-3

3A

Ultra compact non isolated switching regulators, highest efficiency, remote On/Off

THL-6WISM

6W

SMD package, 4:1 input, input filter to meet EN 55022 class A

TEN-8WI

8W

DIP 24 package, extended product range with 43 - 160 VDC input range and railway approval

THL-10WI

10 W 1“ x 1“ package, 4:1 input, high performance, cost optimized design, standard pinout

THL-20WI

20 W 1“ x 1“ package, 4:1 input, high performance, cost optimized smallest 20 W converter!

TEN-20WIR

20 W 2“ x 1“ package, 4:1 input incl. high input range 43-160 VDC, EN 50155 for railway applications

TEN-40N

40 W 2“ x 1“ package, 4:1 input, high performance, smallest 40W converter!

TEP-150WI

150 W High power module, new available with filter option to meet EN 55022 class B

For full TRACOPOWER Product Range:

www.tracopower.com

DESIGN TIPS

IN ASSOCIATION WITH

NETWORKER An advanced web server with a micro By Sven Schlender (Germany) An Internet connection would be a valuable addition to many projects, but often designers are put off by the complexities involved. The ‘NetWorker’, which consists of a small printed circuit board, a free software library and a ready-to-use microcontroller-based web server, solves these problems and allows beginners to add Internet connectivity to their projects. More experienced users will benefit from features such as SPI communications, power over Ethernet (PoE) and more.

There

are three key elements in connecting a device to an Ethernet network: the Ethernet connection hardware itself, the software library and finally the top-level firmware functions. The circuit is based around a Microchip PIC18family microcontroller which includes a built-in Ethernet transceiver. The author has added a few new functions to the free C software library available from the manufacturer that implements the TCP/IP stack. The final element of the project is a web server running on the microcontroller which can communicate with other hardware via the I/O pins of the device. Other advanced features can be implemented such as PoE. Now let’s see what makes the module tick. The circuit Figure 1 shows the circuit of the module. At the heart of the unit is a Microchip PIC18F67J60. Most of the circuitry required is provided in the device and only a few external components are needed to connect to a network. The Ethernet PICs require a 2.5 V core voltage supply, which can be derived from a higher

28

eTech - ISSUE 6

voltage (3.3 V is recommended) using the voltage regulator included in the PIC. Pin ENVREG determines whether the voltage regulator is enabled. A 10 µF capacitor (C112) provides smoothing and capacitors C101 to C106 positioned around the microcontroller decouple the supplies. A 25 MHz crystal (Q101) provides an external clock for the microcontroller, and the Ethernet transceiver clock is also derived from this source. The project includes a bootloader which allows new firmware to be uploaded over the Ethernet interface. The reset circuit comprises R102, R103 and C107. R102 is a pull-up resistor, and R103 and C107 filter the reset signal to prevent spurious resets. C107 can interfere with the operation of the ICSP interface, and so should be removed if it is to be used. The EEPROM stores configuration data. It also includes a 48-bit ID code, called the MAC address, required for Ethernet communication. Ethernet interface The connection to the Ethernet network comprises four signals, TPOUT+, TPOUT–, TPIN+ and TPIN–. These signals are passed via the Ethernet transformer TR1, which galvanically isolates the main part of the

circuit from the network. On the far side of the transformer is an RJ45 socket J1, into which a standard Ethernet cable can be plugged. A special feature of the transformer we have chosen is its compatibility with the IEEE 802.3af power over Ethernet (PoE) standard. Under this standard a 48 V supply is provided on the network and a powered device (PD) can draw current from this supply. There are two alternative arrangements possible. 1. using the spare conductor pairs (on J1 these are pins 4 and 5 and pins 7 and 8); or 2. phantom supply over the signal pairs (pins 1 and 2 and pins 3 and 6).

C102

C103

C104

C105

C106

100n

100n

100n

100n

100n

100n

7

8

9

LEDA

6

VA2

TX

5

VA1

GPIO2

4

VB1

GPIO1

3

RX

GPIO0

2

VA1

VCC 1

10

R105

JP2

560R

C101

4k7

R102

MCLR

VCC

+3V3

GND

DESIGN TIPS

+2V5

+3V3

15 14

+3V3

13 12

SPI_CS

11

GPIO0

3

GPIO1

4

GPIO2

5

MCLR

*

6 44

VCC MCLR

PGC

42 37

ISP

TPOUT+ TPOUT-

RG4/CCP5/P1D

TPIN+ TPIN-

RF1/AN6/C2OUT RF2/AN7/C1OUT RF3/AN8

RA0/LEDA/AN0

RF4/AN9

RA1/LEDB/AN1

RF4/AN10/CVREF

RA2/AN2/VREF-

RF6/AN11

RA3/AN3/VREF+

RF7/SS1

RA4/T0CKL

PIC18F6XJ6X

RA5/AN4

RB0/INT0/FLT0 RB1/INT1

RC0/T1OSO/T13CKI

RB2/INT2

RC1/T1OSI/ECCP2/P2A

RB3/INT3

RC2/ECCP1/P1A

RB4/KBIO

RC3/SCK1/SCL1

RB5/KBI1

RC4/SDI1/SDA1

RB6/KBI2/PGC

RC5/SDO1

RB7/KBI3/PGD

RC6/TX1/CK1

9

OSC1

20 45 52 39

OSC2

RC7/RX1/DT1

GPIO3

2k26

VDD

VDDTX

VDDPLL

VDD

VDDRX

VDD

RD2/CCP4/P3D

RE5/P1C

VSS

PGD GND

43

RE4/P3B

59

TR1

10u

58 51 50

16

2

15

3

14

6

11

7

10

8

9

1

46 24

LEDA

23

LEDB

22

GPIO4

21

GPIO5

28

3 4 5 6 7

R107 R108 R109 R110

8

ETHER_TRANS_N5

27 30 29 33

C108

C109

100n

100n

+3V3

SPI_INT

34 SPI_CLK

IC2

35 SPI_MISO 36 SPI_MOSI 31

TX

32

RX

2 VCC

EEPROM

EEPROM

1

SCIO

11AA02E48 GND 3 R106

3

4

5

6

7

8

9

SPI_CS

GPIO4

GPIO5

GPIO3

VA2

VB2

10

VB2

2

VB1

1

SPI_MOSI

33p

SPI_MISO

25MHz

JP1

SPI_CLK

GND

C111

SPI_INT

C110

560R

Q101

33p

J1

2

47

40 55 25 41 56

R101 1M

1

LEDB

16

RD1/ECCP3/P3A

1k @ 100MHz

49R9

17

RD0/P1B

RE3/P3C

60

49R9

8

RE2/P2B

C112

49R9

61

IC1

R104

10

49R9

62

RE1/P2C

FE101

53 18

VSS

63

ENVREG VDDCORE/VCAP

VSS

* 100n

RBIAS

VSS

C107

64

RE0/P2D

VSSPLL

1

VSSTX

2 EEPROM

MCLR

VSSRX

7

AVSS

R103 1k

MCLR

AVDD

19 26 38 48 49 54 57

100552 - 11

Figure 1. Circuit diagram showing the PIC microcontroller, transformer and network socket.

A PoE-standard device must support both possibilities. To take advantage of the phantom supply a special transformer is needed with centre taps to the windings on the network side. A suitable PoE regulator circuit can be connected to these headers to derive a supply for the module from the 48 V DC provided over the network. Resistors R107 to R110 provide impedance matching, and C108, C109 and FE101 help reduce the effect of interference spikes on the network connections. R104 is a bias resistor that provides the Ethernet transceiver circuit with a known

reference current (hence its bizarre value). This in turn determines the signal amplitude on TPOUT+ and TPOUT–. There are two LEDs mounted inside the Ethernet socket. LED1 lights when the link is up and LED2 indicates network activity. The LEDs are driven from the PIC via series currentlimiting resistors R105 and R106. User-side interface The user-side interface consists of two 10-way 0.1 inch pitch headers. As well as carrying the PoE connections and the module’s power supply, the headers are also directly connected to certain pins on the microcontroller. The supply voltage should be between 3.1 V and 3.6 V.

Pins VA1, VA2, VB1 and VB2 allow the module to be used in conjunction with a power over Ethernet regulator, sometimes called a ‘PD module’. The active-low MCLR pin allows the module to be reset. It is also pulled low briefly when power is applied to the module.

Continued page 30 >

eTech - ISSUE 6

29

DESIGN TIPS < Continued from page 29 Communications Pins TX and RX are connected to a UART that can support speeds of up to 115200 baud. An SPI interface is available on the pins with labels starting ‘SPI’. The interface can operate in master mode or in slave. Software library A ‘stack’ is a collection of software implementations of protocols and drivers, usually arranged in a hierarchy of layers. At the bottom end of the stack are the hardware drivers which are responsible for getting data bits transferred onto the network wires. At the top end of the stack is a simple interface for data exchange. In theory, the layered protocol model makes it relatively easy to make modifications to one layer (such as the hardware driver) without affecting the others. In practice however, when implemented on a microcontroller, the hardware and the stack are very closely tied together, and lots of tricks need to be used to keep memory usage low. Nevertheless, TCP/IP stack implementations are available for a wide range of microcontroller families, often for free and direct from the manufacturer. Microchip offers a TCP/IP stack for its PIC18, PIC24, dsPIC and PIC32 microcontroller families written in ANSI C. It is free and can

be extended and modified as long as it is only used in Microchip devices. It contains a rich collection of hardware drivers, low-level protocol implementations (ARP, IP, TCP and so on) and a couple of important application-level protocol implementations such as DHCP and HTTP. The simple MPFS file system is also included to allow storage of web page source data. Example applications, a bootloader, tools and comprehensive documentation of all stack functions complete the package. Application software The module has an integrated bootloader that allows a new version of its firmware to be uploaded over the Ethernet connection for installation at any time: suitable hex files are available on the project’s web pages [1]. The author developed the application software for the module using the MPLAB IDE. It is written entirely in ANSI C and can be compiled using the free version of the Microchip C18 compiler.

Using the module A simple way to find out what IP address has been acquired is to use Bonjour, a program developed by Apple which is now also available for Windows (most simply installed as a browser plug-in, for example for Firefox [2]). Serial modes When a suitable network connection is established with the serial server data can be sent using TCP/IP to the unit. Further details on the additional protocols required for operation in this mode can be found in a supplementary document downloadable from the Elektor website.

The application consists of three modules, called Main, Web and Appl. The bootloader jumps directly to Main, where the TCP/IP stack, the EEPROM driver and the Appl module are initialised. Then Appl and the TCP/IP stack receive processing time alternately in an infinite loop.

Internet Links [1] www.elektor.com/100552 [2] www.bonjourfoxy.net

Component List Resistors (SMD 0603) R101 = 1MΩ R102 = 4.7kΩ R103 = 1kΩ R104 = 2.26kΩ R105,R106 = 560Ω R107–R110 = 49.9Ω (1%)

Capacitors (SMD 0603): C101–C109= 100nF C110,C111= 33pF C112= 10µF

Inductors (SMD 0603): FE101 = 1k @ 100 MHz

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30

eTech - ISSUE 6

RS Stock No. 678-9932 679-0484 678-9875 679-0128 679-0541 679-0459

RS Stock No. 391-246 616-9161 698-3239

RS Stock No. 367-4856

Semiconductors IC1= PIC18F67J60 (TQFP64), IC2= 11AA02E48 (SOT23) TR1= 10/100Base-TX transformer, Halo N5 (SMD), PoE to IEEE 802.3af

Miscellaneous

J1= 8+2+2 pin RJ45 socket, w. 2 integrated LEDs JP1,JP2 = 10-pin SIL pinheader (lead pitch 0.1 in.)

RS Stock No 400-766 667-8034 615-4406 or 615-4434

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eTech - ISSUE 6

Designed to meet the needs of general purpose voltage, sensor and transducer logging applications. n These devices plug directly into a PC via USB 2.0 and require no external power supply. Two versions offering either: 12 channels at 10 bit resolution, or 16 channels at 12 bit resolution. Supplied with software development kit. Online search term: PicoLog 12

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eTech - ISSUE 6

33



The use of additional visual, through changes in lighting, or audio feedback, can be used to compensate for the reduction in tactile response



The power of By Jerry Abraham, Central Product Manager, RS Components

Technological progress has dramatically changed the way that we interact with machinery, and reshaped assumptions of how user interfaces are designed. Early human-machine interface (HMI) designs were products of necessity.

Before

electronic control systems became the norm, people were accustomed to using mechanical force to interact with a piece of machinery. They used levers and long-travel switches to make and break physical contacts or move gears into place. The only places we see those types of control today are in systems that need a mechanical override, such as the emergency exit doors on trains or aircraft. As electronic control began to predominate, the lever – which needed a lot of force to operate – gave way to the pushbutton that could switch between two closely spaced circuit traces. The assumption remained that users like to have tactile feedback when they use pushbutton-based interfaces. However, the rise of touch panels has demonstrated that people do not need the sensation of travel in a switch to be comfortable using a system. Interfaces that use low-travel switching

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eTech - ISSUE 6

technologies, such as membrane contacts, have been in used for many years. Touchscreen interfaces on mobile phones have demonstrated more recently that the absence of tactile feedback is no hindrance to usability, as long as the system responds consistently and immediately. The use of additional visual, through changes in lighting, or audio feedback, such as the use of synthesised or sampled ‘click’ sounds, can be used to compensate for the reduction in tactile response. One advantage of non-pushbutton designs lies in design flexibility. Take, for example, the AC3875 kit manufactured by Apem. This membrane keypad provides the customer the option to insert their own custom graphs for specialised designs. It is possible to punch holes in the keypad to show the state of LEDs mounted behind it as the individual pads are pressed. Overall, this allows the easy

prototyping and acceptance testing of HMI designs to gauge user reaction. Because legends can easily be overprinted on custom layouts, the look and feel of the membrane keypad can be more easily integrated with the overall industrial design of the complete system. This can be used to provide the consistent look and feel that is considered by ergonomists to be an important factor in ease of use. Many HMIs have to survive hostile conditions – they may be splashed by liquids that then seep into the equipment through gaps between the switches and mounting. And problems in outdoor equipment such as parking meters includes the actions of hostile users. Vandalproofing pushbutton switches is difficult but manufacturers have succeeded in closing off avenues of attack so that buttons cannot be prised out of their mounting. Examples of vandal-proof products include the Schurter

touch 1241 series that include O-ring seals to protect against liquid ingress.

and resilience without the drawbacks of capacitive technology.

As the travel distance on vandal-proof pushbuttons can be limited, many of these devices can be ordered with built-in LEDs that change state when pressed to give the user better feedback. Making the switches purely touch-sensitive rather than relying on switch travel can improve the resilience of the HMI and make possible a wider range of panel designs that are not restricted by the techniques that need to be used to protect moving elements against deliberate vandalism.

ITW’s ActiveTouch technology, employed in the company’s T01 series, uses built-in transducers to supply an ultrasonic signal that is damped by contact with a user’s finger. This reduces the ‘ring down’ time of the ultrasonic pulse, similar to the damping of a bell after it is struck. A microprocessor detects this change in decay and signals whether the button has been pressed or not.

In difficult environments, the capacitive touchscreens favoured by high-end mobile phones and consumer products are often impractical. Because they rely on body capacitance, they frequently do not respond to users wearing gloves. Manufacturers such as Apem and ITW have developed technologies that provide touch-sensitivity

Another approach is piezoelectric sensing, employed by Apem in its PBA series of buttons. A piezoelectric sensor uses the change in pressure on the surface of the button to change the voltage presented to a monitoring microprocessor. This does not mean there is no place for the traditional pushbutton switch. People are used to the idea of the Stop button with its

mechanical feedback. In systems where it is important to demonstrate to the user that contact has been made without involving another form of feedback, tactile response remains important, providing applications for devices such as the Arcolectric T09 series. But the evolution of electronics has shown that there is much more to HMI design than tactile feedback. Manufacturers have responded to this evolution with a greatly expanded range of options that support all forms of industrial design.

See the latest APEM and ITW HMI ranges at www.rs-components.com

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eTech - ISSUE 6

35

Rapid power for the modern electronics system By Dr. Iain Mosely, Technical Director of Zonetech www.zonetech.com

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eTech - ISSUE 6

In our previous eTECH article we discussed how the high level power architecture in complex multi-rail power systems can have a strong influence on product energy use. This article builds on the initial discussion to describe a new concept in power system design - the Rapid Power System (RPS).

Figure 1 – Rapid Power System (RPS) Test Unit



...provides detailed real-time knowledge required to minimise power consumption throughout the new product



New Concept - Rapid Power System Often, provision of the power supply for a new product is considered late in the development process. The RPS allows a designer to implement a custom multi-rail power supply at the very first stages of new product development which brings a number of key benefits: 1. The ability for a designer to rapidly configure a complex multi-rail power subsystem with minimal power design experience. 2. The capability to easily provide detailed power use information during product development which helps the user to minimise product energy use and form an accurate power system load profile.

The RPS provides a main 12Vdc rail and four user pluggable module zones giving the capability of up to five DC output rails. A total system load of 60W is possible with module output of up to +/-25Vdc and +/-6Adc. The test system will monitor the minimum, maximum and average value of each DC output voltage and current as well as measuring mains AC input power, frequency, RMS voltage, RMS current, system output power, total power loss, overall conversion efficiency and operating temperature. Use of the host application running on a computer allows the user to chart all the system variables over time in order to provide complete power qualification of a new product.

3. The flexibility to modify the power supply very quickly if the specification changes. 4. A low risk route to easily map the custom power subsystem into volume production. RPS consists of two main products; a prototyping test system which is used during the product development phase and a generic platform onto which proven designs can then be mapped for volume production.

Continued page 38> eTech - ISSUE 6

37

< Continued from page 37 Example System – External Hard Disk Drive An external hard disk drive requiring +5V and +12V voltage rails was powered using the RPS system. The data captured shown in Figure 2 details four of the twenty three possible useful measurements during the course of the test:-

Measurements Mains AC - Power

W

40 30 20 10

1. PLOT 1 - Shows the power drawn from the 230Vrms mains supply (Note the peak level measured at the start of the test)

0 0

50

100

V

200

250

seconds

300

250

seconds

300

250

seconds

300

250

seconds

300

Main 12v - voltage

12.8

2. PLOT 2 - Shows the voltage measured on the +12V output including minimum, maximum and average levels

150

12.6 12.4 12.2 12.0 11.8

3. PLOT 3 – Shows the power drawn from the +12V. Again, note the peak power consumption at the start of the test

11.6 0

50

100

W

The results of the hard disk test show that the typical total mains power draw of the product is around 10W in steady state with a five second peak of about 32W during start-up. Analysis of the output rail powers show the high peak occurs on the 12V rail and it is most likely that this is the rail used to drive the motors in the hard disk. The 5V rail power is constant until a data read or write is performed. During a data read/write, the load on the 5V rail increases from around 2W to 3.5W, probably a result of moving the hard disk heads across the disk. Thus, the power supply used to drive this disk would have a basic specification of:-

200

Main 12v - Power

30

4. PLOT 4 – Shows the power drawn from the Z1 Module (5VDC in this case).

150

25 20 15 10 5 0 0

50

100

200

Z1 - Power

W

4.5

150

4.0 3.5 3.0 2.5

1.5 GB Data Write

2.0 1.5 1.0 0

50

100

150

200

Figure 2. Data Captured During Test of an External Computer Hard Disk

Measurements

+12v/500mA with a 2.3A/5 second peak capability +5v/800mA

Mains AC - Power

W 30

So, how can we use the data to save energy? The data shows that the power use when the disk is reading or writing data is around 9.6W. The power use when in idle mode is 7W. In particular, during idle mode, more than 70% of the power draw is on the 12V rail and is being used to spin the disks. Since external hard disk drives are often used for data back-up, the most straightforward way to reduce energy consumption would be to power down the motor during periods of disk inactivity.

20 10 0 5

12.8

10

15

25

seconds

25

seconds

20

25

seconds

20

25

seconds

20

Main 12v - voltage

V

12.6 12.4 12.2 12.0 11.8 11.6

Conclusion Measurement of product energy use is often only performed at the end of the development cycle when the options for improvement are limited. The use of the RPS system by product designers during the first stages of the development cycle provide the detailed real-time knowledge required to minimise power consumption throughout the new product. The simple approach used by RPS provides a low risk solution to the complex power requirements of modern products. The speed of implementation frees up design engineers to focus on the key aspects of their new product design, safe in the knowledge that the power system sitting behind it is proven and can be mapped into a volume product when they move into production. Find out more about ZoneTech at www.zonetech.com

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eTech - ISSUE 6

5

30

10

15

20

Main 12v - Power

W

25 20 15 10 5 0 5

4.5

10

15

Z1 - Power

W

4.0 3.5 3.0 2.5 2.0 1.5 1.0 5

10

15

Figure 3. This plot shows a zoom of the first 30 seconds

Omron

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eTech - ISSUE 6

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eTech - ISSUE 6

41

INDUSTRY NEWS

Conductor paths for marvelous light Organic light-emitting diodes are seen as the basis for a new generation of lamps: Large-area lamps that can be randomly shaped and fl exibly integrated into interior design. But the “illuminated glass” is still very expensive. Researchers want to optimize the lamps of the future and reduce the price by a new manufacturing process. A short push on the light switch – and the whole ceiling lights up in a uniform and pleasant color. This “illuminated sky” is not available as yet, but researchers from all over the world are working on it flat out. The technology behind this marvel is based on organic light-emitting diodes, or OLEDs for short. These diodes use special molecules to emit light as soon as current passes through them. Although the first OLEDs have only recently become available, they are small and expensive. A flat disk with a diameter of eight centimeters costs around Euro 250. Experts of the Fraunhofer Institute for Laser Technology ILT in Aachen, Germany are working together with Philips to develop a process for making these lamps distinctly bigger and cheaper – and thus suitable for mass market. These new lamps are expensive primarily due to the costly manufacturing process. An OLED consists of a sandwich layer structure: a flat electrode at the bottom, several intermediate layers on top as well as the actual luminescent layer consisting of organic molecules. The final layer is a second electrode made of a special material called ITO (indium tin oxide). Together with the lower electrode, the ITO layer has the job of supplying the OLED molecules with current and causing them to light up. The problem is, however, that the ITO electrode is not conductive enough to distribute the current uniformly across a larger surface. The consequence: Instead of a homogeneous fluorescent pattern, the brightness visibly decreases in the center of the surface luminaire. “In order to compensate, additional conductor paths are attached to the ITO layer,“ says Christian Vedder, project manager at the Fraunhofer Institute for Laser Technology. “These conductor paths consist of metal and distribute the current uniformly across the surface so that the lamp is lit homogeneously.” Normally the conductor paths are applied by energy-intensive evaporation and structuring processes, while only a maximum of ten percent of the luminous area may be covered by conductor paths. “The large remainder including the chemical etchant has to be recycled in a complicated process,“ explains Christian Vedder. This is different in the new process from the researchers from the Fraunhofer Institute for Laser Technology. Instead of depositing a lot of material by evaporation and removing most of it again, the scientists only apply precisely the amount of metal required. First of all they lay a mask foie on the surface of the ITO electrode. The mask has micrometer slits where later the conductive paths are supposed to be. On this mask the researchers deposit a thin film of metal made of aluminum, copper or silver – the metal the conductor path is supposed to be made of. Subsequently

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eTech - ISSUE 6

a laser passes over the conductor path pattern at a speed of several meters per second. The metal melts and evaporates while the vapor pressure makes sure that the melt drops are pressed through the fine slits in the masks on to the ITO electrode. The result are extremely fine conductor paths. At up to 40 micrometers, they are distinctly narrower than the 100 micrometer conductor paths which can be produced with conventional technology. “We have already been able to demonstrate that our methods works in the laboratory,” says Christian Vedder. “The next step is implementing this method in industrial practice together with our partner Philips and developing a plant technology for inexpensively applying the conductor paths on a large scale.” The new laser process could be ready for practical application in two to three years.



Conductor paths consist of metal and distribute the current uniformly across the surface so that the lamp is lit homogeneously



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