Semiconductor Components Industries, LLC, 2007. March, 2007 â Rev. 2. 1. Publication Order Number: BC550C/D. BC549C, B
BC549C, BC550C Low Noise Transistors NPN Silicon Features
• These are Pb−Free Devices*
http://onsemi.com COLLECTOR 1
MAXIMUM RATINGS Rating
Symbol
Collector −Emitter Voltage
Value
VCEO BC549C BC550C
Collector −Base Voltage
Vdc 30 45
VCBO BC549C BC550C
Emitter −Base Voltage
3 EMITTER
Vdc 30 50
VEBO
5.0
Vdc
Collector Current − Continuous
IC
100
Vdc
Total Device Dissipation @ TA = 25°C Derate above = 25°C
PD
625 5.0
mW mW/°C
Total Device Dissipation @ TA = 25°C Derate above = 25°C
PD
1.5 12
W mW/°C
TJ, Tstg
−55 to +150
°C
Characteristic
Symbol
Max
Unit
Thermal Resistance, Junction−to−Ambient
RqJA
200
°C/W
Thermal Resistance, Junction−to−Case
RqJC
83.3
°C/W
Operating and Storage Junction Temperature Range
2 BASE
Unit
TO−92 CASE 29 STYLE 17
12
3 STRAIGHT LEAD BULK PACK
THERMAL CHARACTERISTICS MARKING DIAGRAM
BC5x yC AYWW G G
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
BC5xyC = Device Code x = 4 or 5 y = 9 or 0 A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location)
ORDERING INFORMATION
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2007
March, 2007 − Rev. 2
1
Device
Package
Shipping
BC549CG
TO−92 (Pb−Free)
5000 Units / Bulk
BC550CG
TO−92 (Pb−Free)
5000 Units / Bulk
Publication Order Number: BC550C/D
BC549C, BC550C ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic
Symbol
Min
Typ
Max
45
−
−
50
−
−
5.0
−
−
− −
− −
15 5.0
−
−
15
100 420
270 500
− 800
− − −
0.075 0.3 0.25
0.25 0.6 0.6
−
1.1
−
− − 0.55
0.52 0.55 0.62
− − 0.7
−
250
−
−
2.5
−
450
600
900
− −
0.6 −
2.5 10
Unit
OFF CHARACTERISTICS Collector −Emitter Breakdown Voltage (IC = 10 mAdc, IB = 0)
V(BR)CEO
Collector −Base Breakdown Voltage (IC = 10 mAdc, IE = 0)
V(BR)CBO
Emitter −Base Breakdown Voltage (IE = 10 mAdc, IC = 0)
V(BR)EBO
Collector Cutoff Current (VCB = 30 V, IE = 0) (VCB = 30 V, IE = 0, TA = +125°C)
ICBO
Emitter Cutoff Current (VEB = 4.0 Vdc, IC = 0)
IEBO
Vdc Vdc Vdc
nAdc mAdc nAdc
ON CHARACTERISTICS DC Current Gain (IC = 10 mAdc, VCE = 5.0 Vdc) (IC = 2.0 mAdc, VCE = 5.0 Vdc)
hFE
Collector −Emitter Saturation Voltage (IC = 10 mAdc, IB = 0.5 mAdc) (IC = 10 mAdc, IB = see note 1) (IC = 100 mAdc, IB = 5.0 mAdc, see note 2)
VCE(sat)
Base−Emitter Saturation Voltage (IC = 100 mAdc, IB = 5.0 mAdc)
VBE(sat)
Base−Emitter On Voltage (IC = 10 mAdc, VCE = 5.0 Vdc) (IC = 100 mAdc, VCE = 5.0 Vdc) (IC = 2.0 mAdc, VCE = 5.0 Vdc)
VBE(on)
−
Vdc
Vdc Vdc
SMALL−SIGNAL CHARACTERISTICS Current −Gain — Bandwidth Product (IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)
fT
Collector−Base Capacitance (VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
MHz
Ccbo
Small−Signal Current Gain (IC = 2.0 mAdc, VCE = 5.0 V, f = 1.0 kHz)
pF
hfe
Noise Figure (IC = 200 mAdc, VCE = 5.0 Vdc, RS = 2.0 kW, f = 1.0 kHz) (IC = 200 mAdc, VCE = 5.0 Vdc, RS = 100 kW, f = 1.0 kHz)
dB NF1 NF2
1. IB is value for which IC = 11 mA at VCE = 1.0 V. 2. Pulse test = 300 ms − Duty cycle = 2%.
RS
−
in en
IDEAL TRANSISTOR
Figure 1. Transistor Noise Model
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BC549C, BC550C 1.0 VCE = 10 V TA = 25°C
1.5
0.9
1.0 0.8 0.6 0.4
VBE(sat) @ IC/IB = 10
0.7
VBE(on) @ VCE = 10 V
0.6 0.5 0.4 0.3 0.2
0.3
VCE(sat) @ IC/IB = 10
0.1 0.2 0.2
0.5
1.0 2.0 5.0 10 20 50 IC, COLLECTOR CURRENT (mAdc)
0 0.1
100 200
Figure 2. Normalized DC Current Gain
0.2
0.5 1.0 2.0 5.0 10 20 IC, COLLECTOR CURRENT (mAdc)
50
100
Figure 3. “Saturation” and “On” Voltages
10
400 300
7.0
100 80 60
C, CAPACITANCE (pF)
200
VCE = 10 V TA = 25°C
40 30
TA = 25°C
Cib
5.0
3.0 Cob 2.0
20
0.5 0.7
1.0
2.0 5.0 7.0 10 20 IC, COLLECTOR CURRENT (mAdc)
1.0 0.4
50
0.6
1.0
Figure 4. Current−Gain — Bandwidth Product
r b, BASE SPREADING RESISTANCE (OHMS)
f T, CURRENT−GAIN BANDWIDTH PRODUCT (MHz)
TA = 25°C
0.8 V, VOLTAGE (VOLTS)
hFE, NORMALIZED DC CURRENT GAIN
2.0
2.0 4.0 10 VR, REVERSE VOLTAGE (VOLTS)
Figure 5. Capacitance
170 160
150 VCE = 10 V f = 1.0 kHz TA = 25°C
140
130
120 0.1
0.2
0.5 1.0 2.0 IC, COLLECTOR CURRENT (mAdc)
5.0
Figure 6. Base Spreading Resistance
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10
20
40
BC549C, BC550C PACKAGE DIMENSIONS
TO−92 (TO−226) CASE 29−11 ISSUE AM A
B
STRAIGHT LEAD BULK PACK
R P L SEATING PLANE
K
D
X X G
J
H V
C SECTION X−X
1
N
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. DIM A B C D G H J K L N P R V
INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.045 0.055 0.095 0.105 0.015 0.020 0.500 −−− 0.250 −−− 0.080 0.105 −−− 0.100 0.115 −−− 0.135 −−−
MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.407 0.533 1.15 1.39 2.42 2.66 0.39 0.50 12.70 −−− 6.35 −−− 2.04 2.66 −−− 2.54 2.93 −−− 3.43 −−−
N
A
R
BENT LEAD TAPE & REEL AMMO PACK
B
P
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM.
T SEATING PLANE
K
D
X X G
J V 1
C SECTION X−X
DIM A B C D G J K N P R V
MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.40 0.54 2.40 2.80 0.39 0.50 12.70 −−− 2.04 2.66 1.50 4.00 2.93 −−− 3.43 −−−
N
STYLE 17: PIN 1. COLLECTOR 2. BASE 3. EMITTER
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BC550C/D