BC549C, BC550C Low Noise Transistors - Farnell

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Semiconductor Components Industries, LLC, 2007. March, 2007 − Rev. 2. 1. Publication Order Number: BC550C/D. BC549C, B
BC549C, BC550C Low Noise Transistors NPN Silicon Features

• These are Pb−Free Devices*

http://onsemi.com COLLECTOR 1

MAXIMUM RATINGS Rating

Symbol

Collector −Emitter Voltage

Value

VCEO BC549C BC550C

Collector −Base Voltage

Vdc 30 45

VCBO BC549C BC550C

Emitter −Base Voltage

3 EMITTER

Vdc 30 50

VEBO

5.0

Vdc

Collector Current − Continuous

IC

100

Vdc

Total Device Dissipation @ TA = 25°C Derate above = 25°C

PD

625 5.0

mW mW/°C

Total Device Dissipation @ TA = 25°C Derate above = 25°C

PD

1.5 12

W mW/°C

TJ, Tstg

−55 to +150

°C

Characteristic

Symbol

Max

Unit

Thermal Resistance, Junction−to−Ambient

RqJA

200

°C/W

Thermal Resistance, Junction−to−Case

RqJC

83.3

°C/W

Operating and Storage Junction Temperature Range

2 BASE

Unit

TO−92 CASE 29 STYLE 17

12

3 STRAIGHT LEAD BULK PACK

THERMAL CHARACTERISTICS MARKING DIAGRAM

BC5x yC AYWW G G

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.

BC5xyC = Device Code x = 4 or 5 y = 9 or 0 A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location)

ORDERING INFORMATION

*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2007

March, 2007 − Rev. 2

1

Device

Package

Shipping

BC549CG

TO−92 (Pb−Free)

5000 Units / Bulk

BC550CG

TO−92 (Pb−Free)

5000 Units / Bulk

Publication Order Number: BC550C/D

BC549C, BC550C ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic

Symbol

Min

Typ

Max

45





50





5.0





− −

− −

15 5.0





15

100 420

270 500

− 800

− − −

0.075 0.3 0.25

0.25 0.6 0.6



1.1



− − 0.55

0.52 0.55 0.62

− − 0.7



250





2.5



450

600

900

− −

0.6 −

2.5 10

Unit

OFF CHARACTERISTICS Collector −Emitter Breakdown Voltage (IC = 10 mAdc, IB = 0)

V(BR)CEO

Collector −Base Breakdown Voltage (IC = 10 mAdc, IE = 0)

V(BR)CBO

Emitter −Base Breakdown Voltage (IE = 10 mAdc, IC = 0)

V(BR)EBO

Collector Cutoff Current (VCB = 30 V, IE = 0) (VCB = 30 V, IE = 0, TA = +125°C)

ICBO

Emitter Cutoff Current (VEB = 4.0 Vdc, IC = 0)

IEBO

Vdc Vdc Vdc

nAdc mAdc nAdc

ON CHARACTERISTICS DC Current Gain (IC = 10 mAdc, VCE = 5.0 Vdc) (IC = 2.0 mAdc, VCE = 5.0 Vdc)

hFE

Collector −Emitter Saturation Voltage (IC = 10 mAdc, IB = 0.5 mAdc) (IC = 10 mAdc, IB = see note 1) (IC = 100 mAdc, IB = 5.0 mAdc, see note 2)

VCE(sat)

Base−Emitter Saturation Voltage (IC = 100 mAdc, IB = 5.0 mAdc)

VBE(sat)

Base−Emitter On Voltage (IC = 10 mAdc, VCE = 5.0 Vdc) (IC = 100 mAdc, VCE = 5.0 Vdc) (IC = 2.0 mAdc, VCE = 5.0 Vdc)

VBE(on)



Vdc

Vdc Vdc

SMALL−SIGNAL CHARACTERISTICS Current −Gain — Bandwidth Product (IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)

fT

Collector−Base Capacitance (VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

MHz

Ccbo

Small−Signal Current Gain (IC = 2.0 mAdc, VCE = 5.0 V, f = 1.0 kHz)

pF

hfe

Noise Figure (IC = 200 mAdc, VCE = 5.0 Vdc, RS = 2.0 kW, f = 1.0 kHz) (IC = 200 mAdc, VCE = 5.0 Vdc, RS = 100 kW, f = 1.0 kHz)

dB NF1 NF2

1. IB is value for which IC = 11 mA at VCE = 1.0 V. 2. Pulse test = 300 ms − Duty cycle = 2%.

RS



in en

IDEAL TRANSISTOR

Figure 1. Transistor Noise Model

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BC549C, BC550C 1.0 VCE = 10 V TA = 25°C

1.5

0.9

1.0 0.8 0.6 0.4

VBE(sat) @ IC/IB = 10

0.7

VBE(on) @ VCE = 10 V

0.6 0.5 0.4 0.3 0.2

0.3

VCE(sat) @ IC/IB = 10

0.1 0.2 0.2

0.5

1.0 2.0 5.0 10 20 50 IC, COLLECTOR CURRENT (mAdc)

0 0.1

100 200

Figure 2. Normalized DC Current Gain

0.2

0.5 1.0 2.0 5.0 10 20 IC, COLLECTOR CURRENT (mAdc)

50

100

Figure 3. “Saturation” and “On” Voltages

10

400 300

7.0

100 80 60

C, CAPACITANCE (pF)

200

VCE = 10 V TA = 25°C

40 30

TA = 25°C

Cib

5.0

3.0 Cob 2.0

20

0.5 0.7

1.0

2.0 5.0 7.0 10 20 IC, COLLECTOR CURRENT (mAdc)

1.0 0.4

50

0.6

1.0

Figure 4. Current−Gain — Bandwidth Product

r b, BASE SPREADING RESISTANCE (OHMS)

f T, CURRENT−GAIN  BANDWIDTH PRODUCT (MHz)

TA = 25°C

0.8 V, VOLTAGE (VOLTS)

hFE, NORMALIZED DC CURRENT GAIN

2.0

2.0 4.0 10 VR, REVERSE VOLTAGE (VOLTS)

Figure 5. Capacitance

170 160

150 VCE = 10 V f = 1.0 kHz TA = 25°C

140

130

120 0.1

0.2

0.5 1.0 2.0 IC, COLLECTOR CURRENT (mAdc)

5.0

Figure 6. Base Spreading Resistance

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10

20

40

BC549C, BC550C PACKAGE DIMENSIONS

TO−92 (TO−226) CASE 29−11 ISSUE AM A

B

STRAIGHT LEAD BULK PACK

R P L SEATING PLANE

K

D

X X G

J

H V

C SECTION X−X

1

N

NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. DIM A B C D G H J K L N P R V

INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.045 0.055 0.095 0.105 0.015 0.020 0.500 −−− 0.250 −−− 0.080 0.105 −−− 0.100 0.115 −−− 0.135 −−−

MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.407 0.533 1.15 1.39 2.42 2.66 0.39 0.50 12.70 −−− 6.35 −−− 2.04 2.66 −−− 2.54 2.93 −−− 3.43 −−−

N

A

R

BENT LEAD TAPE & REEL AMMO PACK

B

P

NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM.

T SEATING PLANE

K

D

X X G

J V 1

C SECTION X−X

DIM A B C D G J K N P R V

MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.40 0.54 2.40 2.80 0.39 0.50 12.70 −−− 2.04 2.66 1.50 4.00 2.93 −−− 3.43 −−−

N

STYLE 17: PIN 1. COLLECTOR 2. BASE 3. EMITTER

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BC550C/D