Conference Program - CMP

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May 15, 2017 - Yasuyuki Nishida, Chiba Institute of Technology, Japan. Geraldo Nojima, Eaton ... Management. München 2.
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International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management Nuremberg, 16 – 18 May 2017 pcim-europe.com

Conference Program

 7 Seminars on 14 May 2017  11 Tutorials on 15 May 2017  Conference from 16 –18 May 2017

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Table of Content

Welcome Address Wednesday Oral Sessions

30

Dear PCIM Europe participants,

Board 4

Wednesday Poster Dialogue Sessions

34

Conference Program at a Glance

Industry Forum

37

Seminars 8

Thursday Oral Sessions

38

Tutorials 12

List of Exhibitors

42

Awards 19

Industry Forum

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I am very pleased to welcome all of you to the PCIM Europe Conference 2017 in Nuremberg. Power electronics is one of the most successful industries in Europe with a variety of advanced research fields, very competitive and successful industrial companies, and many leading academic laboratories in different countries. The PCIM Europe serves as a technical and scientific platform for decision makers, engineers and researchers engaged to power electronics and its fields of applications.

Keynotes 20

Room Plan

45

Tuesday Oral Sessions

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Registration Information

46

Tuesday Poster Dialogue Sessions

26

General Information

47

PCIM Worldwide

48

Welcome Address

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Precise first hand transfer of knowledge The technical program for this year’s conference comprises a variety of topics. New materials for semiconductor devices including wide bandgap power electronics, reliability issues for power modules and advanced systems as well as design regulations to manage ultrafast switching devices in the circuit, form the backbone of the PCIM Europe Conference 2017. The other subjects range from advanced technologies for power semiconductor devices and passive components up to control and drive strategies for high efficient high density power converters, drive systems for e-vehicles and renewable energy technologies. As a conference participant you will gain complete access to specialized knowledge within the power electronics industry as well as an overview of the market as well. Taking a look ahead The keynote papers are a further highlight of the PCIM Europe 2017 Conference. They cover the development of trends for e-vehicles including charging infrastructure, the impact of power electronics for the future SMART factory (Industry 4.0) as well as the evolution of power supply topologies as a result of new semiconductor devices and enabling technologies. Besides the keynotes, the special sessions deal with advanced passive components and capacitors in addition to smart grid and communication. Special attention has been paid on the research carried out by young engineers and the presentation of the Young Engineer and Best Paper Awards at the opening ceremony of the PCIM Europe Conference 2017 ranks amongst the conference highlights. With this outstanding conference agenda and high-quality discussion platform, I am convinced that the PCIM Europe Conference will serve as an international knowledge platform. You will get an overview of key technology developments concerning trends in power electronics and be inspired to pursue new business opportunities. I wish you an enjoyable and successful conference, packed with new ideas for your future business.

Leo Lorenz, General Conference Director, Germany

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Board Board of Directors

General Conference Director Leo Lorenz

Advisory Board

Jean-Paul Beaudet

Philippe Ladoux

Schneider Electric, France

University of Toulouse, France

ECPE, Germany

Bodo Arlt, A Media, Germany

Klaus Marahrens, SEW-Eurodrive, Germany

Francisco Javier Azcondo, University of Cantabria, Spain

Elison Matioli, POWERlab, EPFL, Switzerland

Mark M. Bakran, University of Bayreuth, Germany

Mike Meinhardt, SMA Solar Technology, Germany

Pavol Bauer, Delft University of Technology, Netherlands

Thomas Neyer, Fairchild Semiconductor, Germany

Werner Berns, Texas Instruments, Germany

Yasuyuki Nishida, Chiba Institute of Technology, Japan

Frede Blaabjerg, Aalborg University, Denmark

Geraldo Nojima, Eaton Corporation, USA

Serge Bontemps, Microsemi PMP Europe, France

Yasuhiro Okuma, Fuji Electric, Japan

Eric Carroll, EIC Consultancy, France

Masahito Otsuki, Fuji Electric, Japan

Bruce Carsten, Bruce Carsten Associates, USA

Nejila Parspour, University of Stuttgart, Germany

Daniel Chatroux, CEA-LITEN, France

Robert J. Pasterczyk, Schneider Electric, France

Silvio Colombi, General Electric, Switzerland

Volker Pickert, University of Newcastle, United Kingdom

Eric Favre

Jose Mario Pacas

Hilmar Darrelmann, Darrelmann + Partner Ingenieure, Germany

Bernhard Piepenbreier, University of Erlangen, Germany

IMI Precision Engineering, Switzerland

University of Siegen, Germany

Enrique J. Dede, University of Valencia, Spain

Munaf Rahimo, ABB Switzerland, Switzerland

Drazen Dujic, Power Electronics Laboratory, EPFL, Switzerland

Kaushik (Raja) Rajashekara, University of Houston, USA

Hans-Günter Eckel, University of Rostock, Germany

Chris Rexer, ON Semiconductor, USA

Hans Ertl, Vienna University of Technology, Austria

Katsuaki Saito, Hitachi Europe, Great Britain

J. A. Ferreira, Delft University of Technology, Netherlands

Franck Sarrus, Mersen France, France

Petar J. Grbovic, Huawei Technologies, Germany

Andrew Sawle, Infineon Technologies, Great Britain

Johann Walter Kolar

Uwe Scheuermann

Steffan Hansen, Siemens Wind Power, Denmark

Achim Scharf, Techmedia International, Germany

ETH Zürich, Switzerland

Semikron Elektronik, Germany

Klaus F. Hoffmann, Helmut-Schmidt-University, Germany

Hubert Schierling, Siemens, Germany

Edward Hopper, MACCON, Germany

Manfred Schlenk, Infineon Technologies, Germany

Ionel Dan Jitaru, Rompower, USA

Manfred Schrödl, Vienna University of Technology, Austria

Nando Kaminski, University of Bremen, Germany

Walter Schumacher, Braunschweig University of Technology, Germany

Peter Kanschat, Infineon Technologies, Germany

Toshihisa Shimizu, Tokyo Metropolitan University, Japan

Ulrich Kirchenberger, STMicroelectronics, Germany

Christopher A. Soule, Thermshield, USA

Philip C. Kjaer, Vestas Wind Systems, Denmark

Elmar Stachorra, KoCoS Power Grid Services, Germany

Christopher Kocon, Texas Instruments, USA

Peter Steimer, ABB Switzerland, Switzerland

Jacques Laeuffer, Dtalents, France

Bernhard Strzalkowski, Analog Devices, Germany

Stéphane Lefebvre, SATIE, France

Wolfram Teppan, LEM Intellectual Property SA, Switzerland

Romeo Letor, STMicroelectronics, Italy

Giuseppe Tomasso, University of Cassino and South Lazio, Italy

Andreas Lindemann, Otto-von-Guericke-University Magdeburg, Germany

Joël Turchi, On Semiconductor, France

Stefan Linder, Alpiq, Switzerland

Yoshiyuki Uchida, Japan Fine Ceramics, Japan

Marco Liserre, Christian-Albrechts-University of Kiel, Germany

Peter Wallmeier, Delta Energy Systems, Germany

Martin März, F hG – IISB, Germany

Dehong Xu, Zhejiang University, China

Gourab Majumdar, Mitsubishi Electric, Japan

Peter Zacharias, University of Kassel, Germany

Consultatory Board

Friedrich-Wilhelm Fuchs

Josef Lutz

Christian-Albrechts-University of Kiel, Germany

Chemnitz University of Technology, Germany

Honorary Board Helmut Knöll, University for Applied Sciences Würzburg-Schweinfurt, Germany Jean-Marie Peter, France Gerhard Pfaff, University of Erlangen, Germany Alfred Rufer, EPFL, Switzerland

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Conference Program at a Glance Sunday, 14 May 2017

Thursday, 18 May 2017

14:00 – 17:30 Hotel Arvena Park Görlitzer Str. 51, D-90473 Nuremberg

08:45

Seminars

KEYNOTE »Evolution in Topologies as a Result of New Devices and Enabling Technologies« All seminar attendees will receive all seminar documentations. The same applies for the tutorial documentations.

Monday, 15 May 2017 09:00 – 17:00 Hotel Arvena Park Görlitzer Str. 51, D-90473 Nuremberg Tutorials

Tuesday, 16 May 2017 09:00

Brüssel

09:30

Coffee Break

10:00

Brüssel 1

München 1

München 2

Advanced Wide Bandgap - GaN

Power Electronics in Automotive

Control and Drive Strate- SPECIAL SESSION gies in Power Converters »Capacitors«

12:00

Lunch Break

14:00

Brüssel 1

München 1

München 2

Mailand

SiC Modules Diodes

Power Converters with Wide Bandgap Devices III

System Reliability

Energy Storage and Power Quality Solutions

Brüssel

Conference Opening and Award Ceremony

09:45

Mailand

As of March 2017/subject to change without notice.

Brüssel

KEYNOTE »Long Distance Charging Solutions for BEVs: from now to 2030« 10:30

Coffee Break

11:00

Brüssel 1

Brüssel 2

München 2

Mailand

HV-SiC-MOSFET

Power Converters with Materials Wide Bandgap Devices I

Sensorless Drives

Modular Multilevel Converter for HV Applications

München 1

13:00

Lunch Break

14:00

Brüssel

Brüssel 2

München 1

München 2

Mailand

SiC MOSFET

Power Converter Design

Current Sensors

New and Renewable Energy Systems

SPECIAL SESSION »Smart Grid & Communication«

15:30

Foyer Entrance NCC Mitte

Poster/Dialogue Session

17:15

Exhibition Party

Wednesday, 17 May 2017 08:45

Brüssel

KEYNOTE »The Smart Future of Power Electronics and its Applications« 09:30

Coffee Break

10:00

Brüssel 1

Brüssel 2

München 1

München 2

Mailand

Power Converters with Wide Bandgap Devices II

IGBT

Module Design

Control Techniques in Intelligent Motion Systems

SPECIAL SESSION »Passive Components«

Brüssel 2

München 1

München 2

Mailand

Cooling Thermal Management

Metering and Diagnostics and Standards

Passive Components and New Materials

12:00

Lunch Break

14:00

Brüssel 1

SiC-Systems

15:30

Foyer Entrance NCC Mitte

Poster/Dialogue Session

Power Electronics Optimization

Benefit from early-bird rates until 10 April 2017 and save up to 100 Euro! pcim-europe.com/registration

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Seminars Sunday, 14 May 2017, 14:00 – 17:30 Venue: Arvena Park Hotel Nuremberg, Görlitzer Str. 51, 90473 Nuremberg Seminar 1

Seminar 2

Seminar 3

Seminar 4

Basics of Electromagnetic Compatibility (EMC) of Power Systems

Multi-Kilowatt Flyback Converters; Advantages and Practical Design Considerations

What a Design Engineer Should Know About Current-Mode Control

Modern Magnetic Technologies for High Efficiency and High Power Density

Jacques Laeuffer, Dtalents, France

Richard Redl, Redl Consulting, Switzerland

Ionel Dan Jitaru, Rompower, USA

Bruce Carsten, Bruce Carsten Associates, USA About the instructor Jacques Laeuffer has a 35 years’ experience of R&D in Power Electronics, inside international companies, with powers from 10 W up to 10 MW, including HF resonant converters and high voltage transformers, electric machines and inverters for hybrid cars. He is inventor of 27 granted patents and author of over 80 technical papers. Affiliated professor at Ensta-ParisTech, he is also a teacher at CentraleSupelec, France, and for inter and intra companies international trainings, about power electronics, EMC, electric machines, digital control, mechatronics, cars powertrains, and history of physics. Contents

Fast semiconductors commutations are required for efficiency of high frequency (HF) power converters and drives, and their wide bandwidth control electronics. These sudden front edges generate perturbations in control circuits, especially analog ones, and on public utility power networks. This seminar shows step by step how perturbations propagate, as Differential Mode (DM) and Common Mode (CM), how to reduce noisy oscillations from the beginning, how to design and implement robust control electronics, how to calculate and optimize DM and CM filters for EMC standards compliance, how to avoid expensive shielding and improve reliability. Number of practical designs are analytically calculated, showing orders of magnitudes for a wide range of powers and frequencies. Differential Mode (DM) management and filtering Within control: resistive, inductive and capacitive coupling. Reduction by ground planes. Wiring strategies evolution form “star connection” to “net connection”. Switching power supply operating sequence as EMI source. Distur bances from transistors and diodes. Spectrum analysis. Line diodes recovery. Line inductance effect. Disturbances calculations. Measurement according to Standards by L.I.S.N. and Spectrum Analyzer. DM filter calculation, including damping. Design of L, C and R compo nents. Some MHz perturbations evaluations. Reduction means. Common Mode (CM) management and filtering Within control: implementation and interconnection between PCBs and between cabinets. CM parasitic coupling calculation and reduction. Signal transmission by lines and by optics. Switching power supply operating sequence as EMI source. CM capaci tances of heatsinks, transformers, screens, electric machines stators. Disturbances calculations. Measurement according to Standards. CM filter calculation. Leakage current constraint. Coupled inductance design. EMC Commutation Control of Power Semiconductors Tuning commutation times as a trade-off between switching losses and EMC. Calculation of di/dt and dv/dt front edges of semiconductors according to gate drive. Gate drive circuit designs for MOS and IGBTs. Who should attend? This seminar is targeted towards engineers and project managers, who design, specify, simulate, tune, integrate high frequency power supplies, converters, EMC filters, electric machines, and intelligent motion including inverter + power cable + electric machine, for high efficiency conversion, low global cost and high reliability.

About the instructor Bruce Carsten has 46 years of experience in the design and development of switchmode power converters from 100 mW to 10 kW and 20 kHz to 1 MHz. Although his specialities have become HF magnetics and design for low EMI, his background covers all aspects of switchmode design, from new control methodologies to new topologies, including the active clamp forward converter. He has authored or co-authored 59 papers, and has 17 patents. Contents

Flyback converters are commonly considered to be of low performance, suitable only for low power levels where circuit simplicity is important. This is not the case; I have shown that flyback converters are fundamentally similar to forward converters in nearly all aspects, but are actually superior in the utilization of the power magnetics. All efficient regulating power converters require an inductor, and all isolated converters also require a transformer. In the flyback converter these are uniquely integrated into a single device, which is smaller, lighter and more efficient than separate transformers and indictors, even compared to other integrated magnetic structures. As a buck-boost topology, flyback converters excel at working over a wide range of input and/or output voltages. They can function well as isolated ac input power factor corrected (PFC) converters, and as such are finding increasing use in LED luminaires up to a few 100 watts. This concept has been extended to a 4.5 kW, 50 kHz PFC converter, with 95% efficiency over a wide load range (despite a dissipative voltage clamp), utilizing SiC FETs and Schottky rectifiers. Flyback converters do have some potential disadvantages, including: pulsating input and output currents; a RHP zero in the control function; and the need to deal with the leakage inductance energy stored in the transformer. As with other basic single stage PFC converters, there is also a twice line frequency ripple on the output voltage, although in 3 phase applications this issue is easily overcome. Much of the seminar will deal with solutions to problems in utilizing an existing PFC flyback controller at power levels well beyond the intended application. The pulsating input and output currents are best dealt with interleaved converters, which require that the controllers be synchronized to a master poly-phase clock, and also must be able to share current. All problems encountered and their solutions will be presented, including: noise sensitivity of IC controllers; the slow control loop required of PFC controllers which allows the output voltage to overshoot dramatically on startup and load removal, and inconvenient „features“ built into the controllers which need to be overcome. Who should attend? This seminar is intended for design engineers who have a potential interest in extending the application of the simple flyback converter to high power levels, but who also want to avoid many of the pitfalls that can occur.

About the instructor Dr. Redl is a power-electronics consultant in Switzerland, specializing in power supplies, UPSs, inverters, electronic ballasts, battery chargers and battery management systems, and integrated circuits for power management. He holds twenty-two patents, has written over hundred technical papers and three book chapters, and co-authored a book on the dynamic analysis of power converters.

About the instructor Ionel “Dan“ Jitaru is the founder of Rompower Inc. an internationally recognized engineering firm in the field of power conversion, later Ascom Rompower Inc. and Delta Energy Systems (Arizona) Inc. Presently he is the president of Rompower Energy Systems Inc. He has published 52 papers wherein several of them have received the best paper award, and held 45 professional seminars at different International Conferences in the power conversion field. Mr. Jitaru has pioneered several trends in power conversion technologies such as “Soft Switching PWM”, “Full integrated multilayer PCB Magnetic”, “Synchronized rectification” and recently “True Soft Switching technologies” wherein the primary switchers turn on at zero voltage and the secondary switchers turn off at zero current. Some of these technologies have been covered by 63 intellectual properties wherein 37 are granted patents.

Contents

Current-mode control was introduced in the 1960s and over the years it has become one of the most popular control techniques for dc-dc converters. The reason for this is that it has many advantages, including simplified compensation of the feedback loop, increased stability and robustness, inherent pulse-by-pulse current limiting, reduced sensitivity to variations in the input voltage and to circuit parameter values, and easy load-current feedforward for superior load transient response. It has several flavors to choose from and unlike some other two-loop control techniques (V2, R3) it can be used with all types of square-wave converters. The concept can also be extended to resonant converters, e.g., the LLC converter. This seminar presents an overview and critical comparison of the various current-mode control techniques, discusses the latest developments in modeling and stability analysis, and provides design guidelines. The following topics will be covered: 1. Introduction 1.1. Basic concept of current-mode control 1.2. Advantages and disadvantages 1.3. History 2. Classification and characteristics 2.1. Constant-frequency control (peak, valley, PWM conductance) 2.1.1. Stability of the current loop 2.2. Variable-frequency control (constant-off-time, constant-on-time, hysteretic) 2.3. Derivatives and improvements (average-current control, charge control, inductor-voltage-integral control, emulated current control, line-voltage and load-current feedforward combined with current-mode control, capacitor-current control, combining current-mode control with ripple based voltage-mode control) 3. Large-signal and small-signal modeling, feedback-loop design, high frequency stability analysis 3.1. Simplified large-signal model 3.2. The Ridley model (large-signal, small-signal) 3.2.1. Z-transform based analysis of the current loop 3.3. Describing function analysis and small-signal model by Li and Lee 3.4. Feedback-loop design considerations 3.5. Harmonic balance based fast-scale stability analysis of the feedback regulated current-mode-controlled converters by Fang and Redl (fre quency shift of the hysteretic converter, period-doubling instability of the constant-on-time, constant-off-time or constant-frequency converters) 4. Practical issues 4.1. Current-sensing solutions (switch current, diode/synchronous rectifier current, inductor current, capacitor current) 4.2. Using the current loop for current limiting 4.3. Feedback-loop design for droop 4.4. Current-mode control of multi-phase converters Who should attend? The target audience of this seminar is power-supply design engineers, power-management IC designers, system designers, project managers, engineering students, and all other professionals interested in the theory and application of current-mode control of dc-dc converters.

Contents

This seminar will present a comprehensive overview of the modern magnetic technologies presently used in power conversion and new trends in magnetic technologies developed to address the new demands. In the quest for higher power densities and higher efficiency, magnetic technologies were forced to adapt. New magnetic structures have been developed as a result. In spite of the significant progress in the semiconductor industry, the magnetics technology lags behind. Presently, in most of the advanced implementations, the power dissipation in magnetics is the largest percentage of the total power dissipation. The seminar will start by presenting several key characteristics of magnetics such as leakage inductance, stray inductance, inter-winding and intra-winding capacitances and their impact in power conversion performance. Methods of measuring and controlling these parasitic elements are also presented. The seminar will present the most suitable magnetic technology for different topologies designed to enhance the efficiency and power density. A chapter is dedicated to quasi-integrated and integrated magnetics. Methods of calculating and simulating such structures will be presented. A particular implementation wherein two independent transformers are placed on the same magnetic core without mutual interference, this will highlight the presentation, by offering a better understanding of the flux distribution in the magnetic core. Magnetic technologies for specific applications such as very low voltage and high current will be presented together with experimental results. The seminar will also show some present and future trends in magnetics for higher frequency operation. The presentation will be highlighted with design guidance, design example and experimental results. Who should attend? This seminar is designed for power conversion engineers, magnetic engineers, and technical managers who are involved in state-of-art power conversion. The attendees will get familiar with the latest advancement in magnetics in power conversion aimed to increase the performance and reduce the total cost.

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Seminars Sunday, 14 May 2017, 14:00 – 17:30 Venue: Arvena Park Hotel Nuremberg, Görlitzer Str. 51, 90473 Nuremberg Seminar 5

Seminar 6

Seminar 7

Power Electronics and Control for Battery Systems

Power Supply Design Review: Achieving 98% Efficient Power Supplies Using GaN FETs

Design of Magnetic Components for High Power Electronics Converters

Eric Persson, Infineon Technologies, USA

Tomás Pagá, Enerdrive, Switzerland

Regine Mallwitz, Technische Universität Braunschweig, Germany Mike Meinhardt, SMA Solar Technology, Germany About the instructors Prof. Regine Mallwitz has been held the professorship for Power Electronics at the Technische Universität Braunschweig for 2 years. Before, she worked in R&D positions in different areas of power electronics for instance in the semiconductor module development at Infineon Technology AG, Germany, and PV inverter development at SMA Solar Technology AG, Germany.

About the instructor Eric Persson’s career spans 20 years of hands-on power converter and inverter design, followed by 17 years of applications engineering in the semiconductor industry at International Rectifier, now Infineon Technologies. He is presently heading GaN Applications worldwide for Infineon. Eric has presented more than 80 tutorials and papers at various international conferences. He is a regular lecturer, presenting short courses and tutorials at UW Madison, the University of Minnesota (his Alma Mater) and Purdue University. He is Chairman of the Power Source Manufacturers Association (PSMA) board of directors, and Program Chair for APEC 2017. Mr. Persson holds 13 patents, and is a recipient of the IEEE Third Millennium Medal.

Prof. Mike Meinhardt is head of Innovation Management at SMA Solar Technology AG, Germany and has over 20 years of experience in photovoltaic and off-grid inverters in industrial R&D as well as research institutes and universities. He is honorary professor at the University of Kassel.

Contents

Renewable energies will play a major role in future electric energy supply. With the growing portion of renewable energies in relation to conventional energy sources in public grids the need for energy storage and grid connected battery systems is also growing. Otherwise smaller off-grid battery systems are known for several years. For grid-tied battery energy systems power electronics are needed to convert the DC power of the battery to AC power and vice versa. These systems coupled to the public grid and have to fulfill the specific grid codes. However, off-grid battery inverters deliver stable, sinusoidal AC Voltage and at the same time high AC currents to trip fuses. In this way, each type of system is characterized by specific requirements which affects the power electronics but also the control strategies. These power electronics aspects and control strategies are in the main focus of this seminar. Requirement and functionality are derived and solutions are presented as well as one example of a commercially available battery inverter. The seminar discusses also the most important battery types and gives a systematic overview about the different types of battery systems on the market today and in the future. Who should attend? This seminar is interesting to beginners and advanced participants from university and industry (incl. utilities) as it includes a perfect mixture of different aspects of power electronics and control strategies. The seminar comprises theoretical parts on power electronic topologies and control structures as well as practical aspects on design consideration of offthe-shelf inverters for battery applications.

About the instructor Tomás Pagá, born in Venezuela in 1969, received his B.S and M.S. degrees from Simón Bolívar University in Caracas, Venezuela in 1994 and 1999 respectively. He was university professor and researcher until 2000. From 2001, he has been Power Electronics Converter Designer for industry, railway and renewable energy applications. Currently he works as consultant in High Power Electronics for Enerdrive GmbH in Zurich, for manufacturers of multi-megawatt wind energy and drives power converters. His research interests include high power electronics converters design, magnetic components modeling and design, modeling of power electronics components, thermal management and high frequency converters.

Contents

Contents

Achieving an overall peak efficiency of 98% in a server/telecom power supply has been a challenge for many years. To do so while also meeting density and cost goals is now a reality, by taking advantage of the performance benefits of GaN transistors. This seminar takes you through a complete power supply design in the 1-3 kW range. We will compare conventional high-efficiency silicon designs to even higher efficiency designs based on GaN HEMTs. The comparisons are based on actual reference designs using the latest devices. The seminar is in two parts, first for the PFC front-end, and the second for the LLC back-end DC-DC converter.

Filter chokes and transformers for high power converters, ranging from hundreds to thousands of kW, are commonly one of the most costly and difficult components to design. Desired electrical performance and tight restrictions in weight, volume and cooling represent a challenging compromise for the designer. In this seminar he addresses topics from how to specify the components for outsourcing to how to get deep inside the detailed design itself. References, test results and failure examples from real cases are presented. The seminar will be based on a design case, where the main design problems for each step will be addressed. Analytic, Finite Element Method and Circuit Simulation tools will be used during the design. Losses calculation and measuring are treated in detail. Losses produced by the switching high frequency components are often miscalculated resulting in poor thermal performance. High frequency losses curves of laminated magnetic steel are commonly not available from the suppliers, so the designer faces with the need of high frequency losses measuring methods. Losses measurement error sources, like low power factor and angle errors, are explained in detail and methods to overcome those issues will be discussed. Additional sources of losses due to winding resistance, skin/proximity effect and fringe flux on the air-gaps will also be addressed. Finally, cooling methods and mechanical design considerations for robustness and acoustic noise reduction are discussed.

The PFC section covers: Totem-pole full-bridge topology The tradeoffs of Continuous versus Critical Conduction Mode Balancing switching versus conduction loss Control strategy Magnetic considerations Gate drive EMI filter design Thermal management Handling line cycle drops and surge Performance example LLC DC-DC converter stage: Control strategy, LLC vs LCLC Optimizing magnetizing current, deadtime versus GaN Qoss Magnetic design options Primary-side gate drive Synchronous Rectifier: Control, FET options and gate drive Thermal management Output filter design Managing fault conditions Performance example Overall system performance, summary and conclusions. Who should attend? This seminar is intended for designers and engineers involved in high efficiency power supply design. It assumes a working knowledge of power electronic fundamentals, and a familiarity with power supply topologies and design principles.

Fields of application: Grid Connected Converters - Solar Inverters - Wind Generators - UPS systems Electrical Drives - Traction Drives - Wind Generators Isolated Grid Supplies - Railway Auxiliary Converters - UPS systems

Program: Field of application. Magnetic design basic concepts. Design case. Analytical calculation. Finite Element modeling. Interaction with the PE converter. High frequency losses estimation. Additional losses.

Simulation and measurement methods for validation. Cooling and mechanical design topics. Who should attend? Engineers and project managers involved on the design, specification and integration of transformers and inductors for high power electronics converters. High power electronics converter designers. Magnetic components, inductors and transformers, designers and manufacturers.

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Tutorials Monday, 15 May 2017, 09:00 – 17:00 Venue: Arvena Park Hotel Nuremberg, Görlitzer Str. 51, 90473 Nuremberg Tutorial 1

Tutorial 2

New Trends in Power Conversion for Very High Efficiency and High Power Density

What a Design Engineer Should Know About Power Factor Correction

Ionel Dan Jitaru, Rompower, USA

Richard Redl, Redl Consulting, Switzerland

About the instructor Ionel “Dan“ Jitaru is the founder of Rompower Inc. an internationally recognized engineering firm in the field of power conversion, later Ascom Rompower Inc. and Delta Energy Systems (Arizona) Inc. Presently he is the president of Rompower Energy Systems Inc. He has published 52 papers wherein several of them have received the best paper award, and held 45 professional seminars at different International Conferences in the power conversion field. Mr. Jitaru has pioneered several trends in power conversion technologies such as “Soft Switching PWM”, “Full integrated multilayer PCB Magnetic”, “Synchronized rectification” and recently “True Soft Switching technologies” wherein the primary switchers turn on at zero voltage and the secondary switchers turn off at zero current. Some of these technologies have been covered by 63 intellectual properties wherein 37 are granted patents. Contents

Presently, we are reaching 99% efficiency in PFC and DC-DC Converters by using the latest technologies, ranging from topology, magnetics and control. The developments in semiconductor technology such as GaN and SiC have enabled us to further improve the efficiency exceeding the 99% efficiency in some applications. The goal of this seminar is to teach how to increase the efficiency and power density in power converters. The first part of the seminar will identify the loss mechanisms in different power conversion applications. The next chapter will be dedicated to the latest improvements in topologies designed to minimize these loss mechanisms. Soft switching topologies have become popular in many applications in the last thirty years. Though we have such a long tradition in soft switching technologies, some of these topologies, have added too much complexity and their practical use become questionable due to the hardware cost and complexity. The goal is to have a simple and low cost hardware and an intelligent control designed to minimize the losses under different operating conditions. This seminar will present topologies which provide true soft switching. In the true soft switching topologies, the primary switching devices are turning on at zero voltage and the secondary switching devices are turning off at zero current. There is neither ringing nor spikes across any of the switching devices during operation, without the use of any snubbers. These topologies are derived from the classical topologies, such as flyback, boost, two transistor forward, half bridge, and full bridge with some minor modification with the use of intelligent control to obtain true soft switching. A detailed power dissipation analysis in several applications will highlight the need for magnetic optimization. In spite of the significant progress in the semiconductor industry, the magnetics technology lags behind. The seminar will describe the impact of the parasitic elements in the magnetics in optimizing the performance of the power converters. In the quest for 99% efficiency the magnetics and the packaging become key factors in efficiency optimization. The seminar will present the impact of intelligent power processing in optimizing the efficiency and even in converting a traditional hard switching topology into a soft switching topology. The presentation will be highlighted with many design examples and experimental results such as 99%+ efficiency PFC with power densities above 1000W/in3, and 99% efficiency isolated DC-DC Converter. Who should attend? This course is designed for power conversion engineers, magnetic engineers, and technical managers who are involved in state-of-art power conversion. The participants will get familiar with the latest advancement in magnetics in power conversion aimed to increase the performance and reduce the total cost.

About the instructor Dr. Redl is a power-electronics consultant in Switzerland, specializing in power supplies, UPSs, inverters, electronic ballasts, battery chargers and battery management systems, and integrated circuits for power management. He holds twenty-two patents, has written over hundred technical papers and three book chapters, and co-authored a book on the dynamic analysis of power converters. Contents

The European norms EN61000-3-2 and EN61000-3-12 require that the current harmonics of all line-connected equipment stay below the limits set by those norms. In the case of equipment with a rectifier front end this is usually achieved by adding a power-factor correction (PFC) circuit to the system. This tutorial presents the causes of, and motivations for, PFC (nonlinear loads, line-current distortion and its effects on power transmission and power quality, harmonic regulations), discusses the energy storage considerations, introduces the basic passive and active solutions for single-phase and three-phase PFC, and reviews and evaluates the most interesting new developments. The following topics will be covered: 1. Introduction 1.1. Power factor definitions 1.2. Causes and effects of line-current harmonics 1.3. Overview of the harmonic regulations 2. 2.1. 2.2. 2.2.1. 2.2.2. 2.2.2.1. 2.2.2.2. 2.2.3. 2.2.4. 2.2.4.1. 2.2.4.2. 2.2.4.3. 2.2.4.4. 2.2.4.5. 2.2.4.6. 2.2.4.7. 2.2.4.8. 2.2.4.9. 2.2.5.

Single-phase PFC solutions Passive PFC (choke, LC and LLC waveshaping) Active PFC Energy storage considerations Power-circuit topologies Boost PFC and its derivatives (voltage-doubler, interleaved, multilevel) Other nonisolated converters (buck, two-switch buck-boost, SEPIC, Cuk, hybrid resonant) Isolated PFC (flyback without or with high-efficiency postregulation, isolated boost, transformer-coupled higher-order converters, bridgeless isolated converters, nonisolated PFC and isolated downstream converter combination, isolated single-stage converters with energy storage on the input side, charge-pump PFC) Control techniques Standard average-current control Boundary conduction control Inductor current control with modulated ramp Voltage-follower control with distortion reduction Controlling the two-switch buck-boost PFC Current reference signal generation Control for high efficiency Reducing capacitor current stress Design examples Practical issues (inrush current limit, generating bias power, protection, EMI reduction)

3. Three-phase PFC solutions 3.1. Passive PFC 3.1.1. Rectifier bridge with dc-side or ac-side inductors 3.1.2. Harmonic filter 3.1.3. Multi-pulse rectification 3.2. Active PFC 3.2.1. Rectifier bridge and dc-side CCM boost converter combination 3.2.2. Boost PFC in discontinuous inductor current mode 3.2.2.1. Single-switch boost 3.2.2.1.1. Distortion reduction by harmonic injection 3.2.2.2. Two-switch zero-voltage-switching boost (“Taipei rectifier”) 3.2.2.3. Three-level Taipei rectifier 3.2.3. Buck PFC in discontinuous capacitor voltage mode 3.2.4. Boost PFC in CCM 3.2.4.1. Two-level Y and Δ converters 3.2.4.2. Two-level bidirectional PFC 3.2.4.3. Three-level PFC 3.2.4.3.1. Low-frequency (“slow-switching”) version 3.2.4.3.2. High-frequency version (“Vienna rectifier”) 3.2.4.3.2.1. Topologies 3.2.4.3.2.2. Control 3.2.5. Buck PFC 3.2.6. Four-switch buck-boost PFC 3.2.7. Phase-modular and single-stage isolated PFCs Who should attend? This seminar is recommended to power-supply design engineers, system designers, managers, engineering students, PFC IC designers, and all other professionals interested in power-factor correction or line-harmonics reduction Tutorial 3

Electromagnetic Design of High Frequency Converters and Drives Jacques Laeuffer, Dtalents, France About the instructor Jacques Laeuffer has a 35 years’ experience of R&D in Power Electronics, inside international companies, with powers from 10 W up to 10 MW, including HF resonant converters and high voltage transformers, electric machines and inverters for hybrid cars. He is inventor of 27 granted patents and author of over 80 technical papers. Affiliated professor at Ensta-ParisTech, he is also a teacher at CentraleSupelec, France, and for inter and intra companies international trainings, about power electronics, EMC, electric machines, digital control, mechatronics, cars powertrains, and history of physics. Contents

Increasing high frequencies (HF), i.e. with wide bandgap semiconductors, lead to new challenges. The “wiring inductance” issue is dramatically increased. Windings show “parasitic capacitances”. Electric machines suffer insulation breakdowns by HF ringing over voltages. As a matter of fact, reduced commutations times become smaller than electromagnetic propagation delays, inside power conversion and intelligent motion systems. Thus conventional “electric circuit” equations do not operate anymore as before. The tutorial shows a new appropriate physical analysis to understand what happens, and make designs without noisy resonances and emissions, over voltages, extra losses. This way, full benefits from new semiconductors become possible. The tutorial shows 3D distributions of energies and powers, and focus on main phenomena to lead to simpler calculations.

Number of practical designs are calculated, analytically and/or by simulation, showing orders of magnitudes for a wide range of powers, frequencies and impedances. Introduction Examples of issues. Noisy ringing inside converters and magnetics. Damping. Expected and non-expected actions of electromagnetic fields. Conduction and radiation. Differential mode (DM) and common mode (CM). Magnetic dominant and electric dominant fields. Tracks and Wiring Design Propagation on lines. Four impedances and speed. Power propagation, or filtering, or oscillation. Examples. Design bifilar, coaxial, and strip lines accordingly. Commutation loop with semiconductors and DC capacitor. SMD semicon ductors and stacked capacitor layout. Power module, DC capacitor and busbars geometry. Capacitors and Windings Design Medium frequency (MF) capacitors sizing. Capacitors HF propagation management. MF sizing of foil, planar and multi-layers transformers. Sizing of electric machines stators windings. HF propagation in these windings. Windings equivalent schematics and simulation. Propagation delays calcu lation. How to avoid ringing. Design workflow for low EMI and low HF losses. Proximity effect and optimization. Converters and Drives Design Power propagation in converters. SiC and GaN. Cases of flyback, forward, bridge, ZVS and ZCS. Matching components and layout HF impedances. Intelligent motion drive made of inverter, electric machine, cable, shielding and ground, as DM and CM. HF simulation algorithms of the system, and design workflow for low EMI. Radiations Reduction Examples of emissions of electric and magnetic fields. Fields measurements and reduction. Neighbor field and far field identification. Examples. Wiring, grounding, shielding, packaging. Who should attend? This tutorial is targeted towards engineers and project managers, who design, specify, simulate, tune, integrate high frequency power supplies, converters, EMC filters, electric machines, and intelligent motion including inverter + power cable + electric machine, for high efficiency conversion, low global cost and high reliability..

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Tutorials Monday, 15 May 2017, 09:00 – 17:00 Venue: Arvena Park Hotel Nuremberg, Görlitzer Str. 51, 90473 Nuremberg Tutorial 4

High Performance Control of Power Converters Christian Peter Dick, Jens Onno Krah, Cologne University of Applied Sciences, Germany About the instructor Christian P. Dick studied Electrical Engineering at RWTH Aachen University, Germany, where he also received his PhD degree. Beginning of 2011 he joined SMA Solar Technology AG as director for advance development of solar converters up to 20kW. He is now professor for power electronics and electrical drives at Cologne University of Applied Sciences. Since years, Christian Dick is member of VDE and IEEE. His main research interests are resonant converters and the large-scale utilization of renewable energy, including automation and safety aspects. Prof. Dr. Ing. Jens Onno Krah studied electrical engineering at the University Wuppertal and obtained his PhD 1993 by Prof. Holtz within electrical drives research. Until February 2004 he worked as technical director for Kollmorgen, formerly Seidel Servo Drives. He was responsible for the development of the Kollmorgen Servo Drives. Since March 2004 Prof. Krah teaches control engineering at the University of Applied Sciences Cologne.

Contents

Utilizing power electronic based converter technology is a key approach to build energy efficient solutions. Due to the innovation cycles of the semiconductor suppliers the size and the cost of the more and more complex inverter systems is not increasing. However, especially the new fast switching wide bandgap devices (SiC & GaN) are challenging the control hardware. The advanced control architectures are covered by discussing algorithms and possible implementations using μC, DSP and FPGA technology. Robust controller designs with well-defined set up procedures or reliable self-tuning algorithms can help to use these innovations utilizing a reasonable set-up time. 1. Converter Design Basics IGBT, MOSFET, SiC Buck, 2-Quadrant Chopper State-machine based dead time generation 2-Level / 3-Level Inverter - including Energy Efficiency Classes Gate driver basics Flyback, resonant LLC 2. Inverter Modulation Techniques Single Phase Modulator Pulse Width vs. Pulse Frequency Modulation 2-Level / 3-Level SVM 3. Analog to Digital Conversion Sigma-Delta DAC versus R-2R DAC and PWM Sigma-Delta Modulation Sinc³ decimation filtering Efficient FIR implementations, Demonstration, Examples 4. Current Sensing Transducer versus shunt Synchronous sampling Aliasing, EMI suppression 2 vs. 3 current probes in 3~ Loads 5. Current Control Hysteresis Control Sampling Control Synchronous Control (FOC): Clarke, Park, decoupling Hybrid control (single-phase) PLL Dead-Time Compensation Buck, Flyback, resonant LLC

6. Current Prediction Modeling the Plant Smith Predictor Current Observer 7. Parameter Tuning Theoretical background Parameter estimation 8. Conclusion and Future Trends Who should attend? This tutorial will be especially valuable for engineers and PhD’s who address the following control aspects:

Digital Motion Control Mains Control, including PFC High-Bandwidth Sensor Circuitry including Robust Signal Transmission Modulation Techniques Controller Implementation using FPGA Controls-Related Novel Converter Issues like Wide-Bandgap Devices

dc/dc-converter dc/ac-converter Load Cycles Calculation of heat sink Device Induced Electromagnetic Disturbance Parasitics Oscillations in Power Modules Special Topics of Application Consideration of special problems and questions of participants, for example: Parallel/series connection of power devices Special effects in ZVS/ZCS topologies Special problems related to new device technologies Short-circuit ruggedness of IGBTs and SiC MOSFETs Who should attend? Engineers designing converters equipped with fast power semiconductors like Si/SiC MOSFETs, IGBTs and diodes having basic knowledge in power devices and power converters.

Tutorial 7

Reliability of Si and SiC Power Devices and Packages Josef Lutz, Chemnitz University of Technology, Germany About the instructor Josef Lutz joined Semikron Electronics, Nuremberg, Germany in 1983. First he worked in the development of GTO Thyristors, then in the field of fast recovery diodes. He introduced the Controlled Axial Lifetime (CAL) diode. Since August 2001 he is Professor for Power Electronics and Electromagnetic Compatibility at the Chemnitz University of Technology, Germany. His main fields of research are ruggedness and reliability of power devices. He is involved in several national and international research projects regarding power cycling lifetime of IGBT modules and further reliability aspects. He is one of the authors of the book “Semiconductor Power Devices – Physics, Characteristics, Reliability”, published by Springer 2011. Contents

This tutorial focuses on thermal problems and other lifetime-limiting mechanisms in power devices; aspects going from Si to SiC are considered.

Tutorial 6 Tutorial 5

Design Considerations for High Frequency Linear Magnetics

Advanced System Design with Ultra-Fast Si/SiC/GaN Power Semiconductor Devices

Bruce Carsten, Bruce Carsten Associates, USA About the instructor Bruce Carsten has 46 years of experience in the design and development of switchmode power converters from 100 mW to 10 kW and 20 kHz to 1 MHz. Although his specialities have become HF magnetics and design for low EMI, his background covers all aspects of switchmode design, from new control methodologies to new topologies, including the active clamp forward converter. He has authored or co-authored 59 papers, and has 17 patents.

Tobias Reimann, ISLE Steuerungstechnik und Leistungselektronik, Germany Thomas Basler, Infineon Technologies, Germany About the instructor Tobias Reimann received 1994 his PhD from the Technische Universität Ilmenau in the field of power semiconductor applications for hard and soft switching converters. In 1994 he was one of the founders of the company ISLE GmbH which is engaged in system development for power electronics and electrical drives. He is responsible for the operational business of this company. In addition, since July 2009 he is Professor for Industrial Electronics at the Technische Universität Ilmenau. Prof. Reimann is a member of scientific board of “Thuringian Center of Excellence in Mobility (ThIMo)” at the Technische Universität Ilmenau in the field of automotive electronics. Thomas Basler received his Diploma in Electrical Engineering from Chemnitz University of Technology in 2009. His Diploma thesis was on the robustness of power diodes. Between 2009 and 2013 he was a member of the scientific staff at the Chair of Power Electronics and Electromagnetic Compatibility at Chemnitz University of Technology. At the beginning of 2014 he received his PhD. His thesis is about short-circuit and surge-current ruggedness of IGBTs and was supervised by Prof. Dr. Josef Lutz. 2014 he joined Infineon Technologies AG, Neubiberg, Germany, where he works on the development of SiC MOSFETs, diodes and Si IGBTs. Contents

Fast Power Devices / Modules / Reliability New developments in fast power devices (SiC/Si MOSFETs, IGBTs, GaN devices, freewheeling diodes) Device design, properties and suitable applications Reliability topics of (new) devices, e.g. gate oxide, dynamic Ron, cosmic ray ruggedness Power module layouts and optimal design for low inductivity Thermal mismatch, thermal stress, power cycling capability Drive and Protection Principles, technical realizations Special driver requirements for fast power devices (Si, SiC, GaN) Failure modes, failure detection Topology-dependent Power Losses

Contents

In this tutorial the potential advantages of using internal cooling passages for significantly improved heat dissipation and power density in larger power magnetics will be shown. A comprehensive survey and ranking is provided on the propensity of various transformer, inductor and ‘hybrid’ or integrated magnetic structures to generate external magnetic fields, and thus significant potential EMI problems. Some new material will discuss the myths and misunderstandings of “coaxial” transformers, and their evident confusion with transmission line transformers. As in earlier versions, the tutorial focuses on an intuitive understanding of transformers and inductors. The basic design equations are provided, along with practical information “learned the hard way” which is not found in the text books. Topics include: The basics: Ferromagnetic Materials, Magnetic Energy Storage & Electro magnetic Energy Coupling Inductor Design: Maximizing Energy Storage, Winding Capacitances & Stray Fields Transformer Design: Leakage Inductance, Stray Fields, and use of Faraday Shields Measurement of Transformer Magnetizing and Leakage Inductances Calculation vs Measurement of Transformer Winding Capacitances Design Optimization Scaling Laws beyond the “Area Product”; Exploring Size and Shape Effects Thermal Management Considerations Magnetics Design Guidelines Who should attend? The tutorial is directed towards engineers who design or specify high frequency transformers and inductors, but any power electronic designer or project manager will benefit from an improved understanding of their capabilities, characteristics and limitations.

1. Basic architecture of Si and SiC power modules and discrete packages 2. Materials, substrates and interconnection technologies 3. Heat transport, thermal resistance, thermal impedance, cooling methods 4. Temperature determination Virtual junction temperature: Definition, measurement Temperature sensitive electrical parameters in Si, SiC, GaN 5. Fatigue processes, fatigue detection, related tests 6. Power cycling as main method to determine package related lifetime expectation Experimental setup, test strategies Test according to the German automotive standard LV 324 New methods for state-of-health analysis Temperature measurement accuracy improvement 7. Empirical models for lifetime prediction LESIT model, CIPS 2008 model Application of available models, limits, work on new models Special aspects with SiC devices Special aspects with discrete packages 8. Improved technologies and future trends for increased lifetime expectation Diffusion sintering, Diffusion soldering, Improved bond wires, Improved substrates 9. Gate oxide reliability in Si and SiC 10. Some aspects on cosmic ray reliability Who should attend? Engineers in design of converters with IGBTs and SiC devices with interest in reliability, beginners as well as experienced engineers are welcome.

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Tutorials Monday, 15 May 2017, 09:00 – 17:00 Venue: Arvena Park Hotel Nuremberg, Görlitzer Str. 51, 90473 Nuremberg Tutorial 8

Driving Electric - Power Train, Battery, Wireless Charging and Autonomous Driving Nejila Parspour, Peter Birke, Dan Keilhoff, University of Stuttgart, Germany Martin Doppelbauer, Karlsruhe Institute of Technology, Germany About the instructors Nejila Parspour is Professor of Electrical Energy Conversion at the University of Stuttgart and director of the Institute of Electrical Energy Conversion (iew). She received her Master in electrical engineering in 1991 and her PhD in 1995, both from Technical University of Berlin. Before joining the University of Stuttgart and after a Postdoc work at the University of Berkley, she collected five years of industrial experience at Philips as senior manager in the area of industrial X-ray and six years of scientific experience at the University of Bremen. Her research and teaching activities are in the field of electrical machines and drives with a focus on machine design and in the field of contactless energy transfer with a focus on inductive charging systems. In the field of electromobility Nejila Parspour has meanwhile acquired in-depth knowledge due to her intensive scientific work during the last 14 years, particularly in developing position-tolerant inductive charging systems and high efficiency electrical motors. Prof. Dr Kai Peter Birke obtained his PhD in materials science (ion conducting ceramics) from the University of Kiel in 1997. In 1998, he joined the Fraunhofer-Institute for Silicon Technology, Itzehoe, Germany, to work on the development of proprietary Li-Ion laminated cell with a functional ceramic separator and co-founded two spin-offs to put this technology into production. After being involved in the development and production of pouch type laminated (PoLiFlex) Li-Ion cells at Varta for five years, Dr. Birke joined Continental AG in Berlin in 2005, first as a project leader in energy-storage systems. He became senior technical expert in battery technology and team leader in cell technology, and in 2010 was appointed Head of Battery Module and Electromechanics. Dr. Birke has 22 years of experience in research, development, and production of energy storage systems with a focus on Li-Ion technology. Since 2015 he has been a full Professor at the University of Stuttgart, covering the field of Electrical Energy Storage Systems.

especially with different reactive power compensation topologies, a classification as well as the principles of operation will be explained and safety and reliability of contactless energy transfer will be discussed. The second presentation entitled Battery systems deals with actual and future battery technologies and will give an introduction to the principle of function of Lithium-Ione cells followed by a discussion of the power density and energy density development, materials, new battery trends, cell technology and the vision of electric energy storage and the operating range. The third presentation is entitled Electric Drives of Hybrid and Battery Electric Vehicles. Main contents are drive configurations as well as operating principles and behaviors of electric machines and drivetrains. Further, special features of permanent magnet synchronous motors will be introduced. The presentation closes with an overview of new electric motor designs and an outlook to future developments. The tutorial will be closed by the presentation entitled Automated driving of electric vehicles. Starting with a definition and classification of the autonomous driving, the focus of this presentation will be on the partial automation of electric vehicles in order to improve energy consumption as well as on field studies with volunteers to investigate the acceptance of automated driving.s Who should attend? People who want to get an overview on current developments in the field of electrical driving, particularly on power train, inductive charging, battery system and autonomous driving. Tutorial 9

Design Challenges for High Frequency Magnetic Circuit Design for Power Conversion William Gerard Hurley, Werner Hugo Wölfle, National University of Ireland, Ireland About the instructors William Gerard Hurley received the B.E. degree in Electrical Engineering from the National University of Ireland, Cork in 1974, the M.S. degree in Electrical Engineering from the Massachusetts Institute of Technology, Cambridge MA, in 1976 and the PhD degree at the National University of Ireland, Galway in 1988. He worked for Honeywell Controls and Ontario Hydro in Canada from 1977 to 1983. He is currently Director of the Power Electronics Research Centre at the National University of Ireland, Galway. He is a Fellow of the IEEE. He received the IEEE Power Electronics Society Middlebrook Technical Achievement Award in 2013 and was appointed Distinguished Lecturer of the IEEE for 2014-2017. He has co-authored a text book on magnetics for power electronics.

Dr. Dan Keilhoff received his diploma in Automotive Engineering in 2004. He worked 8 years at the Daimler AG, being responsible for the development of software functions for the exhaust gas aftertreatment system. He joined the Stuttgart University in 2012. His topic for the following 4 years was research regarding operation strategies for hybrid powertrains and powertrain simulation. After receiving his PhD in 2016 he became the assistant of Prof. Reuss, who holds the chair for Automotive Mechatronics. The work field of Dr. Keilhoff is research and teaching in terms of automated and connected driving.

Werner Hugo Wölfle graduated from the University of Stuttgart in Germany in 1981 as a Diplom-Ingenieur in Power Electronics. He completed a PhD degree at the National University of Ireland, Galway in 2003. He worked for various companies in the field of Power Electronics as a Development Engineer for power converters in space craft, military and high grade industrial applications. Since 1989 he is Managing Director and head of the R&D Department of Traco Power Solutions in Ireland. Traco Power Solutions develops high reliability power converters and power supplies for industrial applications. Mr. Wölfle is currently an adjunct professor in Electrical Engineering at the National University of Ireland, Galway. He has co-authored a text book on magnetics for power electronics.

Prof. Doppelbauer worked for 15 years in the industry, lastly as Senior Manager of the Electric Motor R&D department at SEW Eurodrive, Bruchsal. He joined the Karlsruhe Institute of Technology in 2011 where he holds a chair for Hybrid Electric Vehicles at the Institute of Electrical Engineering. Prof. Doppelbauer is also actively working in international standardization of rotating electric machines and currently the chairman of IEC Technical Committee 2. Contents Contents

This tutorial aims giving an overview about the state of the art in electric driving and showing the newest trends in research and technology. In particular, four subjects will be introduced and discussed. These are powertrain, inductive charging, battery system and autonomous driving. Each subject will be treated in a session including a presentation followed by a question and answer part. The tutorial will start with the presentation entitled Inductive Charging. After a brief review of transformer basics, requirements and specific behavior of inductive charging systems are identified. Besides analytical calculation,

The key to reducing the size of power supplies is high frequency operation and magnetic components can play a critical role. The tutorial begins with the design rules for inductor design and examples of different types of inductors are given. A special example is the inductor in a flyback converter, since it has more than one coil. This is followed by the general design methodology for transformers and many examples from switched mode power supplies and resonant converters are given. The main focus is placed on modern circuits where non-sinusoidal waveforms are encountered. General rules are established for optimising the design of windings under various excitation and operating con-

ditions. The skin effect and the proximity effect give rise to increased losses in conductors due to the non-uniform distribution of current in the conductors. A new approach to high frequency losses that avoids cumbersome Fourier analysis will be presented to optimise the winding design, for non-sinusoidal waveform encountered in practical power electronics. Core losses for both sinusoidal and non-sinusoidal flux will be covered. This tutorial is based on a textbook authored by the speakers: Transformers and Inductors for Power Electronics: Theory, Design and Applications, Wiley, 2013.

topics on power electronics, including the reliability. He has contributed more than 300 journal papers, and given more than 300 invited national/international lectures. Among other awards, Dr. Blaabjerg received the IEEE William E. Newell Power Electronics Award in 2014. Francesco Iannuzzo is currently a Professor of Reliable Power Electronics at the Aalborg University, Denmark, and CORPE (Center of Reliable Power Electronics). His research interests are in the field of reliability of power devices, including against cosmic rays, power device failure modelling and testing of power modules under extreme conditions. He has contributed more than 120 journal and conference papers in the field. Prof. Iannuzzo was the Technical Chair in two editions of ESREF, the European Symposium on Reliability and Failure analysis.

Content: Introduction The Introduction covers the fundamental concepts of magnetic components that serve to underpin the later sections. Inductor Design In Section I, the design rules for inductor design are established and examples of different types of inductors are given. The single coil inductor, be it in air or with a ferromagnetic core or substrate, is the energy storage device for magnetic fields. A special example is the inductor in a flyback converter, since it has more than one coil. Examples include: forward, flyback, pushpull and LLC resonant converters; filter chokes. Transformer Design Section II deals with the general design methodology for transformers. Particular emphasis is placed on modern circuits where non-sinusoidal waveforms are encountered and power factor calculations for non-sinusoidal waveforms are covered. Examples include: forward, pushpull and resonant converters. High Frequency Design There is an inverse relationship between the size of a transformer and its frequency of operation. However, losses increase at high frequency. There is skin effect loss and proximity effect loss in the windings due to the non-uniform distribution of the current in the conductors. The core loss increases due to the eddy currents circulating in the magnetic core and due to hysteresis. General rules are established for optimising the design of windings under various excitation and operating conditions. A new approach to high frequency losses that avoid cumbersome Fourier analysis will be presented to optimise the winding design. Losses that result from fringing effect of the magnetic field around an air-gap will be covered. The use of litz wire for mitigating skin and proximity effects will be treated. The application of interleaving to reduce proximity effects will be explained. Who should attend? This tutorial is of interest to and practising engineers working with power supplies and energy conversion systems; students of electrical engineering and electrical energy systems; graduate students dealing with specialised inductor and transformer design for high frequency operation Tutorial 1 0

Reliability Engineering in Power Electronic Systems Frede Blaabjerg, Francesco Iannuzzo, Huai Wang, Aalborg University, Denmark About the instructors Frede Blaabjerg is currently a Professor with the Department of Energy Technology and the Director of Center of Reliable Power Electronics (CORPE), Aalborg University, Denmark. He has intensive research work on power electronics and its applications in motor drives, wind turbines, PV systems, harmonics, and the reliability of power electronic systems. He has held more than 300 lectures national and international, most of them in the last decade are invited and as keynotes at conferences, covering various

Huai Wang is currently an Associate Professor with the Center of Reliable Power Electronics (CORPE), Aalborg University, Denmark. His research addresses the fundamental challenges in modelling and validation of the failure mechanisms of power electronic components, and application issues in system-level predictability, circuit architecture, and robustness design. Prof. Wang received the IEEE PELS Richard M. Bass Outstanding Young Power Electronics Engineer Award, in 2016. He has served as an Associate Editor of IEEE Transactions on Power Electronics since 2015. Contents

In many mission-critical applications of energy conversions such as renewables, industry, electric vehicles, and aircrafts, etc., power electronics should be extremely reliable and robust to avoid high cost of failures. In order to meet this challenging requirement, there is an ongoing paradigm shift in this field from the statistics-based assessment to the physic-of-failures based analysis. In this shift, the stress and strength models of the power electronics systems need to be accurately built, and both of the factors are closely related to the operating conditions or mission profiles of the whole systems. These mission profiles will involve multi-disciplinary knowledge and new engineering approaches for the design of reliability performances. In this tutorial, the paradigm shift in reliability research on power electronics as well as some reliability engineering concepts are first introduced. Afterwards some basics about reliability engineering are presented, followed by a specific section on abnormal condition testing, and another one on condition monitoring and active thermal control. Based on these results, a series of new modelling and control concepts are given to evaluate/improve the reliability performances of power electronics systems considering mission profiles with several examples on renewable energy and motor drives. Finally, the tutorial will also present the views of the instructors on the future research opportunities in the area of reliability of power electronics. The approaches presented in the tutorial are also the common interest for the companies involved in the Center of Reliable Power Electronics (CORPE) at Aalborg University. Content: Towards Reliable Power Electronics Motivations, field experiences and challenges Ongoing paradigm shift in reliability research Design for reliability concept Basics about reliability engineering and metrics Weibull distribution, Reliability, Failure rates, and Bx lifetime Concepts of FMEA, HALT, CALT, Six sigma design, etc. Importance of mission profiles Abnormal condition testing basics for power electronic components Impact of severe and abnormal events on the reliability performances Basic of instabilities and related phenomena Instabilities during short circuit of IGBTs

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Tutorials Monday, 15 May 2017, 09:00 – 17:00

Awards

Venue: Arvena Park Hotel Nuremberg, Görlitzer Str. 51, 90473 Nuremberg Non-destructive testing technique and setups Condition monitoring and active thermal control for improved reliability Basics ideas and control freedoms Thermal measurement and monitoring Control under normal operations of converter Control under severe and abnormal conditions Advanced Design Tool for Reliability of Power Electronics Systems Multi timescales modelling of power electronics system New thermal models of IGBT for mission profile translation Rain flow counting, accumulated damages and Monte Carlo simulation Examples on Wind power, PV power and LED lighting systems Case study: a 5kW fuel-cell system From system level requirement to component level reliability allocation Select proper commercially available components to fulfill the system level reliability requirement Future Research Opportunities in Reliability of Power Electronics Interdisciplinary efforts and opportunities ahead

Who should attend? Engineers or researchers in power electronics design and testing with interest in improving reliability performance. Beginners as well as experienced engineers are both welcome. Focus is more on the reliability engineering including testing and modelling aspects from components to system level. Tutorial 11

Energy Storage - Systems and Components Alfred Rufer, EPFL, Switzerland About the instructor Alfred Rufer is honorary professor in power electronics at the Swiss Federal Institute of Technology EPFL, Lausanne Switzerland. He has been leading the Industrial Electronics Lab (LEIEPFL) from 1997 to 2016. Beneath many research projects in power electronic circuits and applications, he has initialized several activities in energy storage systems and components, from the design and modeling of supercapacitor based power assistance systems to multiphysics modeling of complex storage devices as Vanadium Redox Flow Batteries or CAES, Compressed Air Energy Storage. Alfred Rufer has authored or co-authored more than 250 scientific papers in international conferences and journals. He has supervised over 30 PhD students. Prof. Rufer is a fellow of the IEEE and has received many IEEE Transactions or Conference Prize Paper Awards. In addition, Alfred Rufer is a honorary board member of the PCIM conference where he served as a General Conference Director.

Contents

From the second half of the 20st century, large facilities for electrical energy storage have been built in the context of matching the variable power demand with installations of large nuclear power stations known for their mostly constant power production. More recently, another tendency has appeared with the development of Renewable Energy Sources. From the classical centralized utility of today, a clear movement goes in the direction of distributed utility, together with the appearance of Smart Grids. Renewable energy sources are known by their variation in time, or available power related to meteorology conditions. This is a new motivation for the development and realization of new energy storage techniques. The use of RES, but also the integration of storage devices is mainly achieved with interconnection to electrical systems and need appropriate electric power conversion.

General and technical definitions on energy storage Energy storage technologies Comparative ratings and properties The theory of Ragone plots Modeling, electrical models, thermal modeling, multiphysics modeling Electrochemical energy storage Energy storage by means of supercapacitors Energy storage systems based on compressed air Hydropower pumped storage facilities (Variable speed) Energy storage based on hydrogen Dedicated power electronic circuits Examples of design, examples of applications, calculation of efficiency, thermal models, etc.

Best Paper Award The Best Paper Award honours the best paper of the conference. The award ceremony and speech will be part of the PCIM Europe Conference opening ceremony.

The Young Engineer Award goes to the three best lectures from engineers not older than 35 years and will be also honoured in the PCIM Europe Conference opening ceremony.

The nominees are:

The nominees are:

IGBT Gate Driver with Accurate Measurement of Junction Temperature and Inverter Output Current Marco Denk, Mark-M. Bakran, University of Bayreuth, D

Development of a High Efficient MPPT for Space Applications Using GaN Power Transistors Cornelius Armbruster, Christian Schöner, Fraunhofer Institute ISE, D; Torben Schönbett, Alfons Klönne, Rainer Merz, University of Applied Sciences Karlsruhe, D

Air Cooled SiC Three Level Inverter with High Power Density for Industrial Applications Alexander Hensler, Thomas Bigl, Stephan Neugebauer, Stefan Pfefferlein, Siemens, D Medium Frequency Transformer Design and Optimization Marko Mogorovic, Drazen Dujic, École Polytechnique Fédérale de Lausanne, CH

Who should attend? The tutorial is addressed to all engineers active in power, power systems, renewable energy sources, automotive, traction systems and all applications where energy saving potential exists. The tutorial is oriented on an « engineer approach », presenting tools and definitions helping the design of dedicated systems. The tutorial is a complement to the matter teached in classical university orientations, bridging the knowledge between basic sciences and engineering sciences, covering an interdisciplinary range.

Young Engineer Award

Design and Performance of a 200 kHz GaN Motor Inverter with Sine Wave Filter Franz Stubenrauch, Norbert Seliger, University of Applied Sciences Rosenheim, D IGCT based Modular Multilevel Converter for an AC-AC Rail Power Supply David Weiss, Michail Vasiladiotis, Noemi Drack, ABB Switzerland, CH; Andrea Grondona, ABB, SE Design Method for the Minimization of CM Inductor Volume with Consideration of Core Saturation in EMI Filters Bilel Zaidi, Arnaud Videt, Nadir Idir, University of Lille (L2EP), F

This award is sponsored by:

IGBT Gate Driver with Accurate Measurement of Junction Temperature and Inverter Output Current Marco Denk, Mark-M. Bakran, University of Bayreuth, D Reducing dv/dt of Motor Inverters by Staggered- Edge Switching of Multiple Parallel SiC Half- Bridge Cells Thomas Fuchslueger, Hans Ertl, Technical University of Vienna, AT; Markus A. Vogelsberger, Bombardier Transportation, AT Air Cooled SiC Three Level Inverter with High Power Density for Industrial Applications Alexander Hensler, Thomas Bigl, Stephan Neugebauer, Stefan Pfefferlein, Siemens, D Parasitic Inductance Analysis of a Fast Switching 100 kW Full SiC Inverter Matthias Kegeleers, Julian Körner, Stefan Matlok, Maximilian Hofmann, Martin März, Fraunhofer Institute IISB, D Digital Control of Hard Switched Converters by Phase Modulated Pulse Width Modulation PMPWM Stefan Matlok, Bernd Eckardt, Bernd Seliger, Martin März, Fraunhofer Institute IISB, D Dual Side-Gate HiGT Breaking Through the Limitation of IGBT Loss Reduction Tomoyuki Miyoshi, Yujiro Takeuchi, Tomoyasu Furukawa, Masaki Shiraishi, and Mutsuhiro Mori, Hitachi, J Medium Frequency Transformer Design and Optimization Marko Mogorovic, Drazen Dujic, École Polytechnique Fédérale de Lausanne, CH Power Loss Evaluation of 2.5 MHz High Frequency Inverter Based on Frequency Multiplying Method Koji Orikawa, Satoshi Ogasawara, Hokkaido University, J; Jun-ichi Itoh, Nagaoka University of Technology, J Design and Performance of a 200 kHz GaN Motor Inverter with Sine Wave Filter Franz Stubenrauch, Norbert Seliger, University of Applied Sciences Rosenheim, D IGCT based Modular Multilevel Converter for an AC-AC Rail Power Supply David Weiss, Michail Vasiladiotis, Noemi Drack, ABB Switzerland, CH; Andrea Grondona, ABB, SE Design Method for the Minimization of CM Inductor Volume with Consideration of Core Saturation in EMI Filters Bilel Zaidi, Arnaud Videt, Nadir Idir, University of Lille (L2EP), F

These awards are sponsored by:

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Keynotes

Top-class keynotes each conference day Tuesday, 16 May 2017

which will be demonstrated as an example. This keynote aims to outline how this fundamental change of the well-known applications in the field of intralogistics as well as materials handling technology may look and what consequences it will lead to.

Long distance charging solutions for BEVs: from now to 2030 Robert Lassartesses, Renault, F

Speaker: Robert Lassartesses, Renault, France Chairperson: Jean-Paul Beaudet, Schneider Electric, France

This keynote will describe different charging solutions which are already available for a long-distance drive with a BEV (battery electrical vehicle) today as well as the trends for the future. Pro and contra will be shown. The today trend is to increase the battery and the fix charger power. However, this trend limits the mass market for BEVs. The keynote will show some of these limits on the car point of view (battery cost/packaging/weight, uncertainty on specific material availability and environmental consideration). Game changer as charging during driving could solve these mass market car roadblocks. Charging during driving transfers an important investment part from BEV to infrastructure by reducing battery size or in other words transfers investment from the BEVs owners to the public. If we consider that 5000 euros could be saved by reducing the needed battery size and if we consider 30 % EVs to be sold each year, it would represent 3 billion euros investment each year for road infrastructure only for a country like France. In any case, hundreds of billions will be needed though the world to equip the road in coherence with the high number of BEV expected from now to 2030. To insure profit, each investment needs to be secure for a least 10 years. A very good long term common understanding in the system BEV+ charging infrastructure roadmap is needed between partners to insure BEV success. Even today, if the mainstream of the EV industry invests in huge numbers of powerful fix charger (right now from 43 kW AC to DC 350 kW), many solutions could arrive aside the mainstreams to insure possible lack of fix chargers in dedicated areas or specific timeslots (winter vacations…).

Wednesday, 17 May 2017

The Smart Future of Power Electronics and its Applications Hans Krattenmacher, SEW-Eurodrive, D

Speaker: Hans Krattenmacher, SEW-Eurodrive, Germany Chairperson: Leo Lorenz, ECPE, Germany

Power electronic components have been used for decades in devices in the field of electric drives e.g. inverters, power supplies etc. One of the most important devices is the conventional frequency inverter which is employed in countless applications of the conveyor technology, materials handling technology as well as the field of machine automation. The technology and therefore the power electronics have been adjusted, improved, optimized and perfected to fit the applications throughout the years. However, the application itself hardly changed as the main focus lied on making it faster, more efficient and more robust. The scope of Industry 4.0 possibly brings fundamental changes to the manufacturers of these plant automation technologies leading to completely different tasks, ways of thinking and requirements and therefore different solutions. The traditional stationary materials handling technology, in which many gearmotors and electronic components are built into, will be replaced by mobile materials handling systems. Based on this knowledge it can be concluded that the product in its current form will no longer be needed in the solutions of tomorrow. The production philosophy for the future SMART Factory will be organized and operated in a completely new way. Power Electronics will remain an enabling technology however the converter technology will become “SMART”. SEW as a trendsetter for the future SMART Factory

Thursday, 18 May 2017

Evolution in Topologies as a Result of New Devices and Enabling Technologies Ionel Dan Jitaru, Rompower, USA

Speaker: Ionel Dan Jitaru, Rompower, USA Chairperson: Philippe Ladoux, University of Toulouse, France

The topic that new topologies may be needed as the progress in semiconductor industry and other enabling technologies are emerging, has been raised with different occasions. In order to make a prediction of such developments we need to look into the evolution of the basic topologies in the last thirty years and analyze the impact introduced by the new semiconductor devices, magnetic technologies and control ICs. Though in the last thirty years no more topologies were introduced, we noticed a clear shift in the “preferred topologies” used by engineers in power conversion. That shift did occur mostly due to the progress in semiconductor devices. Another key role was played by the type of applications in power electronics which changed some of the specifications and favored some topologies over others. Recently the availability of digital control has opened the door to intelligent power processing, and allowed us, for example, to take a conventional topology and convert it in “soft switching topology” without any changes in the hardware. This presentation will look at the progress of some topologies over the years such as flyback topology, forward derived topologies including the two transistors forward, half and full bridge topologies and the changes made in order to further improve the performances. Though some of the “old” topologies were not fundamentally changed, modifications did occur for performance enhancement. As an example, the flyback topology evolved over the years initially through the magnetic optimization, and further through control methodology, wherein in the latest flyback topology the energy contained in all the parasitic elements in harvested and the performances greatly improved, achieving soft switching in primary and secondary with minimum hardware changes. The same does apply for the half bridge and full bridge topology, wherein the latest generation of half bridge and full bridge topologies do have soft switching both in primary and secondary across the synchronous rectifiers and this is done mostly through the intelligent power processing, possible today due to the digital control. Even in the case of two transistor forward topology, one of the most popular topology over many years, has recently benefited by some key improvements. The latest two transistor forward topology achieves soft switching both in primary and secondary, with minor hardware changes and through intelligent control. The same evolution is achieved also in the traditional boost converter, which evolved in the latest applications in PFC wherein the efficiency went above 99% mostly due to the GaNs and intelligent control. Though the basic boost topology remained the same, some modifications were introduced to improve the performances and convert it into a true soft switching topology. After scanning the improvements in the last 30 years in power conversion it is concluded that the traditional topologies were not replaced but they evolved especially in the last ten years due to the introduction of new devices and the availability of intelligent power processing through digital control. The paper will be highlighted with design examples of such improvements of the basic topologies over the years.

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Conference Tuesday, 16 May 2017 Morning Oral Sessions

09:00  Room Brüssel 1 Conference Opening and Award Ceremony

09:45  Room Brüssel 1 KEYNOTE:Long Distance Charging Solutions for BEVs: from now to 2030, Robert Lassartesses, Renault,F

10:30  Coffee Break

Room Brüssel 1

Room Brüssel 2

Room München 1

Room München 2

Room Mailand

HV-SiC-MOSFET

Power Converters with Wide Bandgap Devices I

Materials

Sensorless Drives

Modular Multilevel Converter for High Voltage Applications

Chairperson: Gourab Majumdar, Mitsubishi Electric Corporation, J 11:00 3.3 kV/450 A Full-SiC nHPD2 (next High Power Density Dual) with Smooth Switching Takashi Ishigaki, Seiichi Hayakawa, Tatunori Murata, Tetsuo Oda, Yuji Takayanagi, Renichi Yamada, Hitachi Power Semiconductor Device, J; Toru Masuda, Naoki Tega, Akio Shima, Hitachi, J; Katsuaki Saito, Hitachi Europe, GB 11:30 Characterization of 3.3kV and 6.5kV SiC MOSFETs Takui Sakaguchi, Masatoshi Aketa, Takashi Nakamura, ROHM, J; Masaharu Nakanishi, ROHM Semiconductor, D; Munaf Rahimo, ABB Switzerland, CH 12:00 Dynamic Characterization of Next Generation Medium Voltage (3.3 kV, 10 kV) Silicon Carbide Power Modules Ty McNutt, Jonathan Hayes, Lauren Kegley, William A. Curbow, Daniel Martin, Brett Sparkman, Wolfspeed, USA 12:30 3.3kV All-SiC Power Module for Traction System Use Tetsu Negishi, Ryo Tsuda, Kenji Ota, Shinichi Iura, Hiroshi Yamaguchi, Mitsubishi Electric Corporation, J; Eckhard Thal, Mitsubishi Electric Europe, D

Chairperson: Francisco Azcondo, University of Cantabria, ES

Chairperson: Nando Kaminski, University of Bremen, D

11:00 Two-Switch Quasi-Resonant Flyback Converter with SiC Switches Stefan Schmitt, Watts & Bytes, F; Jens Marten, BLOCK Transformatoren, D

11:00 Reliable Interconnection Technologies for High-Temperature Operation of SiC MOSFETs Fabian Mohn, Chunlei Liu, Jürgen Schuderer, ABB Switzerland, CH

11:30 Characterization of 1.7 kV SiC MOSFET Modules for Medium/High Power Current Source Inverter in Photovoltaic Applications Luis Gabriel Alves Rodrigues, Jérémy Martin, Stéphane Catellani, Commissariat à l´Énergie Atomique et aux Énergies Alternatives, F; Jean-Paul Ferrieux, G2Elab, F

11:30 Sintering Copper Die-Bonding Paste Curable Under Pressureless Conditions Hideo Nakako, Dai Ishikawa, Chie Sugama, Yuki Kawana, Motohiro Negishi, Yoshinori Ejiri Hitachi Chemical, J

12:00 Power Loss Evaluation of 2.5 MHz High Frequency Inverter Based on Frequency Multiplying Method Koji Orikawa, Satoshi Ogasawara, Hokkaido University, J; Jun-ichi Itoh, Nagaoka University of Technology, J 12:30 Gate Driver Architectures for High Speed Power Devices in Series Connection Jean-Christophe Crebier, Van-Sang Nguyen, Pierre LeFranc, G2Elab, F

12:00 Taking Power Semiconductors to the Next Level: Novel Plug & Play High Thermal Performance Insulated Christian Kasztelan, Thomas Basler, Infineon Technologies, D 12:30 Development of Thermal Fatigue-Tolerant Active Metal Brazing Substrates Using Highly-Thermal Conductive Silicon Nitrides with High Toughness Hiroyuki Miyazaki, You Zhou, Kiyoshi Hirao, Shinji Fukuda, Noriya Izu, Hideki Hyuga, National Institute of Advanced Industrial Science and Technology (AIST), J; Shoji Iwakiri, Hideki Hirotsuru, Denka Company Limited, J

12:30 – 14:00  Lunch Break

Award nominee. More information on page 19.

Chairperson: Manfred Schrödl, Vienna U niversity of Technology, AT 11:00 Initial Rotor Position Determination of a Soft Starter Driven Synchronous Motor Hauke Nannen, Heiko Zatocil, Siemens, D 11:30 A Robust Encoderless Predictive Current Control Using Novel MRAS Observer for Surface-Mounted Permanent-Magnet Synchronous Generators Mohamed Abdelrahem, Christoph Hackl, Ralph Kennel, Technical University of Munich, D 12:00 FPGA–based Sensorless Control of a PMSM at Low– Speed Range Fernando David Ramirez Figueroa, Mario Pacas, University of Siegen, D; Cesar Gonzalez, Tecnologico de Monterrey, MX 12:30 Application of a Position Sensorless Control to a Reluctance Synchronous Drive Including Flux Weakening Matthias Hofer, Manfred Schrödl, Vienna University of Technology, AT

Chairperson: Drazen Dujic, Power Electronics Laboratory, EPFL, CH 11:00 Four-Level MMC Cell Type with DC Fault Blocking Capability for HVDC Viktor Hofmann, Mark M. Bakran, University of Bayreuth, D 11:30 Virtual Submodule Concept Applied to the Modular Multilevel Converter Alexandre Christe, Drazen Dujic, EPFL - Ecole polytechnique fédérale de Lausanne, CH 12:00 IGCT based Modular Multilevel Converter for an AC-AC Rail Power Supply David Weiss, Michail Vasiladiotis, Noemi Drack, ABB Switzerland, CH; Andrea Grondona, ABB, SE 12:30 Development of A Full-Bridge Sub-Module for HVDC and STATCOM Markets Jerome Perrier, GE’s Grid Solutions, GB; Tianning Xu, Alstom Grid, GB

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Conference Tuesday, 16 May 2017 Afternoon Oral Sessions

Room Brüssel 1

Room Brüssel 2

Room München 1

Room München 2

Room Mailand

SiC MOSFET

Power Converter Design

Current Sensors

New and Renewable Energy Systems

S PE CI AL S E S S I ON : Smart Grid & Communication

Chairperson: Andreas Lindemann, Otto-von-Guericke-University Magdeburg, D 14:00 The new CoolSiC™ Trench MOSFET Technology for Low Gate Oxide Stress and High Performance Dethard Peters, Thomas Basler, Bernd Zippelius, Infineon Technologies, D 14:30 Short-Circuit Robustness of Discrete Silicon Carbide MOSFETs in Half-Bridge Configuration Nicolas Degrenne, Anthony Roy, Johan Le Lesle, Erwan David, Stefan Mollov, Mitsubishi Electric, F 15:00 Design Rules To Adapt The Desaturation Detection For SiC MOSFET Modules Teresa Bertelshofer, Andreas März, Mark-M. Bakran, University of Bayreuth, D

Chairperson: Stéphane Lefebvre, SATIE, F 14:00 Enhancing Power Density and Efficiency of Variable Speed Drives with 1200V SiC-TMOSFETs Benjamin Sahan, Anastasia Brodt, Daniel Heer, Ulrich Schwarzer, Maximilian Slawinski, Tim Villbusch, Klaus Vogel, Infineon Technologies, D 14:30 Air Cooled SiC Three Level Inverter with High Power Density for Industrial Applications Alexander Hensler, Thomas Bigl, Stephan Neugebauer, Stefan Pfefferlein, Siemens, D 15:00 Generic Approach for Design, Configuration and Control of Modular Converters Lyubomir Kerachev, CMP, F; Yves Lembeye, Jean-Christophe Crebier, G2Elab, F

15:30 Device Simulation Modeling of 1200 V SiC MOSFETs Benedetto Buono, Martin Domeij, Kwangwon Lee, Krister Gumaelius, Jimmy Franchi, Fredrik Allerstam, Fairchild Semiconductor, SE ; James Victory, Mehrdad Baghaie Yazdi, Thomas Neyer, Fairchild Semiconductor, D

15:30  Coffee Break

15:30 – 17:30  Foyer Ground Floor Entrance NCC Mitte Poster/Dialogue Session

Award nominee. More information on page 19.

Chairperson: Bernhard Strzalkowski, Analog Devices, D 14:00 IGBT Gate Driver with Accurate Measurement of Junction Temperature and Inverter Output Current Marco Denk, Mark-M. Bakran, University of Bayreuth, D 14:30 An Inverted Rogowski Coil: A High Speed, Wide-Band, Compact Current Transducer With High Immunity to Voltage Transients Chris Hewson, Pemuk, GB 15:00 Design of a 300 Amps Pulsed Current Source with Slopes up to 27 Amps per Nanosecond for Current Probe Analysis Nathan Tröster, Dennis Bura, Julian Wölfle, Martin Stempfle, Jörg Roth-Stielow, University of Stuttgart, D

Chairperson: Friedrich-Wilhelm Fuchs, Christian-Albrechts-University of Kiel, D

Chairperson: Jean-Paul Beaudet, Schneider Electric, F

14:00 A 70 kW Next Generation Three-phase Solar Inverter with Multiple MPPTs using Advanced Cooling Concept and Stacked-PCB Architecture Remi Freiche, Sebastian Franz, Stephan Liese, Marc Fink, Fraunhofer Institute ISE, D

14:00 A New Configuration for a Grid Former Converter in AC Isolated Microgrid Hélio Antunes, Sidelmo Silva, Braz Filho, Reginaldo Ferreira, Danilo Iglesias Brandão, Federal University of Minas Gerais, BR

14:30 Enhanced Current Control Scheme for Large-Scale Solar Inverters Tomomichi Ito, Hitachi, J

14:30 Design and Control of a DC Grid for Railway Stations Sabah Siad, Gilney Damm, Paris Saclay University, F; Lilia Galai Dol, Alexandre de Bernardinis, EFFICACITY, F

15:00 Improved Bias Supply Scheme for a Maximum Power Point Tracking Universal Topology for Low-Voltage Electromagnetic Harvesters in Battery Powered Applications Mahmoud Shousha, Dragan Dinulovic, Martin Haug, Würth Elektronik eiSos, D

15:00 Distributed Nonlinear Control for a MicroGrid Embedding Renewables, Train’s Energy Recovery System and Storages Alessio Iovine, Lilia Galai Dol, EFFICACITY, F; Elena De Santis, Marika Di Benedetto, L’Aquila University, I;; Gilney Damm, Paris Saclay University, F 15:30 Reliability Enhancement of Modular Smart Transformers by Uneven Loading of Cells Vivek Raveendran, Markus Andresen, Levy Ferreira Costa, Giampaolo Buticchi, Marco Liserre, University of Kiel, D

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Conference  Tuesday, 16 May 2017, Poster Dialogue Sessions 15:30 – 17:30, Foyer Ground Floor Entrance NCC Mitte Advanced Si Power Semiconductors

Wide Bandgap Devices I

Chairperson: Stefan Linder,Alpiq, CH PP001 A Scaled PIN Diode SPICE Model for Power System Optimization Mehrdad Baghaie Yazdi, James Victory, Kangwei Mao, Fairchild Semiconductor, D; Dongsoo Kim, Fairchild Korea, ROK PP002

Diode Parameters Design Simulation and Experi mental Validation against Silver Migration Phenomena in High Voltage Switching Application Mattia Gianfranco Gentile, Ettore Vittone, University of Turin, I; Paolo Mirone, University of Naples Federico II, I; Luigi Merlin, Vishay Intertechnology, I

PP003  Reliability Improving of Power Semiconductor Discharge Switch by Means of LTJT Technology Alexey Grishanin, Valentin A. Martynenko, Alexey Khapugin, Mikhail Malygin, Oleg Frolov, JSC Electrovipryamitel, RU; Konstantin Nishchev, Mikhail Novopoltsev, Ogarev Mordovia State University, RU PP004  New Generation Large Area Thyristor for UHVDC Transmission Jan Vobecky, Karlheinz Stiegler, Marco Bellini, Urban Meier, ABB Switzerland, CH PP005 The Next Generation 4500V / 3000A BIGT Stakpak Modules Franc Dugal, Andreas Baschnagel, Munaf Rahimo, Ar nost Kopta, ABB Switzerland, CH PP006 T he New ST Super-Junction Technology with Fast Intrinsic Diode Ideal for the Most Demanding High Efficiency Bridge Topologies and ZVS Phase-Shift Converters- Comparison Analysis in 2kW AC-DC Switch Mode Power Supply Antonino Gaito, Alfio Scuto, Cristiano Gianluca Stella, Giuseppe Sorrentino, STMicroelectronics, I PP007 L ow Voltage AC/DC Over-Current Breaker with 650-V IGBTs Jan Fuhrmann, David Hammes, Hans-Günter Eckel, University of Rostock, D PP008  An Advanced Si-IGBT Chip for Delivering Maximum Overall System Performance Narender Lakshmanan, Thomas Radke, Mitsubishi Electric Europe, D PP009 High Energy Harvesting in High Current/Voltage Induction Heating Application Using the new Ultra Filed Stop IGBTs Technology Vittorio Crisafulli, ON Semiconductor, D; Leon Zhang, ON Semiconductor, CN An Automated Testbench for the Measurement of PP010  Si-IGBT and SiC-MOSFET Hybrid Switches Michael Meissner, Sebastian Fahlbusch, Klaus F. Hoffmann, Helmut Schmidt University- University of the Federal Armed Forces Hamburg, D PP011  New-Generation Trench Schottky Rectifiers (TSR) with Superior Electrical Performance Ju-Hsu Chuang, Wesley Chih-Wei Hsu, Jia-Jan Guo, Yu-Hung Chang, Sung-Yin Wu, Lite-on Semiconductor, TW, D

Power Modules

Chairperson: Thomas Neyer, Fairchild Semiconductor, D PP012

Measurement Scheme to Model an SiC MOSFET for Simulating its Switching Behaviors Tatsuya Yanagi, Hiroyuki Sakairi, Hirotaka Otake, Naotaka Kuroda, Ken Nakahara, ROHM, J; Hiroaki Tanigawa, Keysight Technologies, J

PP013 A Performance Comparison of SiC Power Modules with Schottky and Body Diodes Christopher Schmidt, Martin Röblitz, SEMIKRON Elektronik, D PP014 Comparison between 1200V 5th generation SiC MPS Diode and Silicon Power Diode in DC/AC Hybrid Circuit Breaker Kenan Askan, Michael Bartonek, Eaton Industries, AT; Fabio Brucchi, Infineon Technologies, PP015 Impact of Dynamic On-Resistance of High Voltage GaN Switches on the Overall Conduction Losses Eduardo de Oliveira, Christian Nöding, Peter Zacharias, University of Kassel, D PP016 Calorimetric Measurement of Wide Bandgap Semiconductors Switching Losses Sven Bolte, Norbert Fröhleke, Joachim Böcker, Univer  sity of Paderborn, D PP017 System Level Comparison of Si IGBTs and SiC MOSFETs Levi Gant, Sujit Banerjee, Xuning Zhang, Gin Sheh, Monolith Semiconductor, USA; Andrew Lemmon, Ali Shahabi, The University of Alabama, USA PP018 Comparison of the Short Circuit Capability of Planar and Trench SiC MOSFETs Douglas Pappis, Lucas de Menezes, Peter Zacharias,  University of Kassel, D PP019 Characterization and Optimization of SiC Freewheeling Diode for Switching Losses Minimization Over Wide Temperature Range Xuning Zhang, Levi Gant, Gin Sheh, Sujit Banerjee, Monolith Semiconductor, USA PP020

Chairperson: Hans Ertl, Vienna University of Technology, A PP024 A Power Cycling Test Bench Dedicated to the Test of Power Modules in a Large Range of Cycling Frequency Jean-Jacques Huselstein, Francois Forest, Guillaume Pellecuer, University of Montpellier, F; Serge Bontemps, Microsemi PMP, F PP025 Resin Flow Simulation for Transfer Molding Technology Ken Sakamoto, Yutaro Hanawa, Mitsubishi Electric Corporation, J PP026 Development of High Thermal Performance Automotive Power Modules with Dual Sided Cooling Capability Yangang Wang, Steve Jones, Xiaoping Dai, Dynex Semiconductor, GB PP027 Intelligent Power Modules with Common Footprint for Both Single-Phase and Three-Phase AC Input Power Jonathan Harper, ON Semiconductor, D

PP022 Dual On-State Gate Driver Concept for Improved Drive of Silicon Carbide MOSFETs Sebastian Fahlbusch, Fabian Fisahn, Michael Meissner, Ulf Müter, Sebastian Klötzer, Klaus F. Hoffmann, Helmut Schmidt University- University of the Federal Armed Forces Hamburg, D PP023 High Speed, Thermally Enhanced, Small Footprint SiC Power Modules for Cost Sensitive Applications Adam Barkley, Scott Alan, Marcelo Schupbach, Wolfspeed, USA

PP037 Two-Phase Liquid Cooling for Electric Vehicle IGBT Power Module Thermal Management Itxaso Aranzabal, Inigo Martinez de Alegria, Inigo Kortabarria, University of the Basque Country (UPV/ EHU), ES; Nicola Delmonte, Paolo Cova, University of Parma, I PP038 Evaluation of Leadframe Power Modules for Automotive Drive Applications Bao Ngoc An, Maurizio Kempf, Michael Meisser, Benjamin Leyrer, Thomas Blank, Marc Weber, Karlsruhe Institute of Technology (KIT), D; Johannes Kolb, Schaeffler Technologies, D PP039 Exploring Novel Second Level Cooling Methods for Low Profile IPMs Khatri Danish, Rajeev Krishna Vytla, Okawa Katsumi, Jin Pei, Infineon Technologies Americas, USA

Reliability

PP029 Paralleling of LinPak Power Modules Andreas Baschnagel, Daniel Prindle, Silvan Geissmann, Fabian Fischer, Samuel Hartmann, Raffael Schnell, Gontran Pâques, Arnost Kopta, ABB Switzerland, CH PP030 A New Generation of 600V Smart Power Module for Motor Drive Applications Bumseung Jin, Samuell Shin, HyunSoo Bae, Taesung Kwon, Fairchild Korea Semiconductor, ROK PP031 Super Mini DIPIPM for Automobile Naoki Ikeda, Hiroyuki Hata, Hongbo Zhang, Mitsubishi Electric Corporation, J

Cooling Systems

Chairperson: Serge Bontemps, Microsemi PMP Europe, F PP040 Inverter Power Module Lifetime Estimation for HEV and EV JeHwan Lee, HanGeun Jang, SangChul Shin, KiYoung Jang, JinHwan Jung, Hyundai Motors, ROK PP041 The Enhanced Reliability of the Double Sided Cooled Package with Integrated Internal Isolation Inpil Yoo, Marina Schmitz, Infineon Technologies, D PP042 Determination of State-of-Health and Remaining Lifetime of Power Modules Jörg Franke, Christian Herold, Josef Lutz, Lukas Tinschert, Technical University Chemnitz, D PP043 Shoot Through and Avalanche Behavior of High Speed Fet Converter Florian Kapaun, Rainer Marquardt, Christopher Dahmen, University of the Federal Armed Forces Munich, D

Chairperson: Masahito Otsuki, Fuji Electric, J PP032

Thermal Characterization Analysis of IGBT Power Module Integrated with a Vapour Chamber and Pin- Fin Heat Sink Yiyi Chen, Bo Li, Yuying Yan, University of Nottingham, GB; Fang Qi, Yangang Wang, Steve Jones, Dynex Semiconductor, GB

PP033 Silicone-Based Enablers for Thermal Management in Power Electronics Thomas Seldrum, Dow Corning Europe, BE PP034 Innovative Design in IGBT Cold Plate Chihwei Wei, Kevin Wu, Larry Lin, Amulaire Thermal Technology, TW PP035 Reliability of the Direct Cooling Type Cold Plate with Ni Clad Layer Kazuhiko Minami, Atsushi Otaki, Ichiro Ota, Showa Denko, J

Thermal Management and Packaging I

PP044 Reliability Investigation of SiC Based Diode and MOSFET Modules Developed for High Power Conversion Alexander Otto, Rainer Dudek, Sven Rzepka, Fraun hofer-Institute ENAS, D; Mohamad Abo Ras, Tobias von Essen, Berliner Nanotest & Design, D; Markus Bast, FuE-Zentrum FH Kiel, D; Ulf Müter, Helmut Schmidt University, D; Arne Lunding, Philips Medical Systems, D PP045 Mission Profile Based Reliability Evaluation of Building Blocks for Modular Power Converters Frederik Hahn, Markus Andresen, Giampaolo Buticchi, Marco Liserre, Christian-Albrechts-University, D PP046 Thermal Calculation Methodology for Lifetime Estimation of Semiconductor Devices in MMC Application Yijun Yijun Ye, Josef Lutz, Guang Zeng, Technical University of Chemnitz, D; Rodrigo Alvarez, Pablo Correa, Siemens, D

DC-DC Converters

Chairperson: J. A. Ferreira, Delft University of Technology, NL PP047 In-Situ Transient Testing of Run-in and Degrad tion Effects of Thermal Interface Sheets in Power Switch Assemblies Gabor Farkas, Zoltan Sarkany, Attila Szel, Mentor Graphics, HU PP048

Material Design and Process Conditions of Presureless Sintered Silver for 200/-40 ºC Thermal Cycling Reliability Masafumi Takesue, Tomofumi Watanabe, Naoya Nakajima, Bando Chemical Industries, J

PP049 Performance Comparison of fast Silicon and Silicon Carbide Devices Used with Conventional PCBs and Embedded Into PCBs Peter Zacharias, Juliane Hinze, University of Kassel, D PP050 Power Electronic Package for Double Sided Cooling Utilizing Tile-Level Assembly Maximilian Schmid, Gordon Elger, Johannes Pforr, Technical University of Applied Sciences Ingolstadt, D

 ptimized Layout of 1700V LoPak1 IGBT Power ModPP028 O ule by Holistic Design Approach Sven Matthias, Samuel Hartmann, Athanasios Mesemanolis, Raffael Schnell, ABB Switzerland, CH

On Developing a dV/dt Rating for Commercial 650V- and 1200V-Rated SiC Schottky Diodes Thomas Barbieri, Gang-Yao Wang, Edward Van Brunt, Brett Hull, Jim Richmond, John Palmour, Wolfspeed, USA

SiC power MOSFET with Monolithically Integrated PP021  Schottky Barrier Diode for Improved Switching Performances Huaping Jiang, Xiaoping Dai, Maolong Ke, Dynex Semiconductor, GB

PP036 Testing, Selecting, and Applying Metallic Thermal Interface Materials for Harsh Environment Applications David Saums, DSA LLC, USA; Timothy Jensen, Indium Corporation, USA

PP051 Packaging Solutions for Mitigating IGBT Short Circuit Instabilities Paula Diaz Reigosa, Francesco Iannuzzo, Frede Blaabjerg, Aalborg University, DK PP052 Thermo-Mechanical Optimisation of Press Pack IGBT Packaging Using Finite Element Method Simulation Michael Varley, Ashley Plumpton, Dynex Semiconductor, GB PP053 Thermal Impedance Matrix Characterization of CoPacked Discrete IGBT and Diode Alberto Salinaro, Fairchild Semiconductor, D; Hans Peter Hoenes, ON Semiconductor, D PP054 The Influence of Y Doped ZrO2 Particles for High Strength AlN Ceramics Jong Seol Yoon, Ki Soo Jun, Kyong Hwan Kim, KCC Corporation, ROK PP055 HT Lead-free and Sinter Materials for WBG Power Semiconductors Minoru Ueshima, Tetsu Takemasa, Senju Metal Industry, J; Shijo Nagao, Katsuaki Suganuma, Osaka University, J PP056 Passive and Active Two-Phase Cooling for Power Electronics Applications Devin Pellicone, Advanced Cooling Technologies, USA PP057 Feasibility Study, Combining High-Power MOSFETs in a Power Module Using Advanced Thermal Management Martin Schulz, Maximilian Slawinski, Infineon Tech nologies, D

Chairperson: Werner Berns, Texas Instruments, D PP058 Hybrib Power Converter Using Si IGBT Power Module & SiC MOSFET Benoit Peron, Joseph Magniez, Centum Adetel, F PP059 Application of a Buck-Boost Converter for Highly Dynamic Power Smoothing in Industrial Applications Jochen Staiger, Swen Bosch, Heinrich Steinhart, HTW Aalen, D PP060 High Power Density GaN Interleaved Bidirectional Boost Converter with Extended Cooling Capability Konstantin Siebke, Thorben Schobre, Niklas Lang maack, Regine Mallwitz, Technical University Braun schweig, D PP061 Single-Ended Boost DC-DC Converter Cascade System for High Boost Rate and High Efficiency in Residential Fuel-Cell System Ryoga Kiguchi, Yasuyuki, Nishida, Chiba Institute of Technology, J PP062 An Isolated Bidirectional DC-DC Converter for Energy Storage Systems Mofakkharul Islam, Bebro Electronic, D PP063 Modeling of ZVS DC-DC Converter for Charging and Voltage Balancing of Energy Storage Elements Dimitar Arnaudov, Nikolay Hinov, George Kraev, Gergana Vacheva, Technical University of Sofia, BG PP064 Modeling of Multiphase Converter for Charging of Energy Storage Elements Stoyan Vuchev, Dimitar Arnaudov, Nikolay Hinov, Ivan Nedyalkov, Technical University of Sofia, BG PP065

Advanced Power Converters for Energy Storage Systems for Light Traction Vehicles Miroslav Hruška, Skoda Electric, CZ; Martin Schulz, Infineon Technologies, D

PP066

Compact Diode-Less Bidirectional GaN Based Buck Converter for Mobile DC-DC Applications Sebastian Klötzer, Ulf Müter, Sebastian Fahlbusch, Klaus F. Hoffmann, Helmut Schmidt UniversityUniversity of the Federal Armed Forces Hamburg, D

PP067

High-Voltage Gain DC-DC Boost Converter with Interleaved Inductors for a PV System to Supply Data Centers Fernando Luiz Marcelo Antunes, Katiuscia Lopes dos Santos, Federal University of Ceara, BR

PP068 Seven Reasons why Power Designers Should Implement 48V to 1V Direct Conversion Bob Cantrell, Ericsson Power Modules, SE PP069

Inductor Current Mapping Analog Controllers for Power Inverters and DC/DC Converters Alexei Nikitin, Avatekh, USA; Ruslan L. Davidchack, University of Leicester, GB

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Conference  Tuesday, 16 May 2017, Poster Dialogue Sessions 15:30 – 17:30, Foyer Ground Floor Entrance NCC Mitte Power Converters for Efficiency and Renewable Energy

Chairperson: Mike Meinhardt, SMA Solar Technology, D PP070 Analysis of a Novel Buck-Buck Single Stage LED-Ballast Alexander Pawellek, Thomas Dürbaum, Friedrich-Alexander-University Erlangen, D PP071 Energy Efficient, GHz Excited Plasma Lighting System Kamil Kompa, Slawomir Niespodziany, KOMPA Sp. z o.o, PL PP072 Constant-Current Paralleling Controller fo Mid-Power LED Michael Heidinger, Christoph Simon, Fabian Denk, Wolfgang Heering, Rainer Kling, Karlsruhe Institute of Technology (KIT), D PP073 A Novel Mains Operated LED Driver Using a GaN AC Switch Dominique Bergogne, CEA-Léti, F PP074 Electronic Ballast for Gas Discharge Lamp Based on Input- Series Output- Series Resonant Converter Kaspars Kroics, Riga Technical University, LV PP075 Control Loop Design for Closed-Loop Class-D Amplifiers with 4th Order Output Filter Franz Maislinger, Hans Ertl, Technical University of Vienna, AT; Goran Stojcic, Florian Holzner, Bernecker + Rainer Industrie-Elektronik, AT PP076 Novel Gate Driver Technology for the Series Connection of Power Semiconductors Johannes Kemper, Hako, D; Boris Fiedler, Max Planck Institute for the Structure and Dynamics of Matter, D; Klaus F. Hoffmann, Helmut-Schmidt University, D PP077 Redundant Operation Mode of the Three-Level Advanced-Active-Neutral-Point-Clamped Converter for Wind Energy Application David Hammes, Sidney Gierschner, Hans-Günter Eckel, University of Rostock, D PP078 Implementation of Extended Kalman Filter for PMSG Considering the Dynamics of the Mechanical System Mohamed Abdelrahem, Christoph Hackl, Ralph Kennel, Technical University of Munich, D PP079 Evolution of Bidirectional Power Architectures David Bourner, Vicor Corporation, USA PP080 Modular and Compact 1 MW Inverter in One 19 Inch Rack for Storage and PV Patrick Hercegfi, Stefan Schönberger, Fraunhofer Institute ISE, D PP081 A New Step Towards the Power Electronics Design Automation Lyubomir Kerachev, CMP, F; Yves Lembeye, Jean Christophe Crebier, G2Elab, F

Passive Components and New Materials

Sensors, Metering, Diagnostics

Chairperson: Klaus Marahrens, SEW-EURODRIVE GmbH, D PP082

Comprehensive AC Performance Analysis of Ceramic Capacitors for DC Link usage Kirill Klein, Eckart Hoene, Klaus-Dieter Lang, Frauhofer-Institute IZM, D

PP083 High Performance DC Link Capacitor/Bus Sourcing Dual Infineon HybridPACKTM Drive Inverters for EV Applications Michael A. Brubaker, Terry Hosking, Wayne Liu, SBE, USA; Tomas Reiter, Infineon Technologies, D; Carsten Wüst, David Kuschnarew, hofer eds GmbH, D PP084 An Evaluation Circuits for DC-Link Capacitors Used in a Single-Phase PWM Inverter Kazunori Hasegawa, Ichiro Omura, Shin-ichi Nishizawa, Kyushu Institute of Technology / National Institute of AIST, J PP085 IGBT Switching Behavior With Parallel Surge Arrester For Medium Voltage Applictation Fabian Hohmann, Mark-M. Bakran, University of Bayreuth, D PP086 Using Powder Materials to Replace Air-Gaps for Fringing Flux Reduction Paul Winkler, Wulf Günther, Acal BFi Germany, D

Chairperson: Philip C. Kjaer, Vestas Wind Systems, DK PP093  Current Measurement Device for High and Fast Changing Currents Felix Himmelstoss, Karl Edelmoser, Technikum Vienna, AT PP094 Measurement of Current and Magnetic Field in a Power Electronic Building Block using Coupled Inductors Patrick Deck, Christian Peter Dick, Jan Hannig, TH Köln, D PP095 Comparative Analysis of the Measurement Techniques to Characterize SiC-Power-Modules Zhiyu Cao, Christian Schulte-Overbeck, AEG Power Solutions, D PP096 An Open-Loop Hall-Cell Based Current Transducer with an Integrated Sigma-Delta Modulator Fabrice Salvi, David Jobling, Pierre Turpin, LEM Switzerland, CH PP097 Magnetoresistive Sensors for Angle, Position and Speed Measurement in Small-and Micro-actuators Rolf Slatter, Rene Buß, Sensitec, D

PP087 Partial Discharge of Inductives in a High Frequency Application Herbert Jungwirth, Michael Schmidhuber, SUMIDA Components Modules, D

PP098 Insulation Health State Monitoring of Traction Machines Based on Online Switching Transien Exploitation Markus A. Vogelsberger, Bombardier Transportation Austria, AT; Clemens Zoeller, Thomas M. Wolbank, Hans Ertl, Technical University of Vienna, AT

PP088 Design of Inductive Components for Triangular Current Mode (TCM) Inverters up to 500 kW Tobias Appel, Spezial-Transformatoren-Stockach, D; Jan Fuhrmann, Hans-Günter Eckel, University of Rostock, D

PP099 Comparison of Fundamental Active and Reactive Power Determination Methods in Single- Phase Systems Swen Bosch, Heinrich Steinhart, HTW Aalen, D

PP089 Study of the Influence of an Air Gap on Dimensional Resonance in MnZn-Ferrite Cores Wolfgang Hauser, Manfred Albach, Friedrich-Alexander-University Erlangen, D

PP100

PP090 A Novel Approach to Calculate the Reluctance of Air-Gaps in Ferrite Cores Erika Stenglein, Manfred Albach, Friedrich-Alexander-University Erlangen, D PP091

Inductive Components for Solar Power Conversion in a Harsh Next Decade Environment Michael Schmidhuber, SUMIDA Components Modules, D; Marco Jung, Fraunhofer Institute IWES, D

PP092

Systemsimulations with EMI-Filter in an Automotive HighVolt Environment Stefan Schefler, Stefan Weber, EPCOS, D; Christoph Keller, Robert Bosch, D

Practical Experience with EMI of Radio-Communication System Versus Power Electronics Based on the SiC Jan Leuchter, University of Defence, CZ

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Conference Wednesday, 17 May 2017 Morning Oral Sessions

08:45  Room Brüssel 1 KEYNOTE:The Smart Future of Power Electronics and its Applications, Hans Krattenmacher, SEW-Eurodrive, D

09:30  Coffee Break

Room Brüssel 1

Room Brüssel 2

Room München 1

Room München 2

Room Mailand

Power Converters with Wide Bandgap Devices II

IGBT

Module Design

Control Techniques in Intelligent Motion Systems

S PE CI AL S E S S I ON : Passive Components

Chairperson: Ulrich Kirchenberger, STMicroelectronics, D 10:00 800 V Three-Phase LLC Series Resonant DC/DC Converter Using SiC MOSFETs Yusuke Nakakohara, Hirotaka Otake, Ken Nakahara, ROHM, J; Tomohiko Yoshida, Mamoru Tsuruya, Power Assist Technology, J 10:30 The Destructive Energy Hidden in Supply Lines Roland Kratz, Würth Elektronik, D 11:00 Optimization of a DCDC Dual Active Bridge Converter for Aircraft Application Maximin Blanc, Yves Lembeye, Jean-Paul Ferrieux, G2Elab, F; Corentin Rizet, Sirepe, F; Arnaud Mahe, Taoufik Bensalah, Thales AES, F 11:30 Highly Integrated Silicon Carbide 80 kW Resonant Inverter for High Voltage Generation Switching at 500 kHz Ulf Müter, Klaus F. Hoffmann, Helmut Schmidt University - University of the Federal Armed Forces Hamburg, D; Arne Lunding, Bernhard Wagner, Philips Medical Systems, D

12:00 – 14:00  Lunch Break

Award nominee. More information on page 19.

Chairperson: Katsuaki Saito, Hitachi Europe, GB 10:00 Dual Side-Gate HiGT Breaking Through the Limitation of IGBT Loss Reduction Tomoyuki Miyoshi, Yujiro Takeuchi, Tomoyasu Furukawa, Masaki Shiraishi, and Mutsuhiro Mori, Hitachi, J 10:30 An Optimized Plug-In BIGT with No Requirements for Gate Control Adaptations Munaf Rahimo, Charalampos Papadopoulos, Chiara Corvasce, Arnost Kopta, ABB Switzerland, CH 11:00 Power Rating Extension with 7th Generation IGBT and Thermal Management by Newly Developed Package Technologies Kenichi Yoshida, Shinichi Yoshiwatari, Mutsumi Sawada, Yuichi Onozawa, Osamu Ikawa, Fuji Electric, J 11:30 The Next Generation High Power Modules with Enhanced Trench BIGT Technology Charalampos Papadopoulos, Munaf Rahimo, Chiara Corvasce, Maxi Andenna, Arnost Kopta, ABB Switzerland , CH 12:00 High Efficient and Soft IGBT Technology Suguru Hondo, Yu Enomoto, Yuta Kawamoto, Akihiro Hikasa, Kazuhide Ino, ROHM, J

Chairperson: Peter Kanschat, Infineon Technologies, D

Chairperson: Walter Schumacher,Braunschweig University of Technology, D

10:00 A New Intelligent IGBT Module for Quasi-Resonant Inverter Applications Bum-Seok Suh, Wonjin Cho, Alpha and Omega Semiconductor, ROK

10:00 Harmonic Speed Control in Repetitive Mechanical Systems Van Trang Phung, Mario Pacas, University of Siegen, D

10:30 Relaxing Thermal Stress by SLC Technology and New PC-TIM Koichi Masuda, Yoshitaka Otsubo, Tomohiro Hieda, Mitsubishi Electric Corporation, J

10:30 Hybrid Curent and Acceleration Control of Servo Drives Josef Wittmann, Rainer Hagl, University of Applied Sciences Rosenheim, D; Ralph Kennel, Technical University Munich, D

11:00 Lifetime Estimation Model of HVIGBT Considering Humidity Yumie Kitajima, Kenji Hatori, Shinichi Iura, Keiichi Nakamura, Yasutaka Kusakabe, Kazuhiro Kurachi, Mitsubishi Electric Corporation, J; Eugen Wiesner, Mitsubishi Electric, D

11:00 Analysis of Instantaneous Switching Frequency of a Hysteresis Based PWM for Control of Power Electronics Malte Thielmann, Axel Klein, Michael Homann, Walter Schumacher, Technical University of Braunschweig, D

11:30 Effects of Influencing the Individual Leg Inductance in Case of Paralleling Mo-dules on Basis of XHP 3 and EconoDUAL Matthias Wissen, Waleri Brekel, Daniel Domes, Infineon Technologies, D 12:00 Breakdown of Gate Oxide of SiC-MOSFETs and SiIGBTs Under High Temperature and High Gate Voltage Menia Beier-Möbius, Josef Lutz, Technical University of Chemnitz, D

11:30 Natural-Sampled, Quasi-Continuous and Synchronous Pulse Width Modulator Enables Field Oriented Control for High Speed Drives Jens Onno Krah, Markus Höltgen, Technical University Cologne, D; Christoph Klarenbach, Beckhoff Automation, D

Chairperson: Petar J. Grbovic, Huawei Technologies, D and Wolfram Teppan, LEM Intellectual Property SA, CH 10:00 Estimating the Pulse Performance of Wirewound Power Resistors Bertram Schott, Vishay Electronic, D 10:30 Inductance versus DC Current Measurements on the Anhysteresis of Magnetic Material Jörn Schliewe, Stefan Schefler, Stefan Weber, Matthias Köppen, Achim Siersch, EPCOS, D 11:00 Experimental Evaluation of Capacitors for High Power Resonant Converters Petar J. Grbovic, Huawei Technologies, D; Miroslav Vasić, Jesús A. Oliver, Pedro Alou, Jose A. Cobos, University of Madrid, ES 11:30 Medium Frequency Transformer Design and Optimization Marko Mogorovic, Drazen Dujic, École Polytechnique Fédérale de Lausanne, CH

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Conference Wednesday, 17 May 2017 Afternoon Oral Sessions

Room Brüssel 1

Room Brüssel 2

Room München 1

Room München 2

Room Mailand

SiC-Systems

Power Electronics Optimization

Cooling Thermal Management

Metering and Diagnostics and Standards

Passive Components and New Materials

Chairperson: Peter Steimer, ABB Switzerland, CH 14:00 A Novel Gate Drive Concept to Eliminate Parasitic Turn-on of SiC MOSFET in Low Inductance Power Modules Andreas März, Teresa Bertelshofer, Mark-M. Bakran, University of Bayreuth, D; Martin Helsper, Siemens, D 14:30 Evaluation of Current Measurement Accuracy for a Power Module with Integrated Shunt Resistors Matthias Spang, Niklas Hofstoetter, SEMIKRON Elektronik, D 15:00 Optical Power Isolation Enables Novel IGBT and Sensor Applications Jan-Gustav Werthen, Mort Cohen, L2W Energy, USA

15:30  Coffee Break

15:30 – 17:30  Foyer Poster/Dialogue Session

Award nominee. More information on page 19.

Chairperson: Mark M. Bakran, University of Bayreuth, D 14:00 Development of a High Efficient MPPT for Space Applications Using GaN Power Transistors Cornelius Armbruster, Christian Schöner, Fraunhofer Institute ISE, D; Torben Schönbett, Alfons Klönne, Rainer Merz, University of Applied Sciences Karlsruhe, D 14:30 Parasitic Inductance Analysis of a Fast Switching 100 kW Full SiC Inverter Matthias Kegeleers, Julian Körner, Stefan Matlok, Maximilian Hofmann, Martin März, Fraunhofer Institute IISB, D 15:00 Design Method for the Minimization of CM Inductor Volume with Consideration of Core Saturation in EMI Filters Bilel Zaidi, Arnaud Videt, Nadir Idir, University of Lille (L2EP), F

Chairperson: Josef Lutz, Chemnitz University of Technology, D 14:00 Temperature Swing Issue, How a Passive Two-Phase Cooling Loop Can Improve the Power Electronic Lifetime Vincent Dupont, Cyrille Billet, Thomas Nicolle, CALYOS, BE 14:30 Real-Time Junction Temperature Estimation of Multichip Power Module Used in a Motor Drive Merouane Ouhab, Radoslava Mitova, Miao-Xin Wang, Schneider Electric, F; Zoubir Khatir, Ali Ibrahim, Jean-Pierre Ousten, IFSTTAR, F 15:00 A Double Side Cooled Electronic Power Module Jacques Favre, APSI3D, F; Jean-Michel Reynes, IRT Saint Exupery, F; Jean-Pierre Fradin, Claudia Cadile, Sébastien Sanchez, Dominique Elzo, ICAM, F; Emmanuel Marcault, CEA Tech, F

Chairperson: Enrique J. Dede, University of Valencia, E 14:00 Monitoring of Current Balance in Parallel-connected Power Converters Lorenzo Giuntini, GE Consumer & Industrial, CH 14:30 Online IGBT Temperature Measurement Method Using a Greybox Model Georg Pangalos, Malte Päsler, Holger Kapels, Fraunhofer Institute ISIT, D 15:00 Impact of Temperature Imbalance on Junction Temperature Identification for Multiple Chip Modules Using TSEPs Jose Ortiz Gonzalez, Olayiwola Alatise, Li Ran, Philip Mawby, University of Warwick, GB

Chairperson: Eric Favre, IMI Precision Engineering, CH 14:00 Evolution of Magnetics in Power Electronics Applications and Facing the Challenges of Future Electronics Industry Kapila Warnakulasuriya, Andrea Polti, Murata Power Solutions, GB; Farhad Nabhani, Teesside University, GB 14:30 High Performance Common-Differential Mode Chokes for High Efficient EMI Filters Thiemo Kleeb, Juliane Hinze, Peter Zacharias, University of Kassel, D 15:00 Dimensioning and Testing Planar Inductors for High Frequency Operation Gérard Delette, CEA-Léti, F

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Conference  Wednesday, 17 May 2017, Poster Dialogue Sessions 15:30 – 17:30, Foyer Ground Floor Entrance NCC Mitte Wide Bandgap Devices II

Chairperson: Chris Rexer, ON Semiconductor, USA PP101 Short Circuit Capability of 650 V Normally Off GaN E-HEMT and MOSFET-HEMT Cascode Douglas Pappis, Kevin Göbel, Peter Zacharias, Univer sity of Kassel, D PP102

Advantages Using 650V SiC MOSFET in High Frequency DC-DC Converter Antonino Gaito, Giuseppe Sorrentino, STMicroelectronics, I

PP103  Cross Conduction of GaN HFETs in Half-Bridge Converters Jan Böcker, Carsten Kuring, Sibylle Dieckerhoff, Tech nical University Berlin, D; Oliver Hilt, Joachim Würfl, FBH Ferdinand-Braun-Institute Berlin, D PP104  Design Rules for Paralleling of Silicon Carbide Power MOSFETs Salvatore La Mantia, STMicroelectronics Application, D; Luigi Abbatelli, Giuseppe Catalisano, Maurizio Melito, STMicroelectronics, I PP105 Influence of an Emitter Sense Pin on the Switching Behavior of SiC BJTs in Standard Discrete Housings Christian Bödeker, Melanie Adelmund, Nando Ka minski, University of Bremen, D; Ranbir Singh, GeneSiC Semiconductor, USA PP106

Designing Manufacturable and Reliable Printed Circuit Boards Employing Chip Scale eGaN® FETs Michael de Rooij, Alana Nakata, Efficient Power Conversion (EPC) Corporation, USA

PP107 I mpact of Circuit Carrier Technologies on MHz-switching of GaN Half-Bridge Circuits Norbert Seliger, Franz Stubenrauch, University of Applied Sciences Rosenheim, D; Christian Brendel, Dr. Johannes Heidenahain, D; Doris Schmitt-Landsiedel, Technical University of Munich, D

Thermal Management and Packaging II

Chairperson: Toshihisa Shimizu, Tokyo Metropolitan University, Japan PP108  MMC AlSiC as Alternative for Molybdenum in Power Press-Pack Semiconductor Design. Investigations of Electric Conductivity Properties of AlSiC Alexey Grishanin, Valentin A. Martynenko, Vyacheslav Eliseev, Anton Samoylov, JSC Electrovipryamitel, RU; Konstantin Nishchev, Mikhail Novopoltsev, Ogarev Mordovia State University, RU PP109

Sintered Ag Joints on Copper Lead Frame TO220 by Pressure Sintering Process with Improved Reliability and Bonding Strength Ly May Chew, Wolfgang Schmitt, Jens Nachreiner, Heraeus Deutschland, D

PP110  A New Alternative Non-Pressure Silver Sinter Process by Using IR Wolfgang Schmitt, Ly May Chew, Heraeus Germany, D PP111  High Reliability Large Area Substrate Solder Interconnect with Embedded Mesh Technique James Booth, Kim Evans, Xiaoping Dai, Michael Varley, Dynex Semiconductor, GB; Karthik Vijay, Indium Corporation, GB PP112

Transient Current Distribution with Paralleling Dies and Paralleling Half Bridges in Multichip Power Modules Measurement Scheme to Model an SiC MOSFET for Simulating its Switching Behaviors Helong Li, Wei Zhou, Daohui Li, Steve Jones, Xiaoping Dai, Dynex Semiconductor, GB

PP113 Influence of the Power Semiconductor Packaging on the Failure Characteristic for Safety-Critical Applications Michael Gleißner, Mark-M. Bakran, University of Bayreuth, D; Hussein Khalid, Mitsubishi Electric Europe, D PP114 Double Side Sintered IGBT 650V/200A in a TO-247 Package for Extreme Performance and Reliability Francois LeHenaff, Alpha Metals Lötsysteme, D; Gus tavo Greca, Paul Salerno, Monnir Boureghda, Alpha Assembly Solutions, USA; Anna Lifton, Apha, NL; Jean Claude Harel, Renesas Electronics, USA; Weikun He, Mentor Graphics, GB

PP122 Sensorless Control of a Bridgeless PFC Using a Low Pass Filter Model and a Linear PR Controller Francisco Azcondo, Felipe López, Alberto Pigazo, Paula Lamo, University of Cantabria, ES PP123 Optimised Modulation of Five-Phase Open-End Winding Drive Ivan Zoric, Martin Jones, Liverpool John Moores Univer sity, GB; Milan Darijevic, Siemens AG, D PP124 Characterizing the Conducted EMI Performance of a Power Module Through Passive Measurement Yu Liu, Infineon Technologies, D; Sergey Kochetov, BMW, D; Thomas Smazinka, Fraunhofer Institute IISB, D; Andreas Lindemann, Otto-von-Guericke-University, D PP125 A New Approach for Digital Controlled Power Supplies Regarding Pulsed Plasma Nitriding Systems Lisa Franke, Lutz Zacharias, Mirko Bodach, Ringo Lehmann, Westsächsische Hochschule Zwickau, D; Andreas Böhm, Plasmanitriertechnik Dr. Böhm, D

Chairperson: Manfred Schlenk, Infineon Technologies, D PP126

PP115 Reactive Power Operation of a Single Phase AC-AC DAB Converter  Martin Jagau, Michael Patt, Technologienetzwerk Allgäu, D PP116 Use of FPGAs to Develop Energy-Saving DC-DC Control Ben Jeppesen, Intel FPGA, GB; Ge Gao, Imperial Col lege London, GB PP117 Comparison of Three Model Based Junction Temperature Control Systems to Increase the Lifetime of IGBT-Power- Modules Maximilian Nitzsche, Julian Wölfle, Nathan Tröster, Mar  tin Stempfle, Jörg Roth-Stielow, University of Stuttgart, D PP118 A New Modulation Technique to Control the Switching Losses for Single Phase Three-Level Active-Neutral-Point-Clamped-Inverters Johannes Ruthardt, Julian Wölfle, Matthias Zehelein, Jörg Roth-Stielow, University of Stuttgart, D PP119

Comparison of FPGA Based Control Strategies (DDSRF-PI vs. State-Space Control) for Grid Connected Inverters under Grid Disturbances Emanuel Mittwede, Johannes Kern, Stefan Schönberger, Benjamin Stickan, Fraunhofer Institute ISE, D

PP120 STNRGPF01: A New Driver for Interleaved PFC Based on Mixed Signal Control Sebastiano Messina, Marco Torrisi STMicroelectronics, I PP121 Quasi-Constant Frequency Secondary Side Con trolled Flyback Concept with Variable ON-Time Alexander Connaughton, Graz University of Technology, AT; Arash Pake Talei, Kin Kennith Leong, Infineon Technologies Austria AG, AT

PP136

Combination of Forward-Voltage Measurement and Short-Circuit Detection for High-Voltage IGBTs Patrick Münster, Daniel Lexow, Hans-Günter Eckel, University of Rostock, D

 ate Driver IC for GaN GIT for High Slew Rate and PP127 G Cross Conduction Protection Aaron Qingwei Cai, Arnel Carrera Herreria, Howard Ban How Sin, Panasonic Industrial Devices Semiconductor Asia, SG; Liter Siek, Nanyang Technological University, SG PP128 Gate Drivers For Medium Voltage Applications Pierre Lefranc, Sokchea Am, Benoit Sarrazin, Rachelle Hanna, David Frey, G2Elab, F PP129 Diode Effects Bring Liefetime Risks to Series Resistors Wolfgang Frank, Infineon Technologies, D PP130 FPGA Based Control of an Three Level Neutral Point Clamped Inverter Markus Schaefer, Martin Hofmann, Sebastian Raab, Ansgar Ackva, University of Applied Sciences Wuerz burg-Schweinfurt, D PP131

Investigation of Magnetical Coupler Immunity Against External High Frequency and Density Magnetic Field Bernhard Strzalkowski, Analog Devices, D

PP132 1000 V/80 W Auxiliary Power Supply as a Demonstration Vehicle for Wide Bandgap Power Electronics System Design Mehrdad Baghaie Yazdi, Xiaomin Wu, Peter Haaf, Klaus Neumaier, Fairchild Semiconductor, D; Martin Domeij, Fairchild Semiconductor, SE PP133

Ultra Linear Switching Rectifiers (ULSRs) for HighQuality Regulated 3-Phase AC to DC Conversion Alexei Nikitin, Avatekh, USA; Arlie Stonestreet II, Ultra Electronics ICE, USA

PP134 Start-Up Operation of Active Three-Phase Third Harmonic Injection Rectifiers Markus Makoschitz, AIT Austrian Institute of Tech nology, AT; Michael Hartmann, Schneider Electric, AT; Hans Ertl, Vienna University of Technology, AT

Which Should Be Chosen in Three-Phase Diode Rectifier, Single-Bridge or Double-Bridge? Ryu Kawakubo, Yasuyuki Nishida, Chiba Institute of Technology, J

PP137 Digital Control of Active Resistance Emulation in Three Phase Rectifiers with Current Injection Principle Radoš Vreljakovic, Predrag Pejovic, School of Electrical Engineering, RS; Milan Darijevic, Siemens, D

PP147 A Generalized Approach to the Analysis and Control of Modular Multilevel Converters Patrick Himmelmann, Marc Hiller, Karlsruhe Institute of Technology (KIT), D

PP161 Active Switch Impact on CCM Totem-Pole PFC Efficiency Matt OGrady, Ke Zhu, Jonathan Dodge, United Silicon Carbide, USA

PP148 On Energy Balancing for a Full-Bridge MMC with Distributed Energy Storage Devices Gerrit Henke, Mark-M. Bakran, University of Bayreuth, D

PP162 Dc Bus In Industry A New Way Towards Energy Efficiency Fernando Luiz Marcelo Antunes, Andre dos Santos Lima, Antonio Alisson Alencar Freitas, Aderaldo Racarte Guedes, Edilson Meneiro Sá Jr. Federal Univer sity of Ceara, BR

PP149 Comparison and Evaluation of Modular Multilevel Converter Topologies for Li-Ion Battery Systems Matthias Luh, Thomas Blank, Marc Weber, Karlsruhe Institute of Technology (KIT), D

Improved Efficiency Power Converters

Power Inverters

Power Supplies, Control and Drive

Control of Power Electronic Converters

Chairperson: Geraldo Nojima, Eaton Corporation, USA

PP135 State-of-the-Art GaN Power IC-based 150 W AC-DC Adapter Tom Ribarich, Stephen Oliver, Navitas Semiconductor, USA

PP139

Novel Active Ripple Filtering Schemes Used In Little Box Inverter Radoslava Mitova, Miao-Xin Wang, Schneider Electric, F; Rajesh Ghosh, Mudiyula Srikanth, Schneider Electric, IN; Damir Klikic, Schneider Electric, USA

PP140 Experimental Study of Si- and SiC-Based Voltage Source Klaus Sobe, Fabio Brucchi, Infineon Technologies Austria, AT

PP150 Progress of High Power Multilevel Converters: Combining Silicon And Silicon Carbide Christopher Dahmen, Rainer Marquardt, University of the Federal Armed Forces Munich, D PP151

Direct Torque Control with Variable Level Discretization for Automotive Drives Eduard Specht, Stefan Goetz, Christoph Aschauer, Christian Korte, Porsche Engineering Group, D

PP152 Analysis and Modeling of Efficiency Curve Dip in VRM with Low Output Inductance Ann Starks, Zhiyang Chen, ON Semiconductor, USA PP153 EMI Considerations on MHz Inverters Christoph Simon, Fabian Denk, Michael Heidinger, Karlsruhe Institute of Technology (KIT), D

PP141 Double-Loop Controlled Grid-Connected Inverter Yury Skorokhod, Dimitriy Nitkin, Sergey Dyakin, Transconverter, RU; Sergey Volskiy, Moscow State Aviation Institute Technical University, RU

PP154 Analysis of the Impact of Silicon Carbide Modules in Wind and Traction Applications Itziar Kortazar, David Ortega, Igor Larrazabal, Ingeteam, ES; Mrinal Das, Wolfspeed, USA

PP142 Design and Realization of a 100kHz-100kW Series Resonant Inverter with SiC-MOSFETs Connected in Parallel for a High Frequency Induction Heating Application Yildiray Baskurt, Dokuz Eylul Universitesi, TK

PP155 High Efficiency LLC Based AC-DC Converter for Wide Load Voltage Range Navid Daniali, Syed Inam Ul Murtaza Shah, Euro Engineering, D

PP143

AC-Sweep Analysis and Verification of an AC Power Source with Virtual Output Impedance for Validation of Grid Connected Components Peter Jonke, Markus Makoschitz, Johannes Stöckl, AIT Austrian Institute of Technology, AT; Hans Ertl, Vienna University of Technology, AT

PP156

A Novel Approach to Reduce Losses in Boost PFC Stage of a 90W-Adapter Eva Schmidt, Daniel Kübrich, Thomas Dürbaum, Friedrich-Alexander-University Erlangen, D

PP157 How the heck do I Measure a Gate Drive Slewing at 70kV/Us? Bart Schroder, Cleverscope, NZ

PP144 Technological Possibilities of New Silicon-Carbide Mosfets in Power-Inverter for the Inductive Energy Transfer Martin Warkentin, Faical Turki, Thomas Vosshagen, Paul Vahle, D

PP158 Thyristor Rectifier for Permanent Magnet Wind Generators Philip C. Kjaer, Ionut Trintis, Morten Risskov Knudsen, Stig Lund Pallesgaard, Vestas Wind systems A/S, DK; Peter Mongeau, Vestas Wind Systems, USA

PP145 Five-Level Cascaded Flying-Capacitor Converter Sidney Gierschner, David Hammes, Hans-Günter Eckel, University of Rostock, D; Max Beuermann, Siemens, D

PP159

Evaluation of an Isolated DC-DC Converter Naoki Koike, Shinichiro Nagai, Pony Electric, J; Hiroki Watanabe, Jun-ichi Itoh, Nagaoka University of Technology, J

PP160

STMicroelectronics’s Super-Junction and UltraFAST MOSFET vs IGBT Technologies in Low Power Motor Drives Carmelo Parisi, Gaetano Belverde, Alessio Corsaro, STMicroelectronics, I

PP146

Safe IGBT Turn Off In Three-Level Neutral Point Clamped Type 2 (NPC2) Topology During the Special Case of Short Circuit at 1000V DC Voltage Vladan Jerinic, Reiner Hinken, Danfoss Silicon Power, D; Kevin Lenz, Power Integrations, D

Chairperson: Martin März, Fraunhofer Institute IISB, D

Chairperson: Jacques Laeuffer, Dtalents, F

Chairperson: Silvio Colombi, General Electric, CH PP138 Noise Mitigation in HV Tests Sourced by A Static Frequency Converter by Means Of Changing PWM Signal’s Carrier Frequency Mazen Alzatari, Janusz Szczechowski, ABB, D

Automotive, Traction and Aerospace

PP163 The Highest Power Density IGBT Module in the World for xEV Power Train Akihiro Osawa, Keiichi Higuchi, Akio Kitamura, Daisuke Inoue, Yoshikazu Takamiya, Souichi Yoshida, Hiromichi Gohara, Masahito Otsuki, Fuji Electric, J PP164

J1-Series Modules with Integrated Cooler for Electric and Hybrid Vehicles Tatsuya Kawase, Shinsuke Godo, Noburu Miyamoto, Kazuaki Hiyama, Mikio Ishihara, Yosuke Nakata, Mitsubishi Electric Corporation, J

PP165 Power MOSFETs for Low Voltage and High Current Automotive Applications- 48V Bus Systems Rajagopalan Jagannathan, Marco Atzeri, Hans-Peter Hoenes, ON Semiconductor, D PP166 Electrothermal Stresses in SiC MOSFET and Si IGBT 3L-NPC Converters for Motor Drive Applications Zarina Davletzhanova, Olayiwola Alatise, Roozbeh Bonyadi, Sylvia Konaklieva, Jose Ortiz Gonzalez, Li Ran, Philip Mawby, University of Warwick, GB PP167 High Efficiency and Ruggedness Intelligent IGBT Technology for EV/HEV Vittorio Crisafulli, ON Semiconductor, D PP168 Highly Integrated Power Unit Based on Double Sided Cooling IGBT Module Vincent Li, William Zhu, Dynex Semiconductor, GB PP169 Efficiency Increasing by a Variable DC Link Voltage in Combination with a Bang-Bang Controlled Inverter for an Automotive Application Magnus Böh, Andreas Lohner, TH Köln, D PP170 Magnetic Leakage Field Pattern of a 7kw Wireless Electric Charging System in Different Environments Leandro Percebon, Daniel Kuerschner, Qualcomm CDMA Technologies, PP171 Innovations for IGBT Based Power Modules in HEV Drivetrain Applications Thomas Geinzer, Martin Gleich, Alexander Schwarz, Infineon Technologies, D PP172 Estimation of the Losses in Si and SiC Power Modules for Automotive Application Dounia Oustad, Menouar Ameziani, Dominique Lhotellier, VEDECOM, F; Stéphane Lefebvre, Meckael Petit, ENS Cachan, F PP173

DC/DC-Converter with Optimised Power Density for Integration of Multifunctional Fuel Cell Systems in Modern Aircraft Application Mathias Warncke, Klaus F. Hoffmann, Sebastian Fahlbusch, Helmut Schmidt University- University of the Federal Armed Forces Hamburg, D

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Conference  Wednesday, 17 May 2017, Poster Dialogue Sessions

Exhibitor Forum

15:30 – 17:30, Foyer Ground Floor Entrance NCC Mitte

Hall 7 Booth 507

High Perfomance Power Electronics

Chairperson: Dehong Xu, Zhejiang University, CN PP174

Influence of Different Switching Frequencies and Modulation Techniques on IPMSM and Inverter Losses Optimizing the Overall Drive Train Efficiency Martin Stempfle, Yuying Han, Julian Wölfle, Nathan Tröster, Jörg Roth-Stielow, University of Stuttgart, D

PP181 Approach of Optimization of Power Leveling System Using Multi-energy Storage Devices Toshihiro Shimao, Koji Kato, Yoichi Ito, Sanken Electric, J PP182

Single-Phase PWM-Based Unity Power Factor Rectifier with Adaptive Predictive Current Control Swen Bosch, Jochen Staiger, Heinrich Steinhart, HTW Aalen, D

PP183

1.5kW Digital Totem Pole PFC Design for AirConditioner and Performance Comparison Using IGBT, SiC and GaN Wei Wu, Infineon Technologies Americas, USA

Software Tools and Applications

PP175 Finite Control Set Model Predictive Control of a PMSM Fed by a Multilevel Inverter Cristian Vargas, Simon Feuersänger, Mario Pacas, Univer sity of Siegen, D PP176 Current Control Delay Reduction for FPGA-Based Servodrive Lev Rassudov, Balkovoi Aleksandr, Moscow Power Engineering Institute, RU PP177

An Optimal Coreless Transformer Topology for Power Transfer Yohan Wanderoild, Romain Grezaud, Dominique Bergogne, Adrien Morel, CEA-Léti, F; Hubert Razik, Laboratoire Ampère, F

PP178 Switching Loss Minimization Using Two-Confi guration Predictive Control for a Thermo-Hydraulic Linear PMSG Daniel Bernet, Karlsruhe Institute of Technologie (KIT), D PP179 Energy Storage Battery Protection System with Externaly Triggered Melting Fuses Mitja Koprivsek, ETI, SL PP180 Software-Defined Battery Technology: Novel Approach to Battery Management Eric Macris, Maxim Integrated, USA

PP188 Design Concept of MMC-based Multi-port DC Hub for Multiterminal HVDC Grids Epameinondas Kontos, Pavol Bauer, Delft University of Technology, NL PP189 Direct-Model Predictive Control for Fault RideThrough Capability Enhancement of DFIG Mohamed Abdelrahem, Ralph Kennel, Technical Uni versity of Munich, D PP190 AutoCrear- A Novel Software Tool for Automatic 3D Creepage and Clearance Analysis Michael Martinek, e-laborate Innovations, D PP191 Power-Hardware-In-Loop Setup for Power Elec tronics Tests Giovanni De Carne, Xiang Gao, Marco Liserre, Christian-Albrechts-University, D PP192 Ensuring Fast Turn-Around Times for A Program mable Digital Power Controller Markus Schnell, Jörg Oehmen, Infineon Technologies, D

Chairperson: Peter Zacharias, University of Kassel, D PP184 Design of Test-system for EMC Investigations of Systems with Magnetron Jan Leuchter, Quang Huy Dong, University of Defence, CZ PP185

Development of LabVIEW Models for Resonant Power Converters Tsveti Hranov, Nikolay Hinov, Technical University of Sofia, BG

PP186 A Novel Detailed Analysis Of The Flyback Converter Utilizing A Transformer With Nonlinear Magnetiz ing Inductance Panagiotis Mantzanas, Thomas Duerbaum, Friedrich Alexander-University Erlangen, D PP187 eDesignSuite: A New Design Tool for Digital Power Solutions Carmelo Giuseppe Viccica, Marcello Palano, Natale Porto, STMicroelectronics, I

On all three exhibition days, a great variety of exhibitors present their latest product developments and state-of-the-art solutions in 20-minutes slots.

PP193 A New Optimization Algorithm for Power Electronics Using the Mixed Integer Linear Programming Method Marco Schilling, Tobias Reimann, Technical University Ilmenau, D; Ulf Schwalbe, ISLE Steuerungstechnik und Leistungselektronik, D PP194

Novel Efficient and Reliable Network Simulation by Means of Lipschitz Constants Carsten Kuring, Technical University Berlin, D; Julian Dobusch, Thomas Dürbaum, Friedrich-AlexanderUniversity Erlangen, D

PP195

Hardware-in-the-Loop Parallelization for Fully Automated Testing of “AVL E-Storage BTE” Selimcan Deda, Roland Greul, Guenter Prochart, AVL LIST, AT

Tuesday, 16 May 2017  10:00 – 16:40 Wednesday, 17 May 2017

09:40 – 16:40

Full program available on pcim-europe.com

Thursday, 18 May 2017  10:00 – 16:00

The following exhibitors are represented: MES Manz Electronic Systeme OHG | Alpha Assembly Solutions | Mentor Graphics | Rohde & Schwarz GmbH & Co KG. | Sekels GmbH | Panasonic Automotive & Industrial Systems Europe GmbH | Siebel Elektronik GmbH | RECOM Power GmbH Monolith Semiconductor, Inc. | A.L.M.T. Corp. | Advanced Cooling Technologies Inc. | ON Semiconductor | KEMET Electronics Corporation | Littelfuse | AMS Technologies AG | ROGERS Corporation |Indium Corporation of Europe | Proton-Electrotex | dSPACE GmbH | EPCOS AG, A TDK Group Company | Traftor Europe | Hitachi Metals Europe GmbH | Mitsubishi Electric Europe B.V. | Vincotech GmbH | Kapteos S.A.S. | ABB Switzerland Ltd. - Semiconductors | SEMIKRON International GmbH | Allegro MicroSystems, LLC | POCO Holding Co., Ltd. | HEIDEN power GmbH | ROHM Semiconductor GmbH | Diotec Semiconductor AG | Tamura-Europe Ltd. | Yole Developpement SA | VACUUMSCHMELZE GmbH & Co. KG | EPCOS AG, A TDK Group Company | Jianghai Europe Electronic Components GmbH | Sumitomo Electric Industries, Ltd. | FuG Elektronik GmbH | Hollmén & Co Ltd | Honeywell Europe N.V. | POWERSYS | Analog Devices GmbH | Aperam Alloys Amilly | EpiGaN nv | SET Power Systems GmbH | Exagan S.A. | MB Electronic AG | Amulaire Thermal Technology | Wolverine Tube Inc. MicroCool Division | AC Power Corp. | Magnetics Inc. | Hangzhou Firstack | Technology Co., Ltd. | 3 M Deutschland | tesema Leistungselektronik | GT elektronik GmbH & Co. KG | DEWETRON GmbH | Panasonic Automotive & Industrial Systems Europe GmbH | Vincotech GmbH

As of March 2017/subject to change without notice

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Conference Thursday, 18 May 2017 Morning Oral Sessions

08:45  Room Brüssel 1 KEYNOTE: Evolution in Topologies as a Result of New Devices and Enabling Technologies, Ionel Dan Jitaru, Rompower, USA

09:30  Coffee Break

Room Brüssel 1

Room München 1

Room München 2

Room Mailand

Advanced Wide Bandgap - GaN

Power Electronics in Automotive

Control and Drive Strategies in Power Converters

S PE CI AL S E S S I ON : Capacitors

Chairperson: Peter Wallmeier, Delta Energy Systems, D

10:00 Investigation of GaN-HEMTs in Reverse Conduction Richard Reiner, Patrick Waltereit, Beatrix Weiss, Rüdiger Quay, Oliver Ambacher, Fraunhofer-Institute IAF, D 10:30 Short-Circuit Robustness for 650 V E-Mode GaN Transistors, Current Measurement for High Speed Protection Circuit Matthieu Landel, Cyrille Gautier, Denis Labrousse, Stéphane Levebvre, ENS Cachan - SATIE, F 11:00 Mechatronic Design of 2 kW SiC DC/AC Converter with 200 W/inch Thomas Menrath, Stefan Matlok, Stefan Endres, Stefan Zeltner, Bernd Eckardt, Fraunhofer Institute IISB, D 11:30 A Full SiC Module Operational at 200°C Junction Realized by a New Fatigue-Free Structure Hiroshi Notsu, National Institutee of Advanced Industrial Science and Technology (AIST), J 12:00 A Novel SiC Power Module with 3D Integration Jinchang Zhou, ON Semiconductor, USA

12:00 – 14:00  Lunch Break

Award nominee. More information on page 19.

Chairperson: Giuseppe Tomasso, University of Cassino and South Lazio, I

10:00 Influences of WPT-Coil Losses and Coupling Coefficient on the Resonance Circuits of Wireless Power Transfer Systems Christof Ziegler, Stefan Weber, EPCOS, D; Georg Heiland, Finepower D; Denis Kraus, Technical University of Munich, D 10:30 6 kW Bidirectional, Insulated On-board Charger With Normally-Off GaN Gate Injection Transistors Stefan Endres, Christoph Seßler, Bernd Eckardt, Stefan Zeltner, Fraunhofer Institute IISB, D; Tatsuo Morita, Panasonic Corporation, J 11:00 650V, 7mOhm SiC MOSFET Development for Dual-Side Soldered or Sintered Power Modules Monty Hayes, Delphi Automotive Systems, USA; Brett Hull, Jeffrey Casady, John Palmour, Wolfspeed, USA 11:30 Spectral Control of an Automotive DC-DC Converter Christian Korte, Stefan Götz, Eduard Specht, Porsche Engineering Group, D

Chairperson: Hans-Günter Eckel, University of Rostock, D

10:00 Digital Control of Hard Switched Converters by Phase Modulated Pulse Width Modulation PMPWM Stefan Matlok, Bernd Eckardt, Bernd Seliger, Martin März, Fraunhofer Institute IISB, D 10:30 Non-Linearities Compensation Technique for VSI Fed AC Drives Mauro Di Monaco, Giuseppe Tomasso, Ciro Attaianese, Umberto Abronzini, University of Cassino and Southern Lazio, I 11:00 Novel Control Scheme for the Internal Energies and Circulating Currents of Modular Multilevel Converter Yeqi Wang, Rainer Marquardt, University of the Federal Armed Forces Munich, D 11:30 Suitable Turn-Off Strategies for IGBTs with a High Desaturation Current During Short Circuit Failures Detected with the 2D – Short Circuit Detection Method Stefan Hain, Mark-M. Bakran, University of Bayreuth, D

Chairperson: Klaus F. Hoffmann, Helmut-Schmidt-University, D

10:00 Ceramic Power Capacitors and Optimized Packaging Markus Koini, EPCOS, AT 10:30 Ultra Capacitors - Capacitor Based Energy Storage Jan-Hendrik Ernst, Maxwell Technologies, D; Robert Lynds, Catalin Popescu, Mark Sutherland, Maxwell Technologies, USA 11:00 Review of Film Capacitor Trends and Design Changes as a Result of Improved Technologies in Power Electronics Ayse Kartal, EPCOS, D 11:30 New Concepts of Capacitor Designs in Power Electronics Thomas Ebel, FTCAP, D

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Conference Thursday, 18 May 2017 Afternoon Oral Sessions

Room Brüssel 1

Room München 1

Room München 2

Room Mailand

SiC Modules Diodes

Power Converters with Wide Bandgap Devices III

System Reliability

Energy Storage and Power Quality Solutions

Chairperson: Munaf Rahimo, ABB Switzerland, CH 14:00 Design and Analysis of a Low-Inductive Power-Semiconductor Module with SiC T-MOSFET and Si IGBT in Parallel Operation Christian Müller, Infineon Technologies, D 14:30 1.7 kV High-Current SiC Power Module Based on Multi- Level Substrate Concept and Exploiting MOSFET Body Diode during Operation Slavo Kicin, ABB Corporate Research, CH; Enea Bianda Francisco Canales, Samuel Hartmann, Fabian Fischer, ABB Switzerland, CH 15:00 All SiC Module with 1st Generation Trench Gate SiC MOSFETs and New Concept Package Thomas Heinzel, Fuji Electric Europe, D; Yoshinori Iwasaki, Mikiya Chounabayashi, Masayoshi Nakazawa, Susumu Iwamoto, Yasuhiko Oonishi, Motohito Hori, Hideaki Kakiki, Osamu Ikawa, Fuji Electric, J 15:30 Robust SiC JBS Diodes for the Application in Hybrid Modules Lukas Kranz, Renato Amaral Minamisawa, Lars Knoll, Sven Matthias, Andrei Mihaila, Charalampos Papadopoulos, Athanasios Mesemanolis, Elena Mengotti, Giovanni Alfieri, Vinoth Kumar Sundaramoorthy Enea Bianda, Munaf Rahimo, ABB Switzerland, CH

Award nominee. More information on page 19.

Chairperson: Hubert Schierling, Siemens, D

Chairperson: Uwe Scheuermann, Semikron Elektronik, D

14:00 Design and Performance of a 200 kHz GaN Motor Inverter with Sine Wave Filter Franz Stubenrauch, Norbert Seliger, University of Applied Sciences Rosenheim, D; Doris SchmittLandsiedel, Technical University Munich, D

14:00 Power Cycle Testing of Sintered SiCMOSFETs Ralf Schmidt, Ronny Werner, Siemens, D; Jeffrey Casady, Brett Hull, Adam Barkley, Wolfspeed, USA

14:30 Reducing dv/dt of Motor Inverters by Staggered- Edge Switching of Multiple Parallel SiC Half- Bridge Cells Thomas Fuchslueger, Hans Ertl, Technical University of Vienna, AT; Markus A. Vogelsberger, Bombardier Transportation, AT

14:30 Synchronous Observing Methodology of Surface Images and Energy Data at Power Chip Destruction Toshiya Tadakuma, Akiko Goto, Teruaki Nagahara, Junji Yamada, Mitsubishi Electric Corporation, J

15:00 Highly-Reliable Flyback-Based PV Micro-Inverter Applying Power Decoupling Capability Without Additional Components Hiroki Watanabe, Jun-Ichi Itoh, Nagaoka University of Technology, J 15:30 Compact Highly Efficient 3-kW MHz Inverter Based on SMT SiC MOSFETs Fabian Denk, Christoph Simon, Michael Heidinger, Rainer Kling, Wolfgang Heering, Karlsruhe Institute of Technology (KIT), D

15:00 Active Current Trajectory Control (ACTC) - for Hot Swap, Capacitor Discharge, Circuit Breaker and Current Shaping Juan Sanchez, Kennith Kin Leong, Infineon Technologies Austria , AT 15:30 Impact of Humidity on Railway Converters Christian Zorn, Nando Kaminski, University of Bremen, D; Michel Piton, ALSTOM, F

Chairperson: Daniel Chatroux, CEA-LITEN, F

14:00 A Comparative Study on Si-SJ-MOSFETs vs. GaN-HEMTs Used for LLC-SingleStage Battery Charger Lukas Keuck, Patrick Hosemann, Benjamin Strothmann, Joachim Böcker, University of Paderborn, D 14:30 Investigation and Optimization of the Accuracy of Current Sensors for High Voltage LFPBatteries Simon Bischof, Thomas Blank, Marc Weber, Karlsruhe Institute of Technology (KIT), D 15:00 High-Efficiency UPS Protection for Industrial Applications Lorenzo Giuntini, Massimiliano Brioschi, GE Consumer & Industrial, CH 15:30 A Battery and Super Capacitor Hybrid Energy Storage System for Power Flow Smoothing in Low Voltage Grids Bernd Bohnet, Michael Braun, Karlsruhe Institute of Technology (KIT), D

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List of Exhibitors

Siver-Sponsor

Media Partner

At PCIM Europe 2017, more than 450 exhibitors from 28 nations showcase products and services as well as the most recent innovations in the fields of power electronics, intelligent motion, renewable energy and energy management.

3M Deutschland, D A Media Bodo’s Power Systems, D A.L.M.T., J Aavid Kunze, D Aavid Thermalloy, I ABB Switzerland – Semiconductors, CH AC Power, TW Advanced Cooling Technologies, USA Advanced Techne – PRIATHERM DIVISION, I Advanced Technology & Materials, CN Advice Electronics, IL AgileSwitch, USA AIC Europe, D AIT Austrian Institute of Technology, A AixControl, D ALCON Electronics, IND alfatec, D Alisha Coils & Transformers, IND Allegro MicroSystems Europe, GB Allray, CN Alpha and Omega Semiconductor, USA Alpha Assembly Solutions ALPHA-Numerics, D alpitronic, I alttec, D Alutronic Kühlkörper, D Amantys Power Electronics, GB AMS Technologies, D Amulaire Thermal Technology, TW Analog Devices, D Anhui Astromagnet, CN APAQ Technology, GB Aperam Alloys Amilly, F APM Technologies (Dongguan), CN APOJEE, D Applied Micro Electronics AME, NL Arcel, F Arthur Behrens, D ASM Assembly Systems, D AT & S Austria Technologie & Systemtechnik, A Atherm, F ATV Technologie, D austerlitz electronic, D AutomatisierungsTechnik Voigt Autosplice Europe, D AUXEL, F AVX, GB Behlke Power Electronics, D Beijing Deepcool Industries, CN Beijing Sunking Power Electronic Technology, CN Bestbright Electronics, CN BINDER tecsys, D BLOCK Transformatoren-Elektronik, D Bluestar Silicones France, F Bourns Sensors, D Brightek (Europe), GB Broadcom Europe, D BROXING, CH Bruckewell Technology, TW Caltest Instruments, D Cascade Microtech, USA CEFEM INDUSTRIES, F CEJN-Product, D Celem Passive Components, IL CeramTec, D Chang Sung, ROK China Amorphous Technology, CN CHROMA ATE EUROPE, NL Cixi ULO Electronics, CN CKE Products by Dean Technology, USA Cleverscope, NZ Cluster Leistungselektronik im ECPE, D CMC Klebetechnik, D CMP, F Columbia-Staver, GB Constellium Singen, D

Cool Tec Electronic, D COOLTECH, I CoorsTek, D Cosmo Ferrites, IND CPS Technologies, USA CST, D CTX Thermal Solutions, D Cystech Electronics, TW DACO Semiconductor, TW Danfoss Silicon Power, D Danotherm Electric, DK dataTec, D DAU GmbH & Co., A Dean Technology, USA Denka Chemicals, D DETAKTA Isolier- und Meßtechnik, D DEWESoft, D DEWETRON Deutschland, D DFA Media, GB Diotec Semiconductor, D DODUCO, D Doublecircle Electronics Group, CN DOWA HD Europe, D dSPACE, D DSW Elektronik, D Ducati Energia, I DuPont de Nemours (Luxemburg), L DYNETICS, D Dynex Semiconductor, GB EA Elektro-Automatik EBG Elektronische Bauelemente, A EBV Elektronik ECOMAL Europe, D ECPE European Center for Power Electronics, D ed-k, D EKL, D Electrohms Pvt., IND Electronic Concepts (Europe), IRL ELECTRONICON Kondensatoren, D Electrovipryamitel JSC, RUS ELEKTRISOLA Dr. Gerd Schildbach, D Elektronik-Kontor Messtechnik, D ELSCHUKOM Elektroschutzkomponentenbau, D EpiGaN, B ESKA Erich Schweizer ET System electronic, D ETI Elektroelement d.d., SLO Exagan, F Exxelia Supply, F F & K Delvotec Bondtechnik, D Ferroxcube Deutschland, D Filcap, D Finepower, D Firecomms, IRL Fischer Elektronik, D Flux, DK Foshan City Shunde District ShengYe Electrical, CN Foshan city Xinyuan Electronic, CN Franz Steger Transformatorenbau, D Fraunhofer Institut für Integrierte Systeme und Bauelementetechnologie IISB, D Fraunhofer Institut für Solare Energiesysteme ISE, D Fraunhofer-Institut für Zuverlässigkeit und Mikro­integration IZM, D Frizlen, D FTCAP, D FuG Elektronik, D Fuji Electric Europe, D Furukawa Electric, J GaN Systems, CDN Gaotune Technologies, CN Gemballa Electronics, D General Components, TW GES Electronic & Service, D Global Power Technologies Group, USA GLYN, D

GrafTech, USA GT elektronik, D Guangdong Fengming Electronic Tech, CN Gutre, D GvA Leistungselektronik, D HAHN, D Haining Ferriwo Electronics Co., CN Hangzhou Firstack Technology, CN Hangzhou Liansheng, CN Hangzhou Xenbo Heat transfer Science & Technology, CN HBM, D HE System Electronic, D Hefei Shengda Electronics Technology Industry, CN HEIDEN power, D Hengdian Group DMEGC Magnetics, CN Henkel, D Heraeus Deutschland, D HERVER-9, E Hesse GmbH, D HF Instruments, D High Voltage Power Solutions Products by Dean Technology, USA Himag Planar Magnetics, GB Hitachi Europe, GB Hitachi Metals Europe, D Höganäs AB, S Hollmén & Co, FIN Honeywell Europe, B Hubei Ruiyuan Electronic Co., CN Huhn-Rohrbacher, D HV Components Associates Products by Dean Technology, USA HVP High Voltage Products, D HVR International, D HYDRA Components, D HY-LINE Power Components Vertriebs, D I.C.E., I IB-Billmann, D IC Teplocom, RUS ICAR – INDUSTRIA CONDENSATORI, I ICC Media, D ICEL, I ILFA IMS-TIGER electronics, D Indium Corporation of Europe, GB InduComp Kft., H Inductive Systems Europe, NL Ineltron, D Infineon Technologies, D Ingenieurbüro Federer, CH innovatek OS, D InPower Systems, D Intego, D INTEGRATED Engineering Software, CDN INTENSA Technische Dienstleistungen, A Interplex NAS Electronics, D InTiCa Systems, D Isabellenhütte Heusler, D IS-POWER a Division of IS-Line, D ITELCOND, I IWATSU TEST INSTRUMENTS, J IXYS Semiconductor, D J&D Electronics, ROK Jentech Precision Industrial, TW JFE Steel, J JGD Semiconductor, CN Jianghai Europe Electronic Components, D Johann Lasslop, D Junior Kühlkörper, D Kanthal Globar Sandvik Heating Technology, USA Kapteos, F Karlsruher Institut für Technologie, D Kaschke Components, D KCC, ROK KEMET Electronics, USA Kendeil, I

KERAFOL – Keramische Folien, D Keysight Technologies Deutschland, D KLEINER Stanztechnik, D KOA Europe, D KRAH Elektronische Bauelemente KYOCERA Fineceramics, D LCP Laser Cut Processing, D Leclanché Capacitors, CH Leicht + Müller Stanztechnik, D Leistungselektronik JENA, D LEM Europe, D Littelfuse Europe, D LS Mtron, ROK MACCON, D MacMic Science & Technology, CN MagDev, GB Magnachip Semiconductor, ROK Magna-Power Electronics, D Magnetec, D Magnetics, USA Malico, TW Man Yue Electronics, HK Mareton d.o.o., HR Marini Mario & C., I MB Electronic, D Mecc. AL, I Mentor Graphics (Deutschland), D Mersen France, F MES Manz Electronic Systeme, D MEV Elektronik Service, D Michael Koch, D Micro Commercial Components, USA Microchip Technology, D Micrometals, USA Microsemi, USA MinDCet, B Mitsubishi Electric Europe, D MJC Elektrotechnik, D Monolith Semiconductor, USA Mornsun Guangzhou Science & Technology, CN MS Power, D MUECAP Bauelemente, D Multi Measuring Instruments, J Murata Electronics Europe, NL Myrra Deutschland, D Nanjing New Conda Magnetic Industrial, CN NGK Electronics Devices, J Ningbo Degson Electrical, CN NORWE, USA NORWE;D Nucon Energy, RUS NWL Capacitors, USA OMICRON Lab, A ON Semiconductor, GB Online Engineering, D Otto Brenscheidt, D PADA Engineering, I Panasonic Automotive & Industrial Systems Europe, D PARKER OVERSEAS, IND Payton Planar Magnetics, IL PBF Group, NL Peniel Electronics, ROK PETERCEM, F PHOENIX CONTACT Deutschland, D PHOENIX MECANO Power Quality, D Piciesse Elettronica, I Pikatron, D PLANSEE SE, A Plexim, CH PMK Mess- & Kommunikationstechnik, D POCO Holding, CN POMCEG ELECTRONICS, E Power Electronic Measurements, GB Power Integrations, D POWERSEM, D POWERSYS, F

PPM - Pforzheimer Präzisions Mechanik Prima Electro, I Profiltech Stufenbandprofile, D Promet, CH ProNova, D ProTek Devices, USA Pulse Magnetic & Power Electronics, IND R & D Electronics International, HK R3Tec, D Rara Electronics, ROK RECOM Power, A Richardson RFPD Germany, D RISSE electronic, D RM Prüftechnik, D ROGERS Germany, D Rohde & Schwarz Vertriebs, D ROHM Semiconductor, D RSG Electronic Components, D Rubadue Wire, USA Rudolf Pack LitzWire, D RUTRONIK Elektronische Bauelemente, D Samwha Europe, D SanRex Europe Branch, FIN SanRex, USA Sarnikon Metal ve Elektronik San. ve Tic, TR SAS IDEALEC, F SBA-Trafobau Jena, D SBA-TrafoTech, D SBE, USA Schmidbauer Transformatoren und Gerätebau, D SCHROEDER + BAUER Werkzeugbau Stanztechnik, D Schukat Electronic, D Schulz Stanz- u. Umformtechnik, D Schulz-Electronic, D Schunk Hoffmann Carbon Technology, A Schunk Sonosystems, D schwa-medico Transformatorenbau & Industrieprodukte, D Schweizer Electronic, D SCR, F Seifert electronic, D Sekels, D SEMIKRON International, D Sensitec, D Serigroup, I SERTO, D SET, D SET Power Systems, D Shanghai EAGTOP Electronic Technology Shenzhen Belta Technology, CN Shenzhen BYD Microelectronics, CN Shenzhen Cectn Technology, CN Shenzhen ChuangShiDing Electronic, CN Shenzhen Click Technology, CN Shenzhen Gaoyu Electronic Technology, CN Shenzhen Yamaxi Electronics Shindengen UK, GB Siba, D SIBO Electronic Vertriebs, D Siebel Elektronik, D Siemens, D SIGNALTEC, D Sika Deutschland, D SINUS Electronic, D SIR Resistor, I SIRECTIFIER ELECTRONICS TECHNOLOGY, CN SIRIO ELETTRONICA, I SK Electric Hong Kong, CN SMP, D SMT Maschinen- und Vertriebs, D Sontronic, D Special-Ind Deutschland, D StandexMeder Electronics, D Starpower Europe, CH Stercom Power Solutions, D STMicroelectronics International, CH Strohheker Kunststoffteile und Metallwaren

STS, D Su Zhou OCA Microelectronics, CN SUMIDA Components & Modules, D Sumitomo Electric Industries, J Sunrise Power Transformers, D Supreme Power Solutions, CN Sycomp, D System Plus Consulting, F Taiwan Chinsan Electronic Industrial, TW Taiwan Semiconductor Europe, D Tamura, J Tamura-Europe, GB TCT Tores Composants Technologies, F TDG Holding, CN TDK Europe, D Tech Semiconductors, CN Technagon, D Technix, F TECNOAL, I TECNOMEC, I Tektronix, D TELCON, GB Teledyne LeCroy, D tesema Leistungselektronik Zweign. der Pikatron, D TH Proton-Electrotex, RUS THALES MICROELECTRONICS, F Thomas Waidner, D Tianjin Century Electronics, CN Tianyi Electronic Technolog, CN Tigris Elektronik, D TOELLNER Electronic Instrumente, D Toshiba Electronics Europe, D Toshiba Materials, J trafomodern Transformatorengesellschaft, A Traftor Technology (Shenzhen) , CN TRAMAG Transformatorenfabrik, D Unisonic Technologies, TW United Silicon Carbide, USA University of Nottingham, GB VACUUMSCHMELZE, D Vicor Germany, D Vinatech, ROK Vincotech, D Vishay Europe Sales, D VISIC Technologies, IL Vogel Business Media, D WAGO Kontakttechnik Walther-Präzision, D WARMES, D Wayne Kerr Europe, D Webra Industri, S WeEn Semiconductors UK, GB Weidmüller Interface, D Well Ascent Electronic, CN WEVO-Chemie, D widap electronic components, D Wieland-Werke, D Wijdeven Inductive Solutions, NL WIMA, D Wolfspeed, A Cree Company, USA Wolverine Tube MicroCool Division, USA WÜRTH ELEKTRONIK eiSos, D Würth Elektronik ICS, D Xi’an Miqam Microelectronics Materials, CN Xi’an TRUSUNG Advanced Material, CN Yangzhou Pairui, CN Yangzhou Yangjie Electronic Technology, CN Yokogawa Deutschland, D Yole Developpement, F Zeasset Electronic Technology, CN ZES ZIMMER Electronic Systems, D ZEZ SILKO, CZ Zhuzhou CRRC Times Electronic, CN Zurich Instruments, CH As of March 2017/subject to change without notice.

44

45

Room Plan

Industry Forum Hall 6 Booth 6143

Time

Topic

Company

Tuesday, 16 May 2017 10:30 – 11:00

Research activities of the University of Rostock for future off-shore wind grids

Universität Rostock

11:00 – 11:30

3.3kV SiC hybrid technology combined with HPnC package

Fuji Electric Europe

11:30 – 12:00

Mehrwert-Batteriemanagementsysteme – Gleiche Hardware, mehr Informationen, mehr Sicherheit, mehr Zuverlässigkeit

RWTH Aachen University

12:15 – 13:15

Developing the next generation of power supplies

Power Systems Design

14:00 – 14:30 Der PLANETENMOTOR – Eine neue, unkonventionelle Kombination von Elektromotor und Planetengetriebe für kompakte elektrische Antriebe

Technische Universität Wien

14:30 – 15:30 Benefits and reliability of SiC devices for industrial and automotive applications

ROHM Semiconductor

Ost ServicePartner Center

12 10

11 NCC West

Straße ner he nc

Fraunhofer IAF

Parkhaus Parking



13:30 – 14:00 Monolithically integrated GaN circuits

Exhibition Centre Nuremberg

Automotive electronics battleground: semiconductor vs. tier-1 business model

Roland Berger Infineon Technologies

13:30 – 14:30 SIC – design, EMC and measurement

A Media, Bodo’s Power Systems

14:30– 15:30

GaN – design, EMC and measurement

A Media, Bodo’s Power Systems

15:30– 16:30

Software and hardware solutions for HIL und RCP applications in power electronics

Plexim

S 1/2

100m

50

VIP Ost 2

S4

4A

4

2

S 3/4

3C

3A

3

im Bau under construction

Parking Conference

0

Eingang Entrance

S 4/5

West Einfahrt . Access

Karl-Schönleben-Straße

Ost

Süd-Ost 2

Süd-Ost 1

Ost Einfahrt . Access

Karl-Schönleben-Straße

Halle 10 Hall 10

NCC Mitte, Level 0 Halle 12

Halle 12 Hall 12

NCC Mitte, Level 1

Hall 12

Hall 10

Venedig

Thursday, 18 May 2017

NCC West

10:00 – 10:30 Optimized high current IGBT gate driver improves system efficiency

On Semiconductor

10:30 – 11:30

Rohde & Schwarz

Frankenhalle Rotunde

Presse Center Madrid Foyer Service 9 West Mitte Brüssel/

ECPE Monolith Semiconductor

13:30 – 14:00 NPI - A balancing act for engineers --Global Components Sourcing--

Brightek (Europe)

14:00 – 15:00 Boosting battery energy storage systems: three-level power modules using SiC MOSFET

Danfoss Silicon Power

NCC West Eingang Entrance

Nizza

NCC West Rotunde

München 1 2

Hall 9

München

NCC Mitte

12:30 – 13:00 SiC MOSFETs – How can we match the success of SiC diodes?

As of March 2017/subject to change without notice

5

1

Ost

NCC Ost

Messepark

Betriebshof

e

Yole Développement

Einführung in den Students' Day

S7

6

S 2/3/4

12:30 – 13:30 Next steps in the industrialization of SiC power switches

11:30 – 12:30

7A VIP Ost 1

S1

Operation Center

U-Bahn / Subway Messe

Status and perspectives in the power semiconductor (Si, SiC, GaN) business

Kühltechnologie: Verlustleistung, eine Leistung die keiner haben will. Was tun?

S1 Mitte

raß r-St the eu rnr -Bä to Ot

11:30 – 12:30

ServiceCenter Mitte

VIP West/ Mitte

Wednesday, 17 May 2017

NCC Mitte

Mitte

Eingang Entrance

15:30 – 16:30 Presentations of the Conference Award winner 2017

10:00 – 11:30

NCC Mitte

S 11

7

9

NCC Mitte

Frankenhalle

Rotunde

8

Frankenhalle Verona

Brüssel Poster Session

Lissabon

NCC Mitte Entrance

Conference Counter

Basel Service-Center Mitte

Piazza

Athen Conference Lunch

Mailand

SMT Hybrid Packaging 2017

Entrances and Services

Hall 9

VIP

Nizza Hall 1

PCIM Europe 2017

Foyer Brüssel/ München

Conference

2

Brüssel 1

Advisory Board/ Speaker‘s Room

46

47

Registration Information

General Information

Registration Fees Until 10 April 2017

From 11 April 2017

One Conference Day

650 EUR

750 EUR

Two Conference Days

1,090 EUR

1,190 EUR

Three Conference Days

1,290 EUR

1,390 EUR

Tutorial Full Day

690 EUR

790 EUR

Seminar Half Day

345 EUR

395 EUR

University Staff*

920 EUR

920 EUR

40 % Discount

40 % Discount

250 EUR

250 EUR

These are per named delegate as follows:

Students Exhibitor special rate**

* University staff and students may only register for the full conference at a reduced rate and must enclose a copy of their university ID-card. A student discount of 40 % is available upon request. This discount cannot be combined with the University Staff fee. Please contact Ms. Daniela Käser at [email protected] for registration. ** A transferable ticket valid for the three keynote presentations including the conference proceedings is only available to PCIM Europe 2017 exhibitors. A special registration is required.

Venue The seminars on Sunday, 14 May 2017 and the tutorials on Monday, 15 May 2017 will take place at Arvena Park Hotel, Görlitzer Str. 51, 90473 Nuremberg, phone: +49-911-89220.

Registration Counter Opening hours Arvena Park Hotel Sunday 14 May 2017 from 13.00 until 17.00 Monday 15 May 2017 from 8.00 until 14.00

The conference from Tuesday, 16 May 2017 until Thursday, 18 May 2017 will take place at Conference Center Mitte, NürnbergMesse, Otto-Bärnreuther-Strasse, 90471 Nuremberg.

NCC Mitte, NürnbergMesse Monday 15 May 2017 from 16.00 until 18.00 16 – 18 May 2017 from 8.00 until 17.00

Accommodation For hotel booking please contact the hotel directly. PCIM Europe Head Quarter Hotel Hotel Arvena Park Görlitzer Str. 51 D-90473 Nürnberg Phone: +49 911 89 22 0 [email protected] 5 min. by underground U1 to the conference site.

Questions? Ms. Daniela Käser Phone: +49 711 61946-972 [email protected]

On-site registration: please add 30 EUR per participant. All fees plus 19% VAT.

Registration and terms and conditions on pcim-europe.com

Travel T here are several non-stop flights to Nuremberg daily. In addition, Nuremberg´s closeness to international airports such as Frankfurt, Munich, Zurich, Amsterdam or Paris ensures optimum connections to the intercontinental flight network. Getting from the airport to the exhibition centre is fast and easy. The airport is close to the city with direct underground and taxi connections to the exhibition centre. The underground takes you in 20 minutes from the airport to the exhibition centre. At Nuremberg Airport, taxis to the exhibition centre are available around the clock. Take the taxi directly to the exhibition centre. Journey time from the airport to the exhibition centre by taxi is approximately 15 minutes and costs about 25 EUR. Y ou can reach Nuremberg´s main train station ‘Nürnberg Hauptbahnhof’ conveniently from every German city with the following trains: ICE, IC or EC. There are also frequent train connections from major European cities such as Paris, Brussels, Zurich, Vienna, Amsterdam or Prague. From ‘Nürnberg Hauptbahnhof’ the underground U1 or U11 (direction: ‘Langwasser Süd’) will take you directly to the exhibition centre in only 8 minutes. At the main train station in Nuremberg there are several taxis waiting for you. By taxi you reach the exhibition centre within 10 minutes. Nuremberg is centrally located in the South of Germany. Its excellent connections to the European motorway and direct feeder roads make it easy and convenient to reach the exhibition centre by car. Destination address for your navigation system: NürnbergMesse, Karl-Schönleben-Str., Messeplatz 1, 90471 Nuremberg For more travel and hotel information please visit pcim-europe.com

48

PCIM Worldwide

05 – 07 June 2018, Nuremberg, Germany pcim-europe.com

27 – 29 June 2017, Shanghai, China pcimasia-expo.com

Organizer

Mesago PCIM GmbH Rotebuehlstr. 83 – 85 70178 Stuttgart

Phone: +49 711 61946-0 [email protected] pcim-europe.com

# pcimeurope