Solder paste for printing purpose with low activated rosin based flux (halogen free). Application Range. Solder paste fo
TECHNICAL DATASHEET Trade name: Article No: Issue: File Name:
MARTIN solder paste lead free, rosin based VD90.0230 February, 2015 TDS Lotpaste LF 02xx-e 2015_02_25.doc
Page 1 of 2 _____________________________________________________________________________________________________
Description Solder paste for printing purpose with low activated rosin based flux (halogen free)
Application Range Solder paste for a wide range of high quality processes including electronic connections, electro - mechanical and mechanical solder applications.
Physical Caracters Metal Powder Particle size Alloy Melting Point Density
20-38 µm Sn96,5 Ag3 Cu0,5 Solidus 217 - 218°C, Liquidus 219°C 5,0g/cm³ @ 20°C
Solder Paste Metal Content Viscosity Density Package
85 - 89% 120 Pas (Malcam spiral Type viscometer, PCU-2 @ 25°C, 10RPM) n/a 5ccm cartridge
Flux activity Standard Classification
ANSI- J-STD-004 ROL 0
Shelf Life / Time of Storage Storage Temp: Self life time General:
5 to 10 °C 3 month (sealed) Do not freeze. Store syringes vertically, with tip down. Avoid exposure to sunlight and high humidity.
Martin GmbH D-82234 Wessling / Germany Geschäftsführer / General Manager Dr. Georg Baumann Dipl.-Ing Felix Frischkorn Dipl.-Ing. Gunter Kürbis
Amtsgericht München Ust.-Id.-Nr. DE 128 235 758 WEEE-Nr. DE 22908382
VR-Bank Sta-Hg-Lbg Konto 655 67 87 BIC GEN0DEF1STH IBAN DE 15700932000006556787
Fon +49 [0] 8153 9329-30
[email protected] www.martin-smt.de
Seite 1 von 2
TECHNICAL DATASHEET Trade name: Article No: Issue: File Name:
MARTIN solder paste lead free, rosin based VD90.0230 February, 2015 TDS Lotpaste LF 02xx-e 2015_02_25.doc
Page 2 of 2 _____________________________________________________________________________________________________
Cleaning The flux residues don’t need to be cleaned. They may remain on the circuit or removable with typical rosin cleaning solution.
Application Dispense (Time Pressure Technology) Nozzle Diameter Pressure Nozzle Heating
not recommended not recommended not recommended
Pinting Recommended Product for printing application.
General Handling Information Ensure that the paste has reached room temperature before opening to get the paste dispensable and to prevent condensation.
Martin GmbH D-82234 Wessling / Germany Geschäftsführer / General Manager Dr. Georg Baumann Dipl.-Ing Felix Frischkorn Dipl.-Ing. Gunter Kürbis
Amtsgericht München Ust.-Id.-Nr. DE 128 235 758 WEEE-Nr. DE 22908382
VR-Bank Sta-Hg-Lbg Konto 655 67 87 BIC GEN0DEF1STH IBAN DE 15700932000006556787
Fon +49 [0] 8153 9329-30
[email protected] www.martin-smt.de
Seite 2 von 2
