FEB RUA RY - Future Electronics

AMERICAS’ EDITION

FEBRUARY

2 016

PRODUCT AND TECHNOLOGY NEWS FROM FUTURE ELECTRONICS

Renesas

Introducing the Renesas Synergy™ Platform PAGES 4-5

Infineon

OPTIGA™ TPM: Certified Security Solutions for Trusted Computing in PC and Embedded Applications PAGE 6

TE Connectivity

MS5525DSO: Save Space with Fully Calibrated Pressure and Temperature Sensor in a Small Package PAGE 11

Vishay

The Internet of Things (IoT) – Touching the Human Body PAGE 13

APPLICATION SPOTLIGHT

RL78/G1D Intelligent Bluetooth® Smart MCUs 3 4-5 6 7 7 8 8 8 9 10 10 11 11 12 12 13 24

COMPONENT FOCUS Cambridge CMOS Sensors Ultra-Low Power Gas Sensors 14 Microchip MCP9600: Fully Integrated Thermocouple EMF to ºC Converter 14 NXP NFC Smart Connected Home 15 CUI Inc. Level VI-Compliant AC-DC Power Supplies Suitable for Global Use 16 CUI Inc. The Power to Heal, Deliver, Connect and Build – The Power of Things™ 16 17 Littelfuse XTREME-GUARD™ ESD Suppressors Reduce Power Consumption and Ensure Data Integrity Susumu Precision Chip Resistors with the Highest Power Rating 17 E-Switch Large Selection of Tact Switches with Multiple Options 18 Adam Tech Industry Standard Cable Assemblies 18 Future Electronics Analog Corner 20-21

Low-power RL78 Microcontroller and Bluetooth Low Energy (BLE) wireless technology increase battery life and accelerate Bluetooth connected device development

■

Power Saving

■ High

integration minimizes BOM cost; Balun, on-chip 32 KHz oscillator

Key Features Bluetooth Smart v4.1 connectivity supported in embedded and modem modes

■ Industry-leading support tools shorten

time to market

■ 'RF Adaptable Technology' automati-

State-of-the-art radio technology enables reliable communications with low current consumption.

4 mA

capability enables convenient application upgrades in the field

(Data transfer 1 second interval/ Connection always on)

2 mA 1 mA 0 mA

MCU Oper. Sta.

Deep Sleep

Wake up RUN

Best setting to MCU operation

HALT

RUN

STOP

RUN

S T O P

Deep Sleep

Deep Sleep

RL78/G1D MCUs prioritize current consumption at near distances or communication range at far distances.

Simplified RF Design

Bluetooth Reception/Transmission

Average current is 10 µA !

3 mA

Efficient Connection Technology

■ Firmware-over-the-air (FOTA)

cally optimizes power consumption versus communication range

Receiver Sensitivity

Design Versatility + System Performance Optimization

documented test procedure facilitate radio certification

Rx current of 3.5 mA

Outstanding Tx/Rx Power Efficiency

Interference Rejection

■ BT SIG qualified stack plus

■ Peak Tx current of 4.3 mA and peak

Current

APPLICATION SPOTLIGHT Renesas RL78/G1D Intelligent Bluetooth® Smart MCUs Renesas Introducing the Renesas Synergy™ Platform Infineon OPTIGA™ TPM: Certified Security Solutions for Trusted Computing in PC and Embedded Applications Yageo Resistor Products for Internet of Things (IoT) Applications Zilog 32-bit Cortex-M3 Based Programmable Motor Controllers Cypress EZ-BLE™ PSoC® Module Cypress The Industry’s Lowest Power Energy Harvesting PMIC for IoT Devices Cypress Comparing IoT Memory Types Semtech LoRa® Products Enable the Internet of Things ON Semiconductor High Performance Sub-1 GHz Radio Devices TE Connectivity HM1500LF and HTM2500LF Temperature and Relative Humidity Modules TE Connectivity MS5525DSO: Save Space with Fully Calibrated Pressure and Temperature Sensor in a Small Package TE Connectivity BLE Wireless Sensor Tag Demo V1.1 Sensirion SHT3x Series Digital and Analog Humidity and Temperature Sensors Lattice Semiconductor iCE40 UltraLite™ - The Best Solution for IoT Devices Vishay The Internet of Things (IoT) – Touching the Human Body STMicroelectronics ST Solutions for IoT Sensor Objects

Wake up

High level of integration simplifies RF design and reduces BOM count.

L&C

DC/DC

Antenna

BALUN

RL78/G1D MCU

BLE Connectivity Solution

Operation period of RL78/G1D (About 7 ms) Interval time (1 second)

TECHNICAL VIEW Future Electronics

How to Design a Wireless Lighting Network for High Performance, High Reliability and Low BoM Cost

AD Future Lighting Solutions

We Accelerate Time to Revenue by Providing…

22-23

Module Reference Designs ■

19

Commercial Modules from Gainspan

Tx Output Power: 0dBm & 20dBm

■ GS780MIZ

■ GS780MEZ

Sample Programs ■ ■ ■

Current and previous versions of the virtual FTMs are available at www.FutureElectronics.com/FTM

■

19 mm

■ ■

To buy products or download data, go to www.FutureElectronics.com/FTM

Delight the Customer® Future Electronics’ New Product Introduction (NPI) program is an important part of our commitment to servicing all of our customers’ needs from prototype to production.

To ensure you continue receiving future copies of FTM

Look for the NPI icon to learn about the latest products and technologies available, and buy what you need in engineering quantities.

Most products featured in FTM are available in engineering quantities. For more information or to buy products herein, go to www.FutureElectronics.com/FTM. For immediate access to the WORLD’S LARGEST AVAILABLE-TO-SELL INVENTORY go to www.FutureElectronics.com. Follow us on:

Pin Count 48 pins

Package Plastic WQFN (6x6 mm)

Evaluation Kit

Fields of Application

Ordering Part Number

Consumer

R5F11AGGANB

Industrial

R5F11AGGDNB

Consumer

R5F11AGHANB

Industrial

R5F11AGHDNB

Consumer

R5F11AGJANB

Industrial

R5F11AGJDNB

Code Flash Memory

Data Flash Memory

RAM

128 KB

8 KB

12 KB

192 KB

8 KB

16 KB

256 KB

8 KB

20 KB

Evaluation PC GUI

P/N: RTK0EN0001D01001BZ

For information on Bluetooth Smart, go to bit.ly/1O7yIAC To evaluate today, get your Bluetooth Low Energy Kit: P/N: RTK0EN0001D01001BZ

Register at www.FutureElectronics.com/FTM/Register Accuracy of technical data: All technical data, information, detachable insert(s) or loose advertisement(s) contained in this magazine is derived from information provided by Future Electronics’ suppliers. Such information has not been verified by Future Electronics and we make no representation, nor assume any liability as to its accuracy. Future Electronics does not assume liability in respect to loss or damage incurred as a consequence of or in the connection with the use of such data and information. Prices subject to change without notice. ®Delight the Customer is a registered trademark of Future Electronics.

2

The RL78/G1D Group

Firmware Over The Air update (FOTA) Virtual UART iOS and Android demo apps Beacon stack BT Developer Studio plug-in TCP/IP stack

1.800.FUTURE.1 • www.FutureElectronics.com

Renesas Synergy Software Package (SSP)

At the heart of Renesas Synergy™ Software is the Synergy Software Package (SSP) that integrates Express Logic ThreadX® RTOS, plus stacks, libraries and utilities, including NetX Duo™, USBX™, GUIX™, and FileX®, with a rich application framework and drivers – all optimized specifically for the Renesas Synergy™ MCU architecture.

Renesas Synergy™ Microcontrollers Series S7 High Performance • 240 MHz ARM® Cortex®-M4 CPU w/FPU • Up to 4 MB Code Flash • Up to 640 KB SRAM • Dual Ethernet MAC Controller w/PTP • USBHS and USBFS • CAN, SSI, QSPI, and SDHI • Graphics LCD Controller w/2D Drawing Engine • Capacitive Touch Sensing Unit • TRNG, Crypto, HASH • Integral Safety

Series S5 High Integration • To 200 MHz ARM® Cortex®-M4 CPU w/FPU • Up to 2 MB Code Flash • Up to 640 KB SRAM

Coming Soon

Series S3 High Efficiency • 48 MHz ARM® Cortex®-M4 CPU w/FPU • Up to 1 MB Code Flash • Up to 192 KB SRAM • USBFS • CAN, SSI, QSPI, and SDHI • 14-bit A/D Converter and 12-bit D/A Converter • OPAMP • High-Speed and Low-Power Analog Comparators • Capacitive Touch Sensing Unit • TRNG, Crypto, HASH • Integral Safety

Series S1 Ultra Low Power • 32 MHz ARM® Cortex®-M0+ CPU • Up to 128 KB Code Flash • Up to 16 KB SRAM • USBFS • CAN • 14-bit A/D Converter and 12-bit D/A Converter • Low-Power Analog Comparator • Capacitive Touch Sensing Unit • TRNG, Crypto, HASH • Integral Safety

Renesas Synergy™ Tools & Kits

Renesas Synergy is a comprehensive platform that integrates a real-time operating system, middleware and other software with a family of highly scalable microcontrollers, as well as development tools, designed to improve productivity. This tight coupling, along with a wide range of application and product examples, allows you to focus on innovation and deliver differentiated products faster than ever before. Elements of Renesas Synergy have been designed to provide unprecedented compatibility and scalability. Well-designed software APIs make software development at an application level a reality. Systematic testing, qualification, maintenance and support that follow well-defined software lifecycle management principles reduce risk for software developers. With the out-of-box integration of software and hardware, the Renesas Synergy Platform now allows you to improve your time to market, eliminate barriers to entry brought on by the risks of new technologies and upfront costs, and lower your total cost of ownership with bundled, maintained and verified baseline resources. The Renesas Synergy Platform will continue to evolve over time, bringing new technologies and features that maintain compatibility so you can keep your products on the cutting edge. To catch the next wave and learn more, please visit: bit.ly/1MtOeCo ©2016 Renesas Electronics America Inc. (REA). All rights reserved. Renesas Synergy is a trademark of Renesas Electronic Corporation. All trademarks are the property of their respective owners.

e2 studio, an Integrated Solution Development Environment (ISDE) • Industry-standard Eclipse-based tool with multiple plug-ins • GNU ARM C compiler (IAR ARM compiler option) • New Project Generator for quick and easy project setup • Pin, Clock, and Interrupt Configurator to personalize design, error check, and generate start-up code

• GUIX Studio – desktop graphical user interface design tool • Smart manual. Interactive wiki-based, context-aware embedded document system • RTOS-aware debugging via J-Link JTAG and single-wire interfaces • TraceX™ real time task monitoring for ThreadX

Hardware Kits • Development Kits (DK) for full project development. Modular access to all MCU features and pins • Starter Kits (SK) for low-cost introduction to using the Renesas Synergy Platform • Promotion Kits (PK) for experiencing the Renesas Synergy Platform without any barrier

Renesas Synergy™ Solutions Product Example Kits (PE)

Application Example Kits (AE)

• Human Machine Interface with brilliant-color TFT LCD and wired/wireless connectivity • Industrial data logger w/precision analog and wireless

• Capacitive touch deep evaluation modules • More to come for motor control, industrial networking, and mesh networked sensors

Renesas Synergy™ Gallery • Showroom website for access to Renesas Synergy Platform ecosystem of software, tools, and services • All licensing and downloading of Reness Synergy tools, SSP, demonstrations, and qualified SW add-ons from Renesas

• Browse and download verified software add-on components, tools, and services from third-party suppliers • Visit the Renesas Synergy Gallery at: https://synergygallery.renesas.com

For more information or to get your Renesas Synergy Kit, go to bit.ly/1MtOeCo



OPTIGA™ TPM: Certified Security Solutions for Trusted Computing in PC and Embedded Applications

Resistor Products for Internet of Things (IoT) Applications FEATURES AND APPLICATIONS

The Infineon OPTIGA™ TPM (Trusted Platform Module) family is a standardized security controller family which provides a wide range of security functions for embedded platforms. As the leader of Trusted Computing solutions, Infineon offers a broad range of products meeting your specific requirements.

Current applications of IoT include healthcare systems, buildings and home automation, as well as transportation. As the wearable market expands, Yageo provides high reliability for current sensors and high precision in thin film resistors to meet this increasing need.

Security and Functionality All OPTIGA TPM products are based on Infineon’s advanced hardware security technology. The products are designed according to the Trusted Computing Group (TCG) specifications and are Common Criteria certified1 to EAL4+. The security functions include system and data integrity, authentication, secured communication, secured data storage and secured updates. ™

Performance and Power Implemented on a 16-bit state-of-the-art security controller from Infineon, the products meet the latest Microsoft Windows boot time and performance criteria. Furthermore the products are supported in Linux OS and derivates. A sleep current of down to 110μA allows smooth integration into a broad range of devices requiring power efficient battery operated designs. The OPTIGA TPM family supports an improved commercial temperature range as standard (-20°C to +85°C) as well as an extended temperature range (-40°C to +85°C) for industrial applications. The OPTIGA™ TPM is available in TSSOP-28 package or the small VQFN-32 package (5 x 5mm2), which saves precious board space on your mobile platforms. Migrate to TCG TPM 2.0 Today Leading the way into the future, Infineon is the first provider offering a TPM 2.0 product according to the latest specification. With this early expertise we support your smooth transition to the new standard. Fully Certified and State-of-The-Art Security For new products of the Infineon OPTIGA™ TPM family, the Common Criteria certification is a key focus. As the first and still leading the list, Infineon had its TPMs listed on the official TCG product list showing that the TCG TPM standard is fulfilled. Infineon is a driver in the Trusted Computing Group (TCG), the standardization organization formed to develop open, vendor-neutral, global industry standards for hardware security. With an Infineon representative serving as the TCG president and a strong presence and chairs in various working groups, Infineon is working on future security standards and driving innovation. To buy products or download data, go to www.FutureElectronics.com/FTM

6

The PA series, with high power, is used mostly in power, networking and automotive applications. The PE series is used mostly in smartphones, tablets, battery-power and LED lighting applications.

PE and PA current sensors offer accurate direct current measurement while protecting the circuit from excessive current.

Thin Film Resistors (RT/AT series) • Case size: 0201 to 2512 (RT), 0402 to 1206 (AT) • High precision and high stability • Superior resistance against sulfur-containing environment • AEC-Q200 compliant (AT) • Low TCR, low electrical noise

RT and AT thin film resistors feature high precision RT with superior TCR (down to ±5ppm/°C) and enhanced stability that is ideal for audio, telecommunications, medical and industrial test & measurement equipment.

FEATURES • Standardized security controller • TCG certified products • Products with TPM 1.2 and 2.0 • Standard and extended temperature range (-40°C to +85°C) • Firmware upgrade capability • SPI, I2C and LPC interface • VQFN-32 and TSSOP-28 package • CC and FIPS certification

Extended Temperature Range and Packages ™

Current Sensors (PA/PE series) • Case size: 2512 (PA), 0201 to 2512 (PE) • Low TCR, automotive grade metal current sensors

The RT series is often used in smart meters, intelligent homes and inverters. The AT series can be found in automotive and general industrial applications.


BENEFITS • Innovative security solutions provided by the market leader • High confidence level based on Common Criteria certification • Easy integration based on standardization

Introducing ZNEO32!

APPLICATIONS

Zilog’s Line of 32-bit Cortex-M3 based Programmable Motor Controllers

• Notebooks/PCs/tablets/servers • Networking components • Industrial automation • Single board devices • Home automation • Automotive

ZNEO32! uses high performance 32-bit computing, 3-phase PWM generators, and high speed ADC units to provide an effective, low cost system solution for motor applications.

OPTIGA™ TPM This family builds a root of trust in PC, mobile and embedded solutions based on the Trusted Computing Group specifications. SLB 9645

2

SLB 9665

SLB 9670

SLB 9670

TPM 1.2

TPM 1.2

TPM 2.0

TPM 1.2

TPM 2.0

I C interface

LPC interface

LPC interface

SPI interface

SPI interface

Based on common criteria certified code

Common criteria certified



Common criteria certified (pending)

2

1

SLB 9660

2

The Trusted Computing Group (TCG) specifications for the standardized TPM v1.2 only consider LPC and SPI interfaces. The I2C interface is not part of the TCG defined specification. The SLB 9645 is built on the TCG compliant, EAL4+ certified TPM hardware and firmware, with the addition of I2C support.

2

Product versions for Chrome OS available


Part Number

Core

Flash

SRAM Max. Freq.

Z32F06410AES Z32F06410AKS Z32F12811ARS Z32F12811ATS Z32F38412ALS Z32F38412ATS

Cortex-M3 Cortex-M3 Cortex-M3 Cortex-M3 Cortex-M3 Cortex-M3

64KB 64KB 128KB 128KB 384KB 384KB

8KB 8KB 12KB 12KB 16KB 16KB

48MHz 48MHz 72MHz 72MHz 72MHz 72MHz

ADC Resolu on 12-bit x 2-unit 12-bit x 2-unit 12-bit x 3-unit 12-bit x 3-unit 12-bit x 2-unit 12-bit x 2-unit

Speed 1.5MS/s 1.5MS/s 1.5MS/s 1.5MS/s 1.5MS/s 1.5MS/s

Key Features: • High performance low-power Cortex-M3 core • 64KB, 128KB, or 384KB code flash • Memory with cache func on • 8KB, 12KB, or 24KB SRAM • 3-Phase PWM with ADC triggering func on (1-2 channels) • 1.5Msps high speed ADC with sequen al conversion func on • Watchdog mer • External communica on ports • Six general purpose mers • Industrial grade operang temperature (-40°C ~ +85°C) Typical Applicaons: • BLDC/PMSM motors • Outdoor air condioners • Washing machines • Refrigerators For more information or to buy products, go to www.FutureElectronics.com/FTM

TIMERS 6-16bit 6-16bit 6-16bit 6-16bit 10-16bit + FRT 10-16bit + FRT

UART SPI 2 2 2 4 4 4

1 1 2 2 2 2

I2C

MPWM

ADC

I/O Ports

Pkg.

1 1 2 2 2 2

1 1 2 2 2 2

2-unit 11 ch 2-unit 8 ch 3-unit 16 ch 3-unit 16 ch 2-unit 16 ch 2-unit 16 ch

44 28 48 64 86 64

48 LQFP 32 LQFP 64 LQFP 80 LQFP 100 LQFP 80 LQFP

ZNEO32! Evaluaon Kits Z32F0640100KITG

ZNEO32! 64K Evalua on Kit

Z32F1280100KITG

ZNEO32! 128K Evalua on Kit

Z32F06410AxS Block Diagram JTAG/SWD

POR

Cortex-M3

DMA 4Ch

CACHE FLASH 64KB BOOTROM

MOSC (4/8Mhz Xtal)

VDC/LVD (1.8V)

PLL

12bit ADC x2 (1.5Msps) 3-Phase PWM x1

AHB MATRIX SRAM 8KB

APB GPIO

SYSCON

UART x2

WDT

SPI x1

TIMER X6

12C x1


Semtech’s LoRa® products enable the

EZ-BLE™ PSoC® Module SWD/ GPIO

EZ-BLE PSoC Module is a fully integrated, fully certified, 11 x 11 x 1.8mm, programmable, Bluetooth Smart or Bluetooth Low Energy (BLE) module designed for ease-of-use and reducing time-to-market. It contains Cypress’s PSoC 4 BLE chip, two crystals, antenna, shield and passive components. EZ-BLE PSoC Module provides a simple and low cost way to add a microcontroller, CapSense® touch controller and Bluetooth Smart connectivity to any system. EZ-BLE PSoC Module integrates programmable analog and programmable digital blocks to enable sensor-based designs for IoT products.

5

Power/ Ground

2

EZ-BLE™ PSoC® Module 32.768kHz Crystal

23

PSoC®4 BLE XRES

LPCOM/OPAMP SPI/I2C/ UART/ CapSense®/ ADC/ PWM/GPIO

Trace Antenna

24MHz Crystal

VREF

Energy Harvesting PMIC and EZ-BLE Target Tiny Battery-Free IoT Devices Cypress’s S6AE101A/102A/103A Power Management ICs (PMICs) for energy harvesting are the industry’s lowest power devices, enabling the use of very small solar cells for battery-free BLE IoT devices such as wireless sensor nodes.

Primary Battery (Optional)

Energy Harvesting PMIC Power Gating Switch

Multiplexer

System Load2

Storage Control

Series Solar Cell

The devices require a very small quiescent current of 250nA and startup power of 1.2μW, and integrate system level features such as an LDO, comparator and auxiliary battery support. As a result, a light powered BLE Beacon or wireless sensor node can have a footprint as small as 1cm2.

System Load1

SW_CONT/ COMPOUT

Over-Voltage Portection

VIN_LDO

Control Block

ENA_COMP ENA_LDO STBY_LDO

Timer for Power Gating Switch Control

INT

VOUT_LDO LDO

Vref

Cypress’s S6SAE101A00SA1002 Solar Powered IoT Device Kit includes an S6AE101A energy harvesting PMIC and an EZ-BLE PRoC Module. It offers everything needed (including design example firmware) to develop a light-powered BLE IoT device.

COMPP COMPM

Comparator

CIN0

CIN1

CIN2

Comparing IoT Memory Types In IoT applications, Flash and EEPROMs are the prevalent memories used for data storage, mainly attributed to the low cost per megabit and larger densities available. However, floating gate technologies have a drawback in terms of energy consumption when writing frequently – it drains batteries faster.

Serial Nonvolatile Memory Technology Comparison: Features Operating voltage SPI speed

Cypress 2Mb F-RAM

2Mb EEPROM

2Mb NOR Flash

4Mb MRAM

2.0V to 3.6V

1.8V to 5.5V

2.7V to 3.6V

3.0V to 3.6V

40MHz

5MHz

75MHz

50MHz

10,611,178

6606

11

5000

10

Unlimited

Many developers partition Flash (which is by far the cheapest memory per bit) or use an EEPROM that consumes less energy (i.e., write infrequently to Flash and use EEPROM as a front-end for heavy writes). EEPROM standby and active modes consume lower currents than Flash.

Energy (µJ)/1-byte write

314

63996

Bandwidth (KB/s)

5000

25

Write endurance (Cycles)

10

1.2 x 10

The ideal play for write intensive applications is an external serial interface F-RAM (which has addressing capability), high speeds (40MHz SPI) and low active energy consumption (typically less than 100uA/MHz) and is available in up to 4Mb densities.

Lifetime at 5ms write frequency

15,855 years

100 minutes

8.3 minutes

Unlimited

No. of writes with 3V, 220mAh battery

7,552,985

37,127

2,239

359,666

Nonvolatile retention

100 years

100 years

20 years

20 years

Active write current

3mA at 40MHz

3mA at 5MHz

15mA at 75MHz

46.5mA at 50MHz


14

6

5

Write energy in µJ consumed by different memory types

8


For more information or to buy products, go to www.FutureElectronics.com/FTM


APPLICATION SPOTLIGHT MS5525DSO: Save Space with Fully Calibrated Pressure and Temperature Sensor in a Small Package

High Performance Sub-1 GHz Radio Devices core with 64kB Flash, 8.25kB RAM, and sleep current consumption of 500nA to 1500nA. ON Semiconductor’s Sub-1 GHz product family provides an easy entry to high performance wireless connectivity for the Internet of Things (IoT). ON Semiconductor Sub-1 GHz RF products are designed to provide maximum performance and minimum power consumption for every major wireless sub-1 GHz standard. These solutions combine high performance RF and baseband components, ultra low power microcontroller technology and support for high performance firmware stacks on one chip. The AX5043 radio transceiver is the leading sub-1 GHz transceiver for data rates ranging from 0.1kbps to 125kbps, covering Sigfox, KNX, Wireless M-Bus, and EnOcean standards. Also available is the AX5051 radio transceiver, supporting the high data rates required for 802.15.4, ZigBee, and 6LowPAN. The AX8052F1xx family combines the superb performance of ON Semiconductor wireless transceivers and an ultra low power microcontroller

ON Semiconductor high performance radio products are a driving force behind the IoT infrastructure, enabling users quick and easy access to Sigfox, POCSAG, and FLEX networks. The ready-to-use devices AX-SFEU, AX-SFUS, AX-WMEU, and AX-EOEU are pre-programmed for the chosen standard and come with an AT user interface. To simplify the entry into wireless solutions, ON Semiconductor provides modules and a comprehensive suite of development kits with supporting application generator software. FEATURES • 27MHz to 1050MHz carrier frequency range • 6.5mA to 11mA receive current • ASK, FSK, PSK, AM, FM, AFSK, MSK, OQPSK modulations supported • Shaping for all modulation (GFSK, GMSK, shaped ASK and PSK) • RF transceiver, RF MCU, RF modules To buy products or download data, go to www.FutureElectronics.com/FTM

The MEAS MS5525DSO from TE Connectivity (TE) is a new generation of digital small outline pressure sensors with SPI and I2C bus interface designed for high volume OEM users.

APPLICATIONS • Sigfox, POCSAG, FLEX IoT applications • EnOcean, Wireless KNX, Wireless M-Bus • ZigBee, 6LowPAN system (with AX5051) • Automatic meter reading • Home building automation, IoT and security TOOLS • AXRadioLAB application generator • AXcode Blocks IDE • DVK-BASE-2-GEVK development kit • F143-MINI-GEVK development kit • AX-SIGFOX-GEVK development kit

Temperature and Relative Humidity Modules

HM1500LF: Relative Humidity Module Based on the rugged HS1101LF capacitive humidity sensor, TE Connectivity’s (TE) HM1500LF is a dedicated humidity transducer designed for OEM applications where a reliable and accurate measurement is needed. Direct interface with a microcontroller is made possible with the module’s linear voltage output. HM1500LF SPECIFICATIONS • Small size product • Product free from Lead, Cr(6+), Cd and Hg • Humidity calibrated within ±2% @55% RH • Typical 1Vdc to 3.6Vdc output for 0 to 100% RH at 5Vdc supply • Ratiometric to voltage supply from 4.75Vdc to 5Vdc • Patented solid polymer structure HM1500LF

10

HTM2500LF SPECIFICATIONS • Hermetic housing • Humidity calibrated within ±2% @55% RH • Temperature measurement through NTC 10kΩ ±1% direct output • Small size product • Typical 1Vdc to 4Vdc output for 0 to 100%RH at 5Vdc

This new sensor module generation is based on leading MEMS technology and latest benefits from TE's proven experience and know-how in high volume manufacturing of pressure modules, which have been widely used for over a decade. The rugged engineered thermoplastic transducer is available in single and dual port configurations, and can measure absolute, gauge, compound, and differential pressure from 1psi to 30psi.

FEATURES • Integrated digital pressure sensor (24-bit ΔΣ ADC) • Fast conversion down to 1ms • Low power, 1μA (stand-by