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AMERICAS’ EDITION

JULY/AUGUST

2017

PRODUCT AND TECHNOLOGY NEWS FROM FUTURE ELECTRONICS

APPLICATION SPOTLIGHT:

INDUSTRIAL AUTOMATION

ON Semiconductor A New Modular Approach to Industrial IoT PAGE 8

Digi XBee Cellular LTE CAT-1 ®

PAGE 9

STMicroelectronics Increase Your System Efficiency with 1200V SiC Diodes PAGE 13

TE Connectivity DEUTSCH Connectors PAGES 14 - 15

View the Maxim Integrated Design Note on Sensors. See pages 24 - 25 View the Nexperia Design Note on LFPAK MOSFETs. See page 26

TABLE OF CONTENTS APPLICATION SPOTLIGHT Cypress Semiconductor Renesas Renesas ON Semiconductor Digi Linx Technologies Vishay Infineon STMicroelectronics Hirose TE Connectivity SCHURTER CUI Inc. Altech Corporation Triad Magnetics Susumu Mallory Sonalert VARTA Future Electronics

Cypress Industrial Solutions Fully Integrated Platform Eases Industrial System Design Industrial IoT Networking Simplified A New Modular Approach to Industrial IoT XBee® Cellular LTE CAT-1 Robust, Weatherized Industrial Dipole Antennas for Industrial Use Solutions for Industrial Power Applications PROFET™ 24V Protected Switch Shield with Arduino Increase Your System Efficiency with 1200V SiC Diodes LF Circular Connectors DEUTSCH Connectors Quick Assembly for 600V Fuseholder Designed for Harsh Environments Ultra-Compact Open Frame AC/DC Power Supplies are Ideal for Space-Constrained Applications Broad Line of Power Supplies Power Magnetics Muscle for Industrial Automation Equipment World’s Smallest Low Noise Current Sensing Resistor Adds to Their Lineup of Speakers Ready-to-Use Lithium Rechargeable Batteries Analog Corner

3 4-5 6-7 8 9 10 11 12 13 13 14-15 16 18 18 20 22 22 23 28-29

DESIGN NOTES Maxim Integrated Nexperia

Pack More Punch in Your Small Sensor While Keeping It Cool Using an LFPAK MOSFET to Switch 200A

24-25 26

TECHNICAL VIEW Future Electronics

Graphics Display-Based Human-Machine Interfaces: the New Capabilities of the Latest MCUs

30-31

ADS Future Electronics Future Lighting Solutions Future Electronics Future Electronics Future Lighting Solutions

For Every Facet of Your Business Exclusive. Extraordinary. FREE. Nothing Else Matters if You Are Missing the Part Learn How You Can Leverage Future Electronics’ System Design Center Making LED Lighting Solutions Simple™

17 19 21 27 32

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Most products featured in FTM are available in engineering quantities. For more information or to buy products herein, go to www.FutureElectronics.com/FTM. For immediate access to the WORLD’S LARGEST AVAILABLE-TO-SELL INVENTORY go to www.FutureElectronics.com.

Cypress Industrial Solutions Cypress’ product portfolio empowers the formation of the Industrial IoT and the transition to Industry 4.0. Next-generation industrial devices require the highest performance, most energy efficient, and most secure microcontrollers, radios and memories. And that is exactly what Cypress offers our customers. Learn more below about how Cypress MCU, Connectivity, and Memory solutions are solving the Industrial Problems of tomorrow. CYPRESS SIMPLIFIES DESIGN OF ADVANCED MOTOR CONTROL SYSTEMS

CYPRESS BLE SOLUTIONS PROVIDE LONG RANGE CONNECTIVITY IN INDUSTRIAL IoT APPLICATIONS

The PSoC® 4 Motor Control EVK (CY8CKIT-037) is an ideal development platform for designing motor control applications including BLDC motors, PMSM motors, and Stepper motors. This kit comes equipped with example projects including support for FOC, BLDC, and Stepper motor control techniques/algorithms. Utilize this dev kit with the PSoC 4 Pioneer Kit (CY8CKIT-042) and Cypress’ EVK User Guide to easily design advanced motor control solutions.

Long range BLE connectivity in devices on a large factory floor can help greatly reduce the preexisting time an equipment issue exists before it is addressed. Cypress’ new EZ-BLE™ PRoC™ BT 4.2 Long-Range Modules are turnkey solutions for these types of industrial IoT applications that require long range communication. The modules are fully-qualified (Bluetooth 4.2), fully-certified (FCC, IC, TELEC, KCC, CE) and integrate a PA (for 7.5 dBm output TX power) and an LNA (for up to -93 dBm receive sensitivity), along with 3 different antenna options.

CYPRESS FL-L NOR FLASH ENABLES INDUSTRIAL APPLICATIONS WITH ENHANCED SECURITY AND RELIABILITY Cypress’ FL-L 3.0-V Quad SPI NOR Flash memory provides the highest reliability, enhanced security and 67 MBps read bandwidth even at an extended temperature range of -40°C to +125°C to match the operating ambient temperatures of various machines, industrial, equipment, etc. on a factory floor. Cypress applies stringent testing and qualification processes to ensure all parts meet our world-class quality requirements.

Module MPN

Size

Antenna Type

CYBLE-212006-01

15 x 23 x 2.00mm

PCB Antenna

CYBLE-202007-01

15 x 23 x 2.05mm

Ext. Antenna via u.FL Connector

CYBLE-202013-11

15 x 23 x 1.55mm

Ext. Antenna via RF Pad

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Register at www.FutureElectronics.com/FTM/Register Accuracy of technical data: All technical data, information, detachable insert(s) or loose advertisement(s) contained in this magazine is derived from information provided by Future Electronics’ suppliers. Such information has not been verified by Future Electronics and we make no representation, nor assume any liability as to its accuracy. Future Electronics does not assume liability in respect to loss or damage incurred as a consequence of or in the connection with the use of such data and information. Prices subject to change without notice. ®Delight the Customer is a registered trademark of Future Electronics.

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RENESAS SYNERGY ™ PLATFORM

Performance, scalability and security geared to the demands of industrial system design

FULLY INTEGRATED PLATFORM EASES INDUSTRIAL SYSTEM DESIGN Industrial system design has become more challenging due to increased system complexity, higher levels of software integration, and connectivity and security requirements – along with shorter development cycles. Developed for industrial applications, the Renesas Synergy Platform is a complete and qualified ARMbased solution that accelerates embedded development, inspires innovation, and enables differentiation.

Technology

Synergy ARM ® Cortex ®

ARM ® Cortex ®

Performance

The Synergy Software Package (SSP) is the centerpiece of the Renesas Synergy Platform. Ideally suited for the unique requirements of industrial systems, the SSP includes a complete RTOS and protocol stacks, an application framework, and underlying drivers. It is fully integrated and qualified and is supported and fully warranted by Renesas. The SSP requires no license fees, no royalties, and can be used for an unlimited number of projects and products in development.

Synergy Software

ThreadX® RTOS

Software Add-Ons Stacks Algorithms Functions

...and more

Synergy Microcontrollers Synergy Solutions

M4

M0+ 32 MHz

1.6V-5.5 V

M4

Memory

Analog

Timing & Control

HMI

Core

Connectivity

System & Power Management

Safety

Security & Encryption

M4

240 MHz 2.7 V-3.6 V

120 MHz 2.7 V-3.6 V

48 MHz

t40-nm and 130-nm processes tOperating temperature range: - 40ºC to 105ºC tFlash: 64 KB - 4 MB tSRAM: 16 KB - 640 KB tPin count: 36 - 224 tGPIO pins: Up to 172

Specialties

HAL Drivers

Synergy Tools & Kits

ARM ® Cortex ®

MCU Series

Flash Density

FileX® GUIX™ Application Functional USBX™ Framework Libraries ™ NetX NetX Duo™ BSP

ARM ® Cortex ®

Microcontrollers

1.6 V-5.5 V

Software APIs Synergy Software Package (SSP)

built in to establish rock-solid security, ensure dependable safety, ease connectivity, and facilitate human-machine interface creation. The Renesas Synergy Platform is the best choice for developing an industrial system platform that can be updated, secured, and maintained for years.

A high-quality product needs to be built on a high-quality foundation. With a wide range of performance and features, Renesas Synergy microcontrollers (MCUs) can meet the scalability, power consumption, and performance needs of nearly any end-product using embedded system control. Designed for the specific needs of the industrial market, Renesas Synergy MCUs have features

Synergy Gallery

RTOS and middleware. It‘s all included with the Renesas Synergy Platform. The Synergy Platform integrates Express Logic’s popular ThreadX® real-time operating system. This RTOS ensures reliable system operation, supports an API that allows portability across Synergy MCUs, and minimizes the length of system development cycles. ThreadX RTOS features an extremely fast, commercial multitasking real-time kernel with preemptive scheduling and a small memory footprint.

Express Logic’s ThreadX RTOS Features

Renesas Synergy Software Package – Fully verified and guaranteed based on ISO/IEC/IEEE 12207 standards Reliability and sustainability are key aspects of industrial system design. Realizing this, Renesas is the first MCU supplier that qualifies both MCUs and software. The Renesas Synergy Software Package is fully verified and guaranteed according to the Software Quality Assurance (SQA) process based on ISO/IEC/IEEE 12207 standards – which warrants complete SSP operation against specifications in the SSP software datasheet. Furthermore, the Synergy Software quality process is completely verifiable because it uses quantifiable metrics to measure and track software quality. Download Renesas Synergy Literature: – Synergy Software Quality Handbook – Synergy Software Quality Summary

www.renesas.com/products/synergy/software/quality.html

! Small FLASH footprint – Less than 2 KB on Synergy processor families ! Small RAM requirements – Minimum of 20m cable length BTT6010-1EKB BTT6030-2EKB

10 30

22 64

10 2x4

86 60

1 2

DSO-14 DSO-14

BTF6070-2EKV

70

120

2 x 2.3

11

2

DSO-14

12

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APPLICATION SPOTLIGHT

APPLICATION SPOTLIGHT

TE Connectivity’s DEUTSCH Connectors

TE Connectivity’s (TE) DEUTSCH industrial environmentally sealed electrical connectors are heavy-duty connectors designed to withstand dirt, moisture, salt spray, and rough terrain. DEUTSCH connectors are constructed of rugged thermoplastic or durable aluminum and feature silicone seals and grommets that help prevent contamination. The connectors are available in rectangular and cylindrical body shapes and accommodate wire gauges from 4AWG to 22AWG (25mm2 to 0.35mm2). DEUTSCH connectors are offered in cavity arrangements from 1 to 128 and with in-line, flange, and PCB mount options. The connectors utilize contacts that can be used interchangeably across several DEUTSCH connector product lines, which helps improve performance, reliability, and maintainability by reducing changes in the assembly of the wire harness. Several accessory items are also available to meet specific design requirements, including boots, gaskets, backshells, wire routers, and mounting clips. TE Connectivity’s DEUTSCH DT connectors are used in harsh environment applications where even a small degradation in connection may be critical. Thermoplastic housings offer a wide operating temperature range and silicone rear wire and interface seals allow the connectors to withstand conditions of extreme temperature and moisture. The DEUTSCH DT general purpose connectors provide reliability and performance on the engine or transmission, under the hood, on the chassis, or in the cab. The DT offers the designer the ability to use multiple size 16 contacts, each with 13A continuous capacity, within a single shell. FEATURES • Accepts contact size 16 (13A) • 14AWG to 20AWG (2.50 to 0.50mm2) • 2, 3, 4, 6, 8, and 12 cavity arrangements • In-line, flange, or PCB mount • Rectangular, thermoplastic housing • Integrated latch for mating • Wedgelocks confirm contact alignment and retention TE Connectivity’s DEUTSCH DTP connectors provide solutions for higher power

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application requirements. The connectors are made of rugged thermoplastic and feature silicone rear wire and interfacial seals that allow the connectors to withstand harsh environments. The DEUTSCH DTP connectors offer the designer the ability to use multiple size 12 DEUTSCH contacts, each with a 25A continuous capacity, within a single shell. DTP connectors are currently available in two and four pin configurations. The connectors can be mounted in-line, flanged, and used for PCB mount applications. For power applications that face extreme conditions, TE’s DEUTSCH DTP connectors offer a rugged, reliable, and easy-to-use solution. FEATURES • Accepts contact size 12 (25A) • 10AWG to 14AWG (6.00 to 2.00mm2) • 2 and 4 cavity arrangements • In-line, flange, or PCB mount • Rectangular, thermoplastic housing • Integrated latch for mating • Wedgelocks confirm contact alignment and retention TE Connectivity’s DEUTSCH DTM connectors are designed for cableto-cable and cable-to-board harsh environment applications. The connectors are available in 2, 3, 4, 6, 8, and 12 configurations. Each contact carries a 7.5A continuous capacity, filling the design requirements for lower amperage, multipin connections. They can be mounted in-line, flanged, and used for PCB mount applications. The connectors are made of rugged thermoplastic and feature silicone rear wire and interfacial seals that allow the connectors to withstand conditions of extreme temperature and moisture. For smaller wire gauge applications that are exposed to harsh environments, TE’s DEUTSCH DTM connectors are a reliable and proven solution. FEATURES • Accepts contact size 20 (7.5A) • 14AWG to 22AWG (2.50 to 0.35mm2) • 2, 3, 4, 6, 8, and 12 cavity arrangements • In-line, flange, or PCB mount • Rectangular, thermoplastic housing • Integrated latch for mating • Wedgelocks confirm contact alignment and retention TE Connectivity’s DEUTSCH DRB connectors are designed for harsh environment bulkhead applications. They are designed to accommodate multiple wire gauges

and feature high pin counts, including 48, 60, 102, and 128 cavities. Several mounting flange options and wire arrangements are available. DEUTSCH DRB connectors are suited for on- and off-highway applications, and the marine, industrial, and agriculture markets. FEATURES • Accepts contact sizes 4 (100A), 8 (60A), 12 (25A), 16 (13A), and 20 (7.5A) • 6AWG to 22AWG (16.00 to 0.35mm2) • 48, 60, 102, and 128 cavity arrangements • Flange mount • Rectangular, thermoplastic housing • Jackscrew for mating • Wedgelocks confirm contact alignment and retention TE Connectivity’s DEUTSCH DRC connectors are designed for off-road, heavy-duty industrial, recreational, and agricultural applications. The environmentally sealed, rectangular shaped DEUTSCH DRC connectors are offered with insert arrangements of 24, 40, 50, 60, 64, 70, and 76 cavities that accept size 16 and 20 DEUTSCH contacts. Several mounting options are available including in-line, flange mount, and PCB mount. FEATURES • Accepts contact sizes 16 (13A), and 20 (7.5A) • 14AWG to 22AWG (2.50 to 0.35mm2) • 24, 38, 40, 50, 60, 64, 70, and 76 cavity arrangements • In-line, flange, or PCB mount • Rectangular, thermoplastic housing • Jackscrew for mating TE Connectivity’s DEUTSCH HD10 connectors are environmentally sealed, thermoplastic cylindrical connectors that are offered in arrangements from 3 to 9 cavities. These rugged connectors are designed to withstand the harsh environments of the trucking, agricultural, marine, mining, and construction industries. DEUTSCH HD10 connectors are heavily used for diagnostic connections and are available for either in-line or flanged mounted applications. HD10 connectors are offered with several modifications to enhance the design flexibility and meet application specific needs.

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FEATURES

FEATURES • Accepts contact sizes 4 (100A), 12 (25A), and 16 (13A) • 6AWG to 20AWG (16.00 to 0.50mm2) • 3, 4, 5, 6, and 9 cavity arrangements • In-line, flange, or PCB mount • Circular, thermoplastic housing • Coupling ring for mating TE Connectivity’s DEUTSCH HD30 connectors are constructed from a rugged aluminum shell developed to meet the needs of the heavy-duty truck, bus, and off-highway industries. These metal connectors offer multiple pin configurations that accept DEUTSCH contact sizes 4 through 20. DEUTSCH HD30 connectors are circular shaped and feature quick connectdisconnect bayonet couplings, silicone seals, and a rear insertion/rear removal contact system. The HD30 connectors also include adapter and cable clamp modifications that support the wires while reducing strain on the connectors. FEATURES • Accepts contact sizes 4 (100A), 8 (60A), 12 (25A), 16 (13A), and 20 (7.5A) • 6AWG to 22AWG (13.00 to 0.35mm2) • 2, 6, 8, 9, 14, 16, 18, 19, 20, 21, 23, 29, 31, 33, 35, and 47 cavity arrangements • In-line or flange mount • Circular, aluminum housing • Coupling ring for mating TE Connectivity’s DEUTSCH HDP20 connectors are a versatile connector solution for harsh environment applications in the construction, mining, marine, and agricultural industries. These heavy-duty thermoplastic, circular shaped connectors feature quick connectdisconnect bayonet couplings, silicone seals, and a rear insertion/rear removal contact system. They are offered in two plastic shell sizes and in nineteen different configurations. The configurations range from 2 to 47 cavities and accommodate multiple size contacts and wire sizes inside of a single shell. DEUTSCH HDP20 connectors are available with several modifications and accessories to enhance design flexibility and to meet an application’s specific needs.

• Accepts contact sizes 4 (100A), 8 (60A), 12 (25A), 16 (13A), and 20 (7.5A) • 4AWG to 22AWG (25.00 to 0.35mm2) • 2, 6, 7, 8, 9, 14, 16, 18, 19, 20, 21, 23, 29, 31, 33, 35, and 47 cavity arrangements • In-line or flange mount • Circular, thermoplastic housing • Coupling ring for mating TE Connectivity’s DEUTSCH STRIKE connectors feature a lever lock system and are designed for heavy-duty equipment applications. DEUTSCH STRIKE connectors are available in two different sized rugged housings. The connectors are available in 32 and 64 cavities that accept size 16 and 20 DEUTSCH contacts. For applications that require a heavy-duty rated, environmentally sealed multi-pin connector, DEUTSCH STRIKE connectors are a rugged solution. FEATURES • Accepts contact sizes 16 (13A) and 20 (7.5A) • 14AWG to 22AWG (2.50 to 0.35mm2) • 32 and 64 cavity arrangements • In-line, flange, or PCB mount • Square, thermoplastic housing • Lever for mating • TPA confirms contact alignment and retention APPLICATIONS for DEUTSCH DT, DTP, DTM, DRB, DRC, HD10,HD30, HDP20 AND STRIKE

• Truck, bus, off-highway, construction, agriculture, mining, emergency vehicles, forestry, recreational marine, motorcycle TE Connectivity’s DEUTSCH Common Contact System contacts are used interchangeably across most DEUTSCH connector product lines. This commonality improves performance, reliability, and maintainability by reducing changes in the assembly of the wire harness. The use of the same contact system helps eliminate many of the failures reported in harnesses where hundreds of different terminations are used. Two styles of contacts are available: solid and stamped and formed. Both contact types use a crimp style termination, eliminating the need for solder. The variations in the contact system are those dictated by wire gauge and contact style. JIFFY SPLICES protect connections from dirt, dust, and water immersion up to three feet. They are made from the same high-quality silicone elastomer as TE’s DEUTSCH industrial connector

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seals and grommets. JIFFY SPLICE bodies house a contact retention system that secures a mated pair of contacts in a compact environmentally sealed unit. JIFFY SPLICES accept one DEUTSCH pin and socket and are available in two sizes. The JS-12-00 accepts size twelve DEUTSCH contacts (25A) and utilizes 10AWG to 14AWG. For 14AWG to 20AWG wire, the JS-16-00 accepts size sixteen DEUTSCH contacts (13A). FEATURES • Accepts contact sizes 16 (13A) or 12 (25A) • 10AWG to 20AWG (6.00 to 0.50mm2) • 1 cavity arrangement • In-line • Cylindrical, silicone elastomeric body TE Connectivity’s DEUTSCH DTHD connectors are for applications that require heavy duty single terminal connections. Easy to install, environmentally sealed and compact in size, they are a simple, field serviceable alternative to a splice. DEUTSCH DTHD connectors are available in three sizes, carry 25A to 100A, and can be mounted or used in-line. DEUTSCH DTHD connectors are offered with end cap and flange mount modifications to enhance design flexibility and meet application specific needs. For single terminal connections, DEUTSCH DTHD connectors are a rugged, reliable, and easy-to-use solution. FEATURES • Accepts contact sizes 4 (100A), 8 (60A), and 12 (25A) • 6AWG to 14AWG (16.00 to 2.00mm2) • 1 cavity arrangement • In-line or flange mount • Circular, thermoplastic housing • Integrated latch for mating APPLICATIONS for JIFFY SPLICES AND DEUTSCH DTHD

• Truck, bus, off-road vehicles

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DEUTSCH, TE Connectivity and TE connectivity (logo) are trademarks.

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APPLICATION SPOTLIGHT Quick Assembly for 600V Fuseholder Designed for Harsh Environments

FOR EVERY FACET OF YOUR BUSINESS

SCHURTER’s new FUS series shock-safe, snap-in, panel mount fuseholder is designed with high current/voltage ratings and an ingress degree of protection rating of IP67. The dust and waterproof fuseholders are the first to be especially suited for equipment used in harsh environments. The robust fuseholder family FUS is rated 16A at 500VAC according to IEC and up to 32A at 600VAC/VDC according to UL/CSA. Rated power acceptance is 4W/16A at Ta +23°C with an admissible ambient air temperature of -40°C to +85°C. Made of halogen-free plastic, the new FUS has metal panel mount snap-in brackets that facilitate quick assembly; they also act as heat dissipaters during operation. An optional plastic insulation sleeve is available. Wires are terminated with quick-connect or solder connections. The newly styled fuse carriers accept 5 x 20mm or 6.3 x 32mm fuses, and provide slot or finger grip removal of the carrier for fuse replacement. The FUS series fuseholders can be used wherever applications are exposed to potentially adverse environmental influences, such as equipment exposed to outdoor weather, or equipment exposed to oil and chemical, marine, laboratory and mining environments. The fuseholder is also highly suitable for use in medical and food service or production equipment subject to cleaning. The FUS series complies with the increased glow-wire material requirements outlined in the new IEC 60127-6 Edition 2.0 and IEC 60335-1 standards developed for unattended devices in use. The fuseholder standard IEC/EN 60127-6 Edition 2.0 has been revised to improve fire safety. Effective October 2017, manufacturers of fuseholders will only be permitted to market products that have been tested and authorized in accordance with the updated standard. Look to SCHURTER fuseholders as well as power entry modules with freeholders to meet this new standard by the October deadline.

TECHNICAL DATA • Fuseholder according to IEC/EN 60127-6 Edition 2.0 and UL4248-1 • Rated specifications: IEC 16A at 500VAC (4W)/UL 32A at 600VAC/VDC • Quick-connect connections 6.3 x 0.8mm or solder connections • Ambient temperature: -40°C to +85°C APPLICATIONS • Equipment exposed to harsh industrial environments or the outdoors • Measurement, laboratory and medical equipment • Marine • Food service equipment • Robotics • Controls for mining and underground equipment To buy products or download data, go to www.FutureElectronics.com/FTM

Ingress Protection Rating

Cap

FUS Shock-Safe Fuseholder

IP67

FUS Shock-Safe Fuseholder

IP67

FUS Shock-Safe Fuseholder

Material Number

Description

0031.9156 0031.9157 0031.9158

Fuse Link Size

Terminals

Slotted

5 x 20mm

6.3 x 0.8mm Quick Connect

Slotted

6.3 x 32mm

6.3 x 0.8mm Quick Connect

IP67

Fingergrip

5 x 20mm

6.3 x 0.8mm Quick Connect

0031.9159

FUS Shock-Safe Fuseholder

IP67

Fingergrip

6.3 x 32mm

6.3 x 0.8mm Quick Connect

0031.9160

FUS Shock-Safe Fuseholder

IP67

Slotted

5 x 20mm

6.3 x 0.8mm Solder

0031.9161

FUS Shock-Safe Fuseholder

IP67

Slotted

6.3 x 32mm

6.3 x 0.8mm Solder

0031.9162

FUS Shock-Safe Fuseholder

IP67

Fingergrip

5 x 20mm

6.3 x 0.8mm Solder

0031.9163

FUS Shock-Safe Fuseholder

IP67

Fingergrip

6.3 x 32mm

6.3 x 0.8mm Solder

• • • • •

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APPLICATION SPOTLIGHT Ultra-Compact Open Frame AC/DC Power Supplies are Ideal for Space-Constrained Applications

CUI’s family of ultra-compact AC/DC power supplies is available in an open frame SIP package. The 3W and 5W configurations of the PBO series measure as small as 35 x 11 x 18mm (1.38 x 0.43 x 0.71in), allowing them to occupy less board real-estate than other power solutions. The 3W models are also available in low-profile, right-angle versions measuring as small 35 x 18 x 11mm (1.38 x 0.71 x 0.43in), making them ideal for applications where vertical board space is at a premium. Available with typical efficiencies up to 79%, the high density PBO series offers a wide input voltage range of 85VAC to 264VAC or 70VDC to

400VDC for high voltage DC/DC systems. Single output voltages of 3.3, 5, 9, 12, 15 and 24VDC are available depending upon the series. For use in challenging environments, the 3W models offer a wide operating temperature range of -40°C to +85°C while the 5W models provide a range from -25°C to +85°C. Additionally, all models are designed to provide 3,000VAC input to output isolation. The PBO series also meets UL60950-1/EN 60950-1 standards, complies with EN55022 Class B limits for conducted and radiated emissions and includes overcurrent and short circuit protections. The ultra-compact models are ideally suited for a variety of applications including industrial systems, automation equipment, security, telecommunications and smart home devices.

UPDATED VERSION 1.1 AVAILABLE DESIGN YOUR LUMINAIRE NOW! http://www1.FutureLightingSolutions.com/LSC FEATURES • Ultra-compact package • High density • Wide operating temperature range APPLICATIONS • Industrial systems • Automation • Security • Telecommunications • Smart home

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Exclusive. Extraordinary. FREE.

Over 20,000 Lighting Simulations Completed with Future Lighting Solutions’ Lighting System Creator Design Tool The Lighting System Creator is a free online design tool offered by Future Lighting Solutions which enables the user to seamlessly create an entire lighting system. Powered by a proprietary algorithm leveraging light source LM-80 data, the LSC automatically provides appropriate and application specific light sources based on value engineering principles, determines the optimal forward current and temperature to meet target flux, efficacy and L70 lumen maintenance values. • The LSC will optimize the temperature and current to minimize the LED count and suggest the most cost effective approach to meet target specifications using LEDs, COBs, and even modules and integrated light engines. • In cases where the user wishes to consider one specific type of light-source for the application, the user can now specifically select their preference versus being presented with all possible technical solutions. • The LSC now also includes light sources that do not yet have an available LM-80 report. This now enables users to consider recently released products for design consideration in to their fixtures. • The tool also includes an automatic offset that incorporates the efficiency impact of the integrated driver and/or integrated optic for modules and light engines when applicable.

www.FutureLightingSolutions.com

APPLICATION SPOTLIGHT Power Magnetics Muscle for Industrial Automation Equipment

Triad manufactures hundreds of power transformers, current sense transformers, power supplies and inductors for the heavyduty muscle equipment that gets the job done at industrial process plants and manufacturing facilities.

Our powerful magnetic components offer superior performance, rugged construction, high quality, long life and excellent value. Nearly all are UL approved and all are RoHS compliant. -C2 PC Mount Split Pack Class 2/3

VPS Chassis Mount Quick Connect

CST Current Sense Transformer

VPS Chassis Mount Transformers are chassis mount devices for higher power – up to 175 VA. They meet major U.S. and global standards (CSA, IEC and UL). They are among the industry’s most versatile transformers.

The CST 206/306 high frequency current sense transformer is ideal for industrial switching power supply applications. It’s built with a UL insulation system rated at 130°C and is available with a center tap option.

KEY SPECIFICATIONS

KEY SPECIFICATIONS

• Frequency: 50/60Hz • Electrical rating: 25 to 175 VA • Secondary voltage range: 5-230 VAC APPLICATIONS

APPLICATIONS

• Oil/gas instruments and equipment • Hi-temperature industrial conveyor ovens • Heat exchanger controls VPT Toroidal Transformers

With dual primaries, -C2 Split Pack™ Transformers are the only device of their type with TUV approval and are UL 5085-1 and 3 recognized. They utilize a Class F 155°C insulation system and can be used in myriad applications requiring inherently/ non-inherently limited transformers. KEY SPECIFICATIONS • Frequency: 50/60Hz • Electrical rating: 1.1 to 36.0 VA • Secondary voltage range: 5-56 VAC • HIPOT dielectric: 4200 VAC APPLICATIONS • Food and beverage equipment • Motor speed controls • Industrial controls • Timers To buy products or download data, go to www.FutureElectronics.com/FTM

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• Monitors current: 25A to 110A • Frequency: 20KHz to 200KHz • Turns: 50 to 300

• Switching power supplies • Inverters and converters • Industrial UPS AEU65 Series Power Supply

NOTHING ELSE MATTERS IF YOU ARE MISSING THE PART. VPT Transformers are cost effective with high power density and reduced magnetic fields. Approvals: UL 506, CE IEC 61558-1, and CE IEC 61558-2-6, Class B insulation (130°C). KEY SPECIFICATIONS • Frequency: 50/60Hz • Electrical rating: 25 to 2500 VA • Secondary voltage range: 6-230 VAC APPLICATIONS • Test equipment • Power systems equipment • Robotic production equipment

The AEU65 is a single output power supply designed for industrial devices requiring high reliability, and complies with European EMC (EN55022, Class B and EN61000-3-2) and low voltage directive (TUV EN60950). KEY SPECIFICATIONS • DC output voltage range: 3.3-48V • Output power: up to 65W • Efficiency: 81-87%

• • • • •

On-time delivery exceeding 99.5% Customizable inventory programs and supply chain solutions 13 point inspection for product receipt and quality Globally integrated IT platform showing real-time inventory visibility Largest available-to-sell inventory in the world

APPLICATIONS • Powering relays/actuators • Milling equipment • Stepper-motor power

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APPLICATION SPOTLIGHT

APPLICATION SPOTLIGHT

World’s Smallest Low Noise Current Sensing Resistor FEATURES

Their equivalent series inductance is so small that the signal integrity is preserved without adding extra noise. Susumu’s current sensors are also known to be the best in market in heat distribution and heat dissipation. Reduced Noise

APPLICATIONS

• Smallest for wattage • Excellent heat dissipation • Low ESL – low noise • Excellent current-surge tolerance • Offered in sizes: 0402-4320 • Resistance range 1mΩ to 100Ω • Resistance tolerance as low as ±0.5% • RoHS compliant • Offered in two configurations – longer and shorter side terminal 35 Temperature Increase Per Watt (°C/W)

In high frequency electronics, unwanted noise added by the components themselves can become a significant issue. In order to address this, Susumu offers longer side terminal low resistance chip current sensing resistors.

• Any application that requires current sensing raw resistance resistors such as protection and control circuits

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Temperature Increase by Power (°C/W)

30 Long-side terminal: Competitor’s

25 20

Short-side terminal: RL1220S-R10-F

15

Long-side terminal: PRL1220-R10-F

10

Picture 2 with long-side terminal

5 1

2

3 4 Applied Power (W)

5

6

Mallory Adds to Their Lineup of Speakers

MALLORY SONALERT PRODUCTS, INC.

These new speaker models support applications which require the use of low-frequency sounds, voice, or complex sounds. Most models feature a water-resistant mylar cone and represent a range of size, shape, and mounting options. New speakers include circular speakers (9 models) with diameters ranging from 10mm to 50mm and mounted speakers (5 models), which feature PC pins that can be inserted into PC boards and wave-soldered. Also included are square speakers

22

(2 models) with mounting brackets and low-profile square speakers (thicknesses of 2.5mm to 7mm), which can be press-fit onto a printed circuit board. Mallory Sonalert’s Vice President of Marketing, Dan O’Brien, explains, “One benefit of both the square speakers and the low-profile square speakers is the ease with which they can be integrated, keeping assembly time and cost low.” These new speakers are suitable for industrial, transportation, medical, computer, communications, and consumer applications.

These cylindrical and prismatic ready-to-use lithium rechargeable batteries incorporate cell protection features such as over-voltage, under-voltage and overcurrent. They comply with the requirements of battery safety standard UL 1642. Designing a Customized Battery Has Never Been So Easy CellPac BLOX is a design service that provides engineers the possibility to create a custom battery solution through the use of various standard battery cells and Protection Circuit Modules (PCMs). These combinations have been reviewed and safety tested by VARTA to ensure a good fit and function between the cells and electronics. CellPac PLUS Custom Lithium Rechargeable Design Service

New speaker series parts are now available for immediate purchase. (Note: New miniature electronic speakers are indicated by product numbers ending in K.) PSR10N08AK PSR12N08AK PSR1511N06S3K PSR1511N08S2.5K PSR1511N08S3.5K PSR1511N08S3K PSR15N08AK PSR1609N08S3K PSR1813N07S2.5K PSR20N08AK PSR3520F08S7K

The ready-to-use battery solutions allow design engineers to quickly and efficiently complete new product development. The VARTA Storage CellPac LITE product range is comprised of ready-to-use 3.7V Lithium Rechargeable batteries with capacities ranging from 595mAh to 2260mAh. Part of this offering is the EasyPack series of batteries that are comprised of Lithium Polymer cells which are the very latest in battery technology. CellPac LITE: A Range of Standard Lithium-Ion Preconfigured Packs Available for Various Applications

0

Picture 1 with shortside terminal

Ready-to-Use Lithium Rechargeable Batteries

PSR36N08AK PSR37N45SK PSR4028F08S11.5K PSR40N08AK PSR44N08AK PSR50F25SK PB-1517PK PB-1715PK PB-2315PK PB-3212PK PB-32N10W-12K

CellPac PLUS is VARTA Storage’s core design-to-manufacture battery design service. It was created to provide customers with the highest quality custom battery solutions. CellPac PLUS fits ideally to long-term high value projects where customized batteries are a must. • No design costs and minimal NRE • Quick samples of custom battery solution • Reduced time to market APPLICATIONS VARTA CellPac LITE and CellPac BLOX Products • Surgical lights • Dental lights • Blood pressure monitoring devices • Recorders • A variety of health monitoring devices • Suction units (CellPac LITE) • Nerve stimulation products for healing (CellPac BLOX)

CellPac LITE EasyPack SLIM

CellPac PLUS: Custom Products • Infusion pumps • DVT pumps • Respirators • Blood pressure meters • ECG monitors • Recorders • Suction units • Ultrasound devices • Medical drills and tools • Monitors • Portable lights • Heat sensing devices • Walky talkies FEATURES/BENEFITS CellPac LITE: Off the Shelf Products • UNDOT 38.3 transportation compliant/tested • IEC62133 certified/tested • Off the shelf/distribution CellPac BLOX: Semi-Custom Products • Building block utilization to assemble semi-custom packs • For smaller/mid volume usage • Multi options • Smaller minimum requirements • Certification eligible CellPac PLUS: Custom Products • Full custom design support • Full certification compliance eligible • Full program management To buy products or download data, go to www.FutureElectronics.com/FTM

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23

DESIGN NOTE

DESIGN NOTE

Pack More Punch in Your Small Sensor While Keeping It Cool Packing More Punch

Safe Low Voltage Operation Introduction Sensors have become ubiquitous in the industrial environment. As they increase in sophistication and shrink in size, sensors are enabling Industry 4.0. In turn, sensor electronics are becoming more complex, requiring on-board voltage regulators to deliver power more efficiently and with minimum heat generation. How do you safely deliver low-voltage power to tiny sensors in high-voltage, industrial environments, while minimizing solution size and maximizing efficiency? In this Design Note, Maxim reviews a typical industrial sensor architecture and provides a simple solution to this challenge. Industrial Sensor Applications Industrial end equipment often operates in a harsh electronic environment. Sensors detect and diagnose many parameters and also make decisions. They must be durable and reliable, regardless of the environment. Proximity sensors (Figure 1), temperature sensors and pressure sensors are used in many industries, including food and beverage, chemical processing, oil and gas, pharmaceutical, manufacturing, construction, hydraulic and pneumatic applications, water and wastewater, HVAC, and refrigeration systems, to name just a few!

The sensor is typically powered by an isolated 24V DC power source. However the factory floor can be a very challenging environment, with long cables and strong electromagnetic interference resulting in high voltage transients. Accordingly, the step-down converter inside the sensor must withstand voltage transients of 42V or 60V that are much higher than the sensor operating voltage. According to SELV/FELV regulations, an isolated device handling up to 60V is considered safe to touch. Protection above 60V can be provided with the addition of dedicated TVS devices.

The Sensor System Sensors may be located anywhere on the factory floor. The control center receives information from the sensor and sends the appropriate action to the actuator via a field bus. The sensor ‘box’ includes a front-end connector/ interface handling data and routing the power to a step down voltage regulator which delivers the appropriate voltage to the ASIC/microcontroller/FPGA and the sensing element.

12 mm

Proximity sensors are by far the most common and can be catagorized as optical, inductive, capacitive, photoelectric and ultrasonic. This class of sensors consumes anywhere from 45mA to 100mA.

FRONT VIEW SIDE VIEW

IC 3mm x 2mm x 0.8mm

12 mm

Rotary or linear encoders are widely used in sensing speed and position of electric motors. Their typical current consumtion is in the 10mA to 20mA range.

Figure 2. Buck IC, Inductor and Sensor Size Comparison

3mm x 3mm x 1.5mm INDUCTOR 36mm

Conclusion

Digital Sensor System Architecture Figure 3 illustrates a digital sensor system based on the popular IO-Link® point-to-point serial communication protocol. IO-Link, used for communicating with sensors and actuators, has been adopted as an international standard (IEC 61131-9). The IO-Link bus carries power (24V) and data. 24V IO-LINK® CONNECTOR

CABLE/ FIELD BUS (24V/DATA)

24V DATA

TRANSCEIVER

IO-LINK MASTER

DATA

STEPDOWN

CONTROLLER

CONTROL CABLE CENTER 24V DATA

SENSOR 5V

TARGET

SENSING ELEMENT

ACTUATOR

AC/DC

Most industrial sensing elements need an input voltage significantly lower than that supplied by the system. In many systems an LDO is used to step-down a 24V system voltage to 5V to power the microcontroller (3mA) and the sensing element (100mA). This is a lossy process (η=21% in this example) that ends up costing 2.5W of power dissipation. If the voltage step-down is performed by a buck switching regulator with 85% efficiency the power losses are reduced down to 624mW.

We discussed common industrial sensor architectures and examined the power needs and challenges of various types of sensors. In addition, we provided a solution to efficiently and safely deliver power in a small formfactor using a switching regulator as an alternative to the lossy and thus, inadequate, LDO. Finally we introduced a new family of Maxim Integrated switching regulators, the MAX17550-MAX17552 and MAX17530-MAX17532 high-efficiency, high-voltage, synchronous step-down DC-DC converters with integrated MOSFETs. These small buck regulators deliver an output current up to 25mA, 50mA, or 100mA and are tailored to the needs of industrial sensor applications. Learn More MAX17530 42V, 25mA, High-Efficiency, Buck Converter MAX17531, 42V, 50mA, High-Efficiency, Buck Converter MAX17532, 42V, 100mA, High-Efficiency, Buck Converter MAX17550 60V, 25mA, High-Efficiency, Buck Converter MAX17551, 60V, 50mA, High-Efficiency, Buck Converter MAX17552, 60V, 100mA, High-Efficiency, Buck Converter About the Authors

Figure 3. Digital Sensor System

Powering the Sensing Element

The MAX17550-MAX17552 and MAX17530-MAX17532 families of high-efficiency, high-voltage, synchronous step-down DC-DC converters save space with integrated MOSFETs and operate over a 4V-to-60V and 4V-to-42V input voltage range, respectively. Delivering output current up to 25mA, 50mA or 100mA, the devices are ideal for sensor applications. The output voltage is accurate to within ±1.75% over the -40°C to +125°C temperature range. The converters consume only 22µA of no-load supply current in PFM mode. The low-resistance, on-chip MOSFETs ensure high efficiency at full load and simplify PCB layout. The devices offer programmable switching frequency to optimize solution size and efficiency, and are available in compact 10-pin (3mm x 2mm) TDFN and 10-pin (3mm x 3mm) µMAX® packages. Simulation models are also available to simplify design. The typical application circuits for the 600 kHz configurations — optimized for small size — deliver 5V to a load up to 100mA. This enables a total solution size of only 50mm2. With a 24V input, the peak efficiency is 87% for both device families. As discussed earlier, these devices decisively outperform any LDO-based solution in terms of power savings.

Pressure sensors are based on the piezolelectric effect or on strain gauge. In piezoelectric sensors, the crystal produces a voltage proportional to the pressure. In a strain gauge sensor, the silicon resistance varies with pressure. Their typical current consumption is 20mA.

FELV: Functional Extra Low Voltage. A non-isolated circuit below 60V. INDUSTRY 4.0: The fourth industrial revolution. The current trend of automation and data exchange in manufacturing technologies to create the smart factory. RTD: Resistance Temperature Detector. SELV: Separated Extra Low Voltage. An isolated circuit below 60V. Such a circuit is considered safe to the touch. TVS: Transient Voltage Suppressor. Clips voltage transients, for example, above 60V. Figure 1. Proximity Sensors in Action

As mentioned earlier, sensor electronics are becoming more complex while sensor housings are shrinking to enable intelligent factories. Hence, it is important that the on-board voltage regulator is small in size and delivers power with high efficiency and minimum heat generation. Figure 2 illustrates the size of a Himalaya switching regulator IC (MAX17552) and the companion inductor housed in a small, M8 sized proximity sensor. Clearly the MAX17552 consumes minimal space in this application.

Sensor Current Consumption

Temperature measurements are based on diodes, thermocouplers or resistors depending on the application temperature range. As an example, a typical resitor temperature detector (RTD) is a 100Ω platinum resistor.

A Tailor-Made Buck Converter Family

The sensor may be located anywhere on the factory floor. The control center receives information from the sensor and sends the appropriate instruction to the actuator via the standard I/O field bus. The sensor ‘box’ includes an IO-Link transceiver interface which handles data and routes the 24V power to a step-down voltage regulator. The regulator delivers 5V to the microcontroller and to the sensing element.

Viral Vaidya is an Executive Business Manager for Power Management products at Maxim Inc. He has over 10 years of experience in product management for various power management products. He has been at Maxim for more than five years and served in a similar role for the previous five years. Vaidya has a MSEE from San Jose State University in California. Nazzareno (Reno) Rossetti is a seasoned Analog and Power Management professional, a published author and holds several patents in this field. He holds a doctorate in Electrical Engineering from Politecnico di Torino, Italy.

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25

DESIGN NOTE

Learn How You Can Leverage Future Electronics’

System Design Center

Using an LFPAK MOSFET to Switch 200A By: Brian Clifton, Applications Engineer, BG MOS Discretes

The ever decreasing ‘on’ resistance of modern MOSFETs means that they stay cool even when handling lots of amps. It is possible to dispense with a heatsink and rely on the copper of the PCB to dissipate the heat. This ability to surface-mount power devices is what makes new packages like LFPAK and Power SO8 so popular. So, how much power can a SMD MOSFET handle? A good example is the Nexperia PSMN0R725YLD. This has a typical ‘on’ resistance of 0.57mΩ and a sturdy, internal ‘clip’ construction that can carry a lot of current. A quick glance at the datasheet indicates that this tiny SO-8 size device can dissipate 158W and the low RDS(ON) suggests a current handling capability in the hundreds of amps!

When the device is working hard the silicon will get hot. The maximum allowable for this device is 150°C. At that temperature, the RDS(ON) increases by a factor of 1.6 to 1.15 mΩ. We can use this to calculate the current that will generate 95W and therefore the maximum current. The power is given by: P = I 2R Rearranging: I2 = P/R That is: I2 = 95/0.00115 Taking the square root: I = 287A

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avalanche mode, the voltage across the device is usually just above the Vds rating. Avalanche mode can be fatal to the MOSFET because the V x I product is large. For instance, in the case of PSMN0R7-25YLD switching 200A, the V x I product is 25 x 200 = 5000W! This is acceptable only if the duration is very short – in the order of nanoseconds.

To demonstrate 200A capability, I chose to use solid copper bus bars 25 x 3mm thick. Two pieces, one for the source and one for the drain were glued to a third to form a rigid structure. The glue used was ‘self shimming’ and thus provides an electrical insulating barrier.

In the demonstrator, nichrome wire is used as a resistive load and the loop inductance is kept low by running the flow and return cables close together to reduce the loop area.

Soldering the source and drain of the PSMN0R725YLD directly to the copper provides the lowest possible thermal resistance. The thick copper, apart from carrying the high current, ‘spreads’ the heat over a large area and cools the MOSFET by natural convection. MOSFETs are designed to operate as switches. When they are ‘on’ the current is high but the voltage drop is small. When they are ‘off’ the current is very small but the voltage drop is high. In both these conditions the power dissipation given by V x I is low. It is when the device is switching that the danger comes. In the intermediate state the V x I product is large and therefore it is essential to switch as fast as possible. A TC4422CPA gate driver is used to drive the gate. A 12-volt supply ensures the lowest possible ‘on’ resistance. The TC4422CPA driver can provide up to 9A to charge the gate capacitance and thus guarantee fast switching times. All circuits have inductance. This causes problems when switching off because the current is forced to keep flowing through the MOSFET after it is turned off. This is known as avalanche mode. In

In use, the push button on the top of the demonstrator switches on the MOSFET via the gate driver. Two DC-DC converters provide 100A each to the Nichrome wire resistors which begin to glow red after a few seconds. The clamp-on current meter indicates just over 200A. A thermocouple attached to the copper near to the MOSFET shows the temperature rising slowly. After about thirty seconds it steadies at around 60°C. In conclusion, SMD power devices have an advantage over their leaded counterparts because they can be directly soldered to a heatsink. This property, combined with remarkably low ‘on’ resistance, enables them to switch immense currents. The rugged ‘clip’ design of Nexperia’s LFPAK packages takes advantage of this high current capability. In practice, SMD MOSFETs are soldered to far thinner copper layers than are used in this demonstrator. The high current rating of LFPAK is still valuable to enable devices to survive shortterm overload conditions such as motor start-up or locked rotor situations.

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Future Electronics offers the best solutions and service in the industry. Our Advanced Engineering Group together with our System Design Center is committed to assisting you with all your needs, whether schematic design or turnkey production.

1 Concept

2 Design

3 Prototype

4 Production

Electronic Circuit Schematic CAD Design

Multi-layer Printed Circuit Board (PCB) Layout and Design

MCU, CPU and FPGA Hardware/ Firmware Development

Product Prototyping Production and Manufacturing Support

Analog, Digital and Mixed Signal Circuit Design

RF/Wireless, NFC and Antenna Design

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ET RK

But hold on – that figure of 158W only holds true if the mounting base (the solder tab) is kept at 25°C. What does that imply? Well, getting rid of 158W requires a lot of heatsink, probably water cooled, and is not practical in the real world. However, it does give us a maximum figure to work to. The datasheet shows that if the mounting base gets hot, the power dissipation must be reduced. For example, at 75°C we must de-rate to 95W.

This is an absolute maximum figure and suggests that a target of 200A is realistic. What kind of PCB can carry 200A? Clearly, not a conventional one. The thickest PCB copper around is 0.5mm (14 oz). Reference to the online PCB trace-width calculator shows that even with that thickness of copper, a trace 20mm wide is needed to keep the temperature rise of the PCB down to 20°C.

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ANALOG CORNER Drivers

ANALOG CORNER

DGD2103M: Half Bridge Gate Driver Simplifies the Switching of MOSFETs and IGBTs The DGD2103M is a high voltage/high speed gate driver capable of driving N-channel MOSFETs and IGBTs in a half bridge configuration. High voltage processing techniques enable the DGD2103M’s high side to switch to 600V in a bootstrap operation. The DGD2103M logic inputs are compatible with standard TTL and CMOS levels (down to 3.3V) to interface easily with controlling devices. The driver output features high pulse current buffers designed for minimum driver cross conduction. DGD2103M has a fixed internal deadtime of 420ns (typical).

Power Regulation, Conversion and Management FEATURES

BD9227F: The Industry’s First DC/DC Converter Capable of DC Fan Motor Speed Control

• Floating high side driver in bootstrap operation to 600V • Outputs tolerant to negative transients • 10V to 20V low side gate driver supply voltage • Schmitt triggered logic inputs • 290mA source/600mA sink output current capability • Internal dead time of 420ns to protect MOSFETs • 3.3V logic input • Under-voltage lockout for VCC

The BD9227F is the industry’s first power supply IC capable of controlling the rotational speed of DC fan motors with high accuracy by linearly varying the output voltage based on the PWM duty signal generated by the MCU. In addition to more accurate control compare to conventional discrete configurations, ROHM’s proprietary IC analog circuit design technology achieves circuit optimization along with high frequency (1MHz) drive, which resulting the use of smaller peripheral components (i.e. coil, output capacitor), reduced footprint by 75% while improving power conversion efficiency by 19% (at 300mA output) in DC fan motor applications.automotive and industrial applications.

Power Regulation, Conversion and Management ISL85005/A: 12V Synchronous Buck Regulators

FEATURES

The ISL85005 and ISL85005A are monolithic, synchronous buck regulators with integrated 5A, 18V high side and low side FETs. These devices also provide an integrated bootstrap diode for the high side gate driver to reduce the external parts count. These devices have a wide input voltage range to support applications with input voltage from multi-cell batteries or regulated 5V and 12V power rails. The ISL85005 and ISL85005A regulate the output voltage with current mode control and have an internal oscillator. The switching frequency of the ISL85005 is internally set as 500kHz, and can be synchronized to an external clock signal with frequency ranges from 300kHz to 2MHz. The ISL85005A has a fixed 500kHz switching frequency.

ISL9238/A: Single-Chip USB-C Buck-Boost Battery Chargers

• • • • • •

4.5V to 18V input voltage range ±1%, 0.8V feedback voltage reference Current mode control with internal slope compensation Default internally set 500kHz switching frequency Diode emulation mode (DEM) and forced CCM (FCCM) options (ISL85005) Output power-good (PG) indicator Internal 5A, 18V high side and low side MOSFET switches Integrated bootstrap diode with under-voltage detection Internal or external compensation options Synchronization capability to external clock (ISL85005) Adjustable soft start time (ISL85005A)

PI3525: 20A 48V Cool-Power ZVS Buck Regulator The PI3525-00-LGIZ is the latest addition to the CoolPower ZVS Buck Regulator portfolio with a 48V (30 – 60VIN ) input. The PI352x is a higher current offering to the existing PI354x portfolio enabling scalable power options for 48V Direct to Point-of-Load (PoL) applications. The PI3525-00-LGIZ is a 5V output regulator, supplying up to 20A, packaged in a 10 x 14mm LGA SiP package. Offering all the same industry leading features of Vicor’s existing 48V Cool-Power ZVS Buck Regulators, the PI352x portfolio extends performance by delivering twice the power of the PI354x regulators using only a 40% larger package. The PI3525-00-LGIZ requires only an output inductor and minimal passives for a complete cost effective design that consumes less than 740 mm2 of PCB real estate.

FEATURES

The ISL9238 and ISL9238A operate in forward buck, boost or buck-boost mode to fast charge mobile battery packs with up to 4-cell Li-ion batteries. They also support USB 3.1 On-The-Go (OTG) with 5V/20V reverse buck, boost or buck-boost mode to deliver power out of a USB-C port for charging external devices such as smartphones, headphones or virtual reality goggles. At maximum power, both ICs provide 20V at 5A to the USBC port for delivery of power up to 100W over a reversible USB Type-C connector cable. The ISL9238A features the same capabilities as the ISL9238, but also includes a different SMBus address for OEMs that want to use both ICs to design systems with dual USB-C ports.

MCP19122/3: Flexible, Integrated Digitally Enhanced Power Analog Controllers The MCP19122/3 offer excellent regulation accuracy, in a variable output analog PWM controller with an integrated microcontroller for supervisory and management functions. With analog-based synchronous buck PWM controller and an integrated 8-bit PIC® MCU, they combine the performance of a high speed analog solution, with the configurability and communication interface of a digital solution. MCP19122/3 are designed to deliver industry-leading current measurement by using a lossless inductor current sense method with specialized internal measurement calibrations. The device can directly accept a common mode signal up to 16V and report the load current to within 5% accuracy for most applications, with an emulated average current mode control for hardware-based cycle-by-cycle current limiting.

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• • • • •

• • • • • • • • • •

3.2V to 23.4V input voltage range 2.4V to 18.304V system output voltage System power monitor PSYS output, IMVP compliant PROCHOT# open-drain output, IMVP compliant SMBus/I2C programmable Battery learn mode calibrates the battery fuel gauge Up to 1MHz operation ASGATE FET control Allows trickle charging of depleted battery Autonomous charging option (automatic end of charge control) • Adapter current and battery current monitor (AMON/BMON) • Different SMBus address (ISL9238A) to charge a second battery

Sensors

AS7225: Tunable-White Lighting Smart System Sensor The AS7225 is equipped with the product family’s industry-first embedded tri-stimulus CIE XYZ color sensor to enable precise color sensing with direct mapping to the International Commission on Illumination (CIE) 1931 color space which is recognized as the standard coordinate definition for human color perception. CCT and daylighting tuning directives are communicated to the host microprocessor via an industry standard I2C interface, allowing IoT smart lighting manufacturers to avoid costly calibration and tuning algorithm development and reduce time to deployment.

FEATURES • 4.5 to 40V operating and 0.3 to 16V output voltage range • Support synchronous buck, or similar high/low side switch topologies • Operate from 100kHz to 1.6MHz, adjustable during operation • Integrated 8-bit PIC® microcontroller with 4kw flash memory and 256B RAM • Significant configurability (compensation, UVLO, OVLO, start-up behavior, MOSFET deadtime, etc.) • Integrated MOSFET drivers and high side current sense • Integrated 10-bit A/D converter • Integrated I2C interface, capable of PMBus™ support • In-circuit debug via two pins (MCP19123) • 12 (MCP19122) or 16 (MCP19123) IO pins and one input-only pin

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VCNL4035X01: Fully Integrated Proximity and Ambient Light Sensor with I2C Interface and Interrupt Function

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VCNL4035X01 integrates a proximity sensor (PS), ambient light sensor (ALS), a mux, and a driver for up to 3 external IREDs/LEDs into one small package. It incorporates photodiodes, amplifiers, and analog to digital converting circuits into a single chip by CMOS process. The 16-bit high resolution ALS offers excellent sensing capabilities with sufficient selections to fulfill most applications whether dark or high transparency lens design. Both ALS and PS programmable interrupt features of individual high and low thresholds offers the best utilization of resource and power saving on the microcontroller.

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FEATURES • • • • • • • • •

6V to 20V operating input range 1.0MHz fixed operating frequency Overcurrent hiccup period protection Over-voltage protection Thermal shutdown 20V/200mΩ internal power MOSFET Current mode control Under-voltage locked out SOP-8 package

FEATURES • • • • • • • • • •

48 VIN nominal (36V to 60V) 2.2V to 14V VOUT range Paralleling and single wire current sharing User adjustable soft start and tracking Optional I2C functionality and programmability Internal compensation - few external components No additional design or additional settings required Frequency synchronization Power-up into pre-biased load -40°C to +125°C operating range

FEATURES • • • • •

XYZ tri-stimulus chromatic sensing Simple register-based control commands I2C interface Calibrated nano-optic silicon interference filters Readable registers for CIE 1931 and 1975 color-point coordinates, CCT, duv and lux • 4.5 x 4.7 x 2.5mm 20-pin LGA package • 0°C to +85°C operating temperature • 1k MSRP: $2.40 US

FEATURES • AEC-Q101 qualified • Conditioning ICL • Filtron™ technology adoption for robust background light cancellation • Low power consumption I2C (SMBus compatible) interface • 2.5V to 3.6V operation voltage • Integrated modules: ambient light sensor(ALS), proximity sensor (PS), and signal • Operates ALS and PS in parallel structure • -40°C to +105°C temperature compensation • I2C bus (ALS/PS) output • 4.0 x 2.36 x 0.75mm surface-mount package

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TECHNICAL VIEW

TECHNICAL VIEW

Graphics Display-Based Human-Machine Interfaces: the New Capabilities of the Latest MCUs By: Justin Palmer, Vertical Segment Director, Embedded and Healthcare, Future Electronics

The evidence from consumer research, analyst reports, OEM customer feedback and the forecasts from semiconductor manufacturers all points in the same direction: few embedded designers will be immune over the next five years from pressure to dramatically enhance the capabilities, mode of operation and appeal of the Human-Machine Interface (HMI) in their products.

MCU platform. So how much scope are MCU manufacturers offering their users to dramatically improve the HMI’s functionality?

Although the move to create more graphical and touch-sensitive interfaces was largely initiated in devices such as smartphones and tablets, the demand for such a rich user experience has expanded far beyond the consumer market. In fact, products for the industrial, automotive, medical, military and aerospace markets are all facing the same requirement. Several factors are driving the revolution in HMI design: • Sensors, processors and wireless devices have become much better and much cheaper at the same time, greatly enhancing systems’ ability to measure and track their own operation. • A generational shift has taken place in the user base which requires product manufacturers to meet the expectations of millennials rather than baby boomers. • A color TFT display costs less now than a monochrome STN display cost just five years ago. Touchscreen overlays have also become both better and cheaper, with capacitive touch-sensing technology now widely available, and offering a better and more interactive interface than older resistive technology options. • Companies have discovered the scope to improve efficiency and reduce operating costs when equipment has an easy-to-use and intuitive interface. They benefit both from a lower requirement for training and from a reduced incidence of human error.

The fundamental underlying cause of the shift in HMI design is the development of new and improved semiconductor technology. Sensors, RF transceivers and microcontrollers have become so powerful and yet so cheap that it is possible for OEMs to embed them in greater numbers than ever, and in more devices than ever. In factories, this enables factory-automation systems to track all important parameters of both the manufacturing equipment and the manufactured product in real time, at any point in the production process. In medicine, it enables health professionals to remotely monitor a patient’s condition constantly, and to set alerts when critical thresholds are crossed.

In the past, redesigning an embedded product’s HMI to feature more and better graphical content would have been out of the question for systems that were based on a microcontroller. There used to be a sharp divide between, on the one hand, embedded systems based on a microprocessor with sophisticated graphics capability, and a rich operating system such as the Windows® or Linux™ platforms; and on the other hand, those based on a microcontroller, often with no operating system and typically running nothing more complex than a segment LCD. The ground is shifting fast, however, and improving MCU capabilities gives design engineers hope that they can stay one step ahead of their customers’ changing expectations without having to abandon their familiar and productive

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How and Why the HMI is Evolving Before looking at how system designers might implement an improved HMI, it is worth understanding why and how the HMI needs to be improved.

Figure 1. The Tesla Model S dashboard – a response to modern users’ preference for graphics-rich control interfaces. (Image credit: Steve Jurvetson under Creative Commons 2.0 license)

Interestingly, the preferences and working style of millennials are different from those of baby boomers. Whereas baby boomers expected to be trained to implement a process, and measured on their execution of it, millennials expect to understand a system, to track it with real-time data, and to make their own decisions based on the data rather than following a set process. So now we have masses of data generated by sensors, the ability via the internet to communicate and share it in real time, and the people with the native ability to process and use it. Clearly, simple segment LCDs and push-button inputs do not fit in with this mode of interacting with complex equipment. Displays Must Present Menus of Data to Users The key factor is the availability of Big Data, and the extraordinary value which can be derived from its use. In fields as diverse as intensive medical care and predictive maintenance of machines, it is the patterns discoverable in multiple streams of data or multiple parameters which provide the most valuable insights. And humans can most easily and most quickly discover these patterns visually; we learn more about complex data sets from diagrams, graphs and charts than we do from hundreds of lines of letters and numerals. To enable millennials to do what they do well – making intelligent decisions based on rich, realtime data – embedded devices should present information graphically, and allow the user to interact with it intuitively. Systems, then, need graphics capability and must support touchsensing interfaces.

The result is that vast amounts of data are being generated and transmitted to control units. As the Internet of Things gains traction, this data is increasingly being hosted online in the cloud, where it may be aggregated and analyzed, and the results of the analysis displayed on any internet terminal anywhere. So the extent and types of data available to users are changing rapidly.

The most sophisticated graphical systems, capable of handling video streams in high definition, for instance, will run on a highperformance MPU such as the i.MX family from NXP Semiconductors, based on ARM® Cortex®-A processors operating within a Linux® or Android™ environment. Such systems are complex and expensive in both software and hardware terms, and present considerable implementation challenges for those not versed in development on a rich Operating System (OS).

At exactly the same time, the make-up of the user base, and in particular of the workforce, is changing, as baby boomers go into retirement to be replaced by ‘millennials’, the generation starting with people born in the early 1980s, and by later generations. These people are digital natives, accustomed since childhood to interact with computers and displays (see Figure 1).

More and more embedded systems, however, are based on a microcontroller platform. And of course MCU users would always, if possible, prefer to remain as MCU users rather than migrating to an MPU. The MCU is familiar, it supports the C language for application-code development, and it enables the reuse of legacy systems running on the same platform. In short,

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the upheaval involved in migrating from an MCU to an MPU can be immense, but is potentially avoidable. So how closely can a system with an MCU architecture emulate the sophistication and performance of an MPU-based HMI? Today, STMicroelectronics promises users of its 32-bit STM32F7 MCUs, which are based on an ARM® Cortex®-M7 processor core, that they can support up to an XGA display screen with high-definition 1024 x 768px resolution. The STM32F7x7, STM32F7x8 and STM32F7x9 series all include an on-board TFT display controller and JPEG image codec (see Figure 2). All STM32F7 MCUs also include ST’s Chrom-ART Accelerator™ for graphics, to enable high-speed rendering of graphics without any overhead on the main processor. This graphics accelerator creates content twice as fast as the core alone can do. As well as providing for fast rendering of raw 2D data, the Chrom-ART Accelerator also supports extra functions such as image format conversion and image blending, providing the MCU user with the capability to implement some sophisticated graphics effects.

Figure 2. STMicroelectronics’ 32F769IDISCOVERY development board for the STM32F7x9 series of MCUs includes a 4” LCD touchscreen. (Image credit: STMicroelectronics)

On-board Flash memory of up to 2Mbytes and 512kbytes of SRAM provide plenty of capacity for graphics data storage and the scratchpad memory required by the Chrom-ART Accelerator. A MIPI-DSI interface in the STM32F7x9 series MCUs can also be useful in graphics-rich applications, as it provides a direct channel to devices such as image sensors and cameras. Other MCU manufacturers provide similar levels of graphics and display controller capability in their high-end devices. Microchip’s PIC32 MX3 and MX4 series are intended for embedded applications with a high performance graphics display. They support TFT and OLED display screens up to WVGA (800 x 480px resolution), and integrate Microchip’s touch-sensing control technology.

Microchip offers particularly good development support for graphics applications, providing a free graphics library, and its intuitive and easy to use Graphics Display Designer development tool.

• Timing windows shorten and scheduling creates considerable challenges • The memory requirement scales up hugely, resulting in a need for memory management

NXP Semiconductor’s LPC5460x and LPC54S60x families of ARM Cortex-M4-based MCUs are also optimized for rich HMI applications. They support a graphics LCD with resolution up to 1024 x 768, and offer options to easily connect and manage external QSPI Flash memories to store large images or pieces of code. NXP also provides a good ecosystem including graphics libraries, such as Segger emWin, provided free of charge.

There is no question that an embedded application with a sophisticated HMI therefore requires the use of a real-time OS (RTOS) to provide a framework for scheduling and prioritization, and to implement memory management. A wide choice of RTOS options is available, and a system such as FreeRTOS™ is – as its name suggests – free to use, and benefits from board support from most MCU manufacturers.

Cypress Semiconductor also has a long heritage in the field of graphics display control – it is a leader in the market for highly integrated controllers for vehicle instrument clusters, which today often feature 2D or 3D graphics display screens. For industrial equipment and home appliances, the FM4 family of MCUs offers a wide choice of features and capabilities. In particular, the S6E2D series of ARM Cortex-M4 MCUs, which is part of the FM4 family, is aimed at applications containing a full-color TFT-based graphical display; its graphics engine is derived from that used in the Traveo range of MCUs for instrument clusters. Offering 512kbytes of video RAM as well as the graphics engine, the S6E2D supports complex image overlap, mirroring, scaling and image movement with minimal overhead on the Cortex-M4 core. It can implement sophisticated and impressive graphics at much lower price points then competing solutions. New System Requirements in Move to Graphics Displays The good news, then, is that many MCU manufacturers offer existing users a migration path up to their high-end devices through which they can implement very sophisticated, full-color graphics displays, even supporting some moving content, and providing high resolution up to Full HD. Extremely sophisticated display-based HMIs which meet the needs of millennial users can now be implemented without requiring a wholesale move to an MPU-based architecture and a full-featured operating system. But designers implementing a sophisticated graphics display for the first time will find that: • The complexity of their system increases dramatically

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Designers will also need to take advantage of the support that MCU manufacturers provide for third-party graphics design tools. Segger’s emWin design and simulation tool, for instance, is provided free by ST and NXP to users of its MCUs. It is also worth taking note of the trend to enhance the HMI not only with advanced graphics capabilities but also with gesture control and

Figure 3. Microchip’s 3DTouchPad demonstrates its GestIC gesture-recognition technology. (Image credit: Microchip)

with improved ability to use audio inputs and outputs. Microchip provides interesting capabilities in gesture control with its GestIC® technology (see Figure 3). And in audio user interfaces, XMOS in particular has been doing pioneering work in far-field microphone management implemented in its xCORE-VOICE™ processors, offering a means to provide voice control of electronic equipment in all environments.

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