software for complex automation sequences. IX-255 ... Provide Selectable High-fluence to Large Field Operation ... IPG P
IX-255
UV Laser Micromachining System
Micro Drilling
Annealing
Thin-film Patterning
Laser Lift-off (LLO)
Dicing
Selective Material Removal
Features Pre-set Configurations for 248 or 193 nm Laser Options Available High Fluence and Large Field-of-view Applications Dual Magnification Vision System with Sub-micron Precision Mask Imaging Part Alignment Beam Delivery System Optional Mask Changer for Precision Stages with ±5 µm Motion Control Accuracy Complex Micromachining
IPG Photonics’ IX-255 is a highly flexible UV laser micromachining system ideal for multi-purpose, R&D and small-scale production applications. The system combines a Class 1 workstation integrated with a proprietary UV laser, optional tool shape selector and software for complex automation sequences.
IX-255 UV Micromachining Workstation
Fl e x ibl e , I nt e r c hange a bl e , Proc essi ng Tool Design Laser Specifications • IPG Microsystems MicroX Deep UV • Available in 193 or 248 nm Configurations
Compact Footprint • Integrated IPG Laser in Single CDRH Class 1, Fully Interlocked Workstation Cabinet
• Pulse Rate from 1 Hz to 1,000 Hz
• Minimizes Floor Space Requirements
• Pulse Length Typically 10 ns
• Ergonomic Work Height- Easy Part Loading and Unloading
System Architecture
Part Handling Stage
• All Granite Beam Delivery and Stage Support Structure for Vibration Isolation and
• X-Y-Z-Theta Part Handling • 125 mm Diameter Process Area Standard;
Minimized Thermal Drift • Front Door with Laser-safe Viewing Window
150 mm Diameter Option • Positional Accuracy ±5 micron over Process Area
