Mar 23, 2011 - Junior Talent Program (JTP): 24-month trainee program for top ... Since 2001 over 100 SEMI HTU programs h
Recent Innovations Semiconductors and System Solutions Mag. Dr. h.c. Monika Kircher-Kohl CEO Infineon Technologies Austria AG
2011 MIT Europe Conference Innovation in a Networked World: Technology, People, and Places Wednesday, March 23, 2011
Agenda Semiconductor Business - an Overview
Market Driven Innovations New Challenges in Energy, Mobility and Security
Hidden Innovations 300 MM Thin-Wafer Technology Silicon Carbide iRobotics – Cooperative Robotics in Production Lines
Management Innovations Creating a ‚Culture of Innovation‘ Enabling Innovations in Human Resource Management
Copyright © Infineon Technologies 2011. All rights reserved.
Page 2
Global semiconductor market development Revenue in US Dollar billion and market growth rate 40%
37%
32%
28%
368 329
18%
18%
301 7%
4% 1% -8%
-8%
132 137 126
213
204 149
227
313 320
20%
6%
10%
296
9% 248
30%
256 249 226
3%
166
6%
-3%
139 141
-9%
0% -10% -20% -30%
-32%
-40%
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 Revenue Forecast range revenue
Market growth rate Forecast range (average) market growth rate
Source: WSTS for historical data. Forecast: ∅ of Gartner, iSuppli, IC Insights, VLSI, WSTS; market growth rates year-on-year; last forecast update January 25th 2011 01/02/2011
Copyright © Infineon Technologies 2011. All rights reserved.
Page 3
12.0
7.18
0.0
8.9
12.0
Global economic growth is the key driver for semiconductor market growth
7.18
6.80
6.80
6.20
6.20
5.00
Real GDP & Semiconductor Market Growth
Annual Semiconductor Market Growth [%]
Global Recession
40
III
30
1995 2000 1994
1993
1986
20
2003
In 2010, both the global economy and the global semiconductor market strongly recovered.
There is a positive correlation between real GDP growth and semiconductor market growth.
Field I represents a healthy economy and a growing semiconductor market. In field II, there is a global recession and the semiconductor market shows negative growth. In field III, the semiconductor market – in particular at the beginning of the nineties – was successful in decoupling from the economic cycle and ended with positive growth rates despite a recessive world economy. Field IV with the combination of a healthy economy and a contracting semiconductor market seems to be an anomaly.
1991 2002 2008
0 -10
2009
1998
-30
Growing Semi Market
1987
1996
II
-20
2010
2004
1999 1989 2006 2005 1990 2007 1997
1992
10
I
1988
Contracting Semi Market
IV 2001
-40 -1
0
1
2
3
4
5
Worldwide Real GDP Growth Rates [%]
5.00
50
-2 6.40
Healthy Economy
Comments
6.40
Source: WSTS – T99, 31 January 2011; IHS Global Insight Years are calendar years 8.60 9.20
8.60
Copyright © Infineon Technologies 2011. All rights reserved.
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9.20
12.0
0.0
8.9
12.0
Quarter-by-quarter-view: Growth in end markets will fuel semiconductor unit shipments 7.18
7.18
6.80
6.80
6.20
6.20
End applications’ and semi unit growth
Comments
5.00
5.00
Year-on-year growth rates 70%
70%
60%
60%
50%
50%
40%
40%
30%
30%
20%
20%
10%
10%
0% -10%
0% 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 2006
2007
2008
2009
2010
2011e
-20% -30% -40% 6.40
-50%
2012e
-10% -20%
Semi unit shipments Handset unit shipments Car unit production Flat Panel TV production units PC unit shipments
The positive outlook for end markets drives semiconductor unit demand in the course of 2011 and 2012.
But there is not only unit demand that drives the semi market, also increasing semiconductor content as well as price developments contributes to semi market growth.
-30% -40% -50%
6.40
Source: WSTS – T99; IHS CSM, Strategy Analytics, Gartner. Years are calendar years
8.60 9.20
8.60
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Page 5
9.20
12.0
7.18 6.80 6.20
0.0
8.9
In addition to GDP and end markets, the following parameters also influence semiconductor market growth Chip capacity & chip production 240
5.00 220
Semi unit shipments in bn [left y-axis]
Chip capacity [msi]
3000
2500
Chip production [msi]
140
Semi industry inventory-to-sales ratio
60%
50%
60%
5.00
50%
40%
30%
30%
OEM, EMS, Disti, Retail inventory-to-sales-ratio
1500 20%
120
1000
100 80 2009
2010
2011e
0.52
0.40 2008
2009
2010
2011e
2012e
3Q
2007
4Q
1Q
2Q
3Q
2008
4Q
1Q
2Q
3Q
2009
4Q
1Q
2Q
3Q
4Q
2010
Given that, capacity utilization is expected to remain close to 90%, leading to more or less firm ASPs. Important to know, capacity utilization is leading ASPs by 1-2 quarters.
0.44 0.42
2Q
0.46 70%
1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q
1Q
Under current conditions (expected GDP and end market growth, current capital spending plans in the semi industry), increasing chip production will meet demand and should neither end in oversupply nor excess inventories. Currently, the inventory situation within the electronics foodchain is stable.
0.48
50%
4Q
80%
60%
3Q
Comments
0.50
Average Selling Price in USD [right y-axis]
2Q
2006
Capacity utilization & Average Selling Price
90%
0% 1Q
2012e
Capacity utilization [left y-axis]
10%
0%
500 2008
20%
10%
1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q
9.20
6.20
2000
160
8.60
6.80
40%
180
100%
7.18
Inventories in the electronics foodchain
200
6.40
12.0
Source: VLSI; WSTS – T99; IHS CSM, Gartner, Strategy Analytics Copyright © Infineon Technologies 2011. All rights reserved.
6.40
8.60
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9.20
Infineon at a Glance The Company
Infineon provides semiconductor and system solutions, focusing on three central needs of our modern society: Energy Efficiency, Mobility and Security Revenue in FY 2010*: 3.295 billion EUR 27,315** employees worldwide (as of December 2010) More than 21 R&D locations
*Note: Figures according to IFRS with Wireline and Wireless as discontinued operations; as of September 30, 2010 **Note: Including Wireless as discontinued operations; as of December 31, 2010 Copyright © Infineon Technologies 2011. All rights reserved.
Page 7
Agenda Semiconductor Business - an Overview
Market Driven Innovations New Challenges in Energy, Mobility and Security
Hidden Innovations 300 MM Thin-Wafer Technology Silicon Carbide iRobotics – Cooperative Robotics in Production Lines
Management Innovations Creating a ‚Culture of Innovation‘ Enabling Innovations in Human Resource Management
Copyright © Infineon Technologies 2011. All rights reserved.
Page 8
Energy Efficiency Key trends Soaring total energy demand across the globe amid dwindling fossil energy resources Strong CO2 policies to achieve climate goals Tapping renewable energies as sustainable energy sources Electrification of the drivetrain of commercial and passenger vehicles
Our contribution Infineon delivers semiconductor innovations playing a valuable role in minimizing power loss and maximizing power savings along the entire energy supply chain, extending from generation through distribution to actual consumption. Our products are the basis for intelligent and optimal use of energy resources in industrial, computing and consumer applications, and in cars. Copyright © Infineon Technologies 2011. All rights reserved.
Page 9
12.0
0.0
8.9
12.0
Most of the electric energy is actually not "consumed" but lost "on the way" 7.18
7.18
6.80
6.80
6.20
6.20
Electricity Generation
5.00
Stone Coal power plant
Transmission & Distribution
ACPower Transmission Distribution
5.00
Consumption (example Notebook)
Power Supply
DC supply
Processor
60 W
220 W 90 W electricity (ca. value)
Mostly thermal losses
1.4 W
3.6 W
13 W
etc. 6.40
Losses: 31 W
6.40
9.20
Memory Display
130 W (~60%)
8.60
13 W
Source: Estimation by Infineon Copyright © Infineon Technologies 2011. All rights reserved.
8.60
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9.20
12.0
0.0
8.9
12.0
However, it is possible to reduce energy losses with use of technology available today! 7.18
7.18
6.80
6.80
6.20
6.20
Electricity Generation
5.00
Transmission & Distribution
Off-shore Wind HVDC Advanced Power Plant Transmission Distribution
85 W (ca. value)
90plus Power Supply
DC supply
Processor
60 W
77 W electricity
8W ~9%
5.00
Consumption (example Notebook)
1.2 W
2.3 W
5W
7W
Memory Display etc.
6.40
8.60 9.20
6.40
Losses: 15.5 W Source: Estimation by Infineon Copyright © Infineon Technologies 2011. All rights reserved.
8.60
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9.20
Mobility Key trends Rigid CO2 regulations and rising oil price Increasing rules on safety, focusing on preventive measures Rising new requirements in cars for emerging markets Urbanization, globalization and demographic change Strong investments in local and long distance public transportation systems
Our contribution
Leading semiconductor solutions contributing to a more sustainable mobility in terms of reduced fuel consumption/emissions, improved safety and affordability.
As an innovation driver and supplier of key components for electric and hybrid vehicles, Infineon will actively help to shape the paradigm shift towards electro mobility on the road.
Innovative public transportation solutions for traction and electronic tickets. Copyright © Infineon Technologies 2011. All rights reserved.
Page 12
Leading national economies promote electromobility to give their industry a head start
1.8 – 5.4
2.2 – 6.3
France State Funded
• Electric Vehicles, Plug-in and Fuel-Cell
• Vehicle with < 60g /km CO2 emission
• Electric Car (Exchange of used cars)
• Battery electric vehicles
• Electric Car (in public transport)
Further Incentives (examples)
• Tax Reduction • Free car registration
• Free car registration • Partial Free parking
• Exemption of sales and tonnage tax
• Free parking • No road maintenance fee and no toll
• Regional contributions
Remark: Only retail incentives; partially direct support for research, development and production structure Source: Bain & Company, The Climate Group Copyright © Infineon Technologies 2011. All rights reserved.
Page 13
Electric and hybrid vehicles drive semiconductor demand Auto(ICE) vs. EV/HEV Semiconductor BOM The material input [in €] of semiconductors in the drivetrain of an electric/hybrid vehicle is 2 to 3 times higher than the average input of semiconductors in cars with conventional combustion engines. IGBT switches and diodes in the latest module packages account for 50-80%.
Market growth fostered by new vehicle launches
Fast followers enter HEV market
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Security Key trends Requirements for secure systems are visible in all areas of life Secure communication everywhere utilizing mobile phone and internet Move to electronic identification of documents and products Contactless cards for payment and electronic tickets Increased electronics in cars, calling for secure data handling
Our contribution
Tailored security according to system requirements, enabling the implementation of transparent security in everyday systems
Leverage our worldwide leadership in security know-how for smart cards in automotive and industrial applications increasingly demanding security
Combining both hardware security and cryptography, our products build the basis for privacy and security while maintaining personal freedom and facilitating extended communication capabilities Copyright © Infineon Technologies 2011. All rights reserved.
Page 15
Agenda Semiconductor Business - an Overview
Market Driven Innovations New Challenges in Energy, Mobility and Security
Hidden Innovations 300 MM Thin-Wafer Technology Silicon Carbide iRobotics – Cooperative Robotics in Production Lines
Management Innovations Creating a ‚Culture of Innovation‘ Enabling Innovations in Human Resource Management
Copyright © Infineon Technologies 2011. All rights reserved.
Page 16
Infineon – Worldwide R&D Network (Excluding Europe) Bejing
Milpitas
Seoul
Morgan Hill
Shanghai
Torrance
Singapore
Bangalore
Malacca
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Infineon – R&D Network in Europe
Duisburg
Warstein
Dresden
Regensburg
Bristol
Linz
Augsburg
Graz
Munich, Neubiberg
Padova
Villach
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Bucharest Page 18
Villach Production Site Villach innovation fab Power semiconductors on 300mm thin-wafers 200
50
75
100
125
150
300
Feasibility study: 300 mm thin-wafer manufacture for power semiconductors First 300mm pilot line in the world in Villach/Austria
Focal area: Energy efficiency Further development of thin-wafer technology raises efficiency First large-scale manufacture in the world with 40µ wafer thickness
Copyright © Infineon Technologies 2011. All rights reserved.
Page 19
12.0
0.0
8.9
12.0
Thin-Wafer Technology Demand driven and Technology Push 7.18
Strictly confidential
6.80
Applications
6.20
5.00
lower power losses lower energy losses lower resistance
Power supplies for computer and server Power supplies for consumer electronics
Technologies
Inductive cooking …
5.00
Demand driven:
Speed-controlled motors, pumps
Automotive
6.80 6.20
Traction (trains)
Lighting
7.18
IGBT Diodes
Wafer front side
MOSFET (e.g. CoolMOS) SPT (smart power technology) …
Manufacturing Competencies Handling an ultra-thin-wafer
6.40
Technology Push 8.60 9.20
Frontside and backside processing
6.40
Equipment Engineering …
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8.60
Page 20
9.20
Energy savings enabled by Ultra-Thin-Wafer Technology Applications with TRENCHSTOP™ IGBT Lower power losses Lower energy losses
Inductive cooking Washing machines Dish washer Tumble dryer Air conditions Refrigerators
SuperJunction MOSFET Lower resistance Lower energy losses
LCD / Plasma TV Gaming consoles Lightning Laptop PC
Active PFC Lower energy losses
LCD / Plasma TV Solar systems Lightning PC
SFET 5 Lower resistance Lower energy losses
Notebook Gaming consoles Electric drives
Annual Savings per private Household
Copyright © Infineon Technologies 2011. All rights reserved.
Reduction of losses
Page 21
IGBTs – Semiconductor technology and special manufacturing expertise enable optimal power densities IGBTs are used for switching high currents typically occurring in the inverter Trench + field stop cells enable low switching losses and high robustness The power losses are primarily determined by the thickness of the wafers used (ultrathin-wafers) Changeover from 6” to 12” wafers will increase the IGBT area yield by 400%
Trench + field stop cell Emitter
Gate
down to 40µm ! n - base(substrate)
Collector
Larger silicon wafers X4.0 devices/ wafer
x1.7
12”
(future)
8”
6”
(2010)
Pdis ~ Waferthickness
(2005)
2
3” Copyright © Infineon Technologies 2011. All rights reserved.
Page 22
Power300 The first microelectronics manufacturer in the world In pursuing organic growth, Infineon focuses on 300mm POWER manufacturing technology Strong growth in revenues of ~10% p.a. driven particularly by photovoltaics (IMM) and electrical drive (ATV) leads to significant increase of in-house production. Area yield expected to increase by 400% compared to 150mm. Start of pilot line for qualification in FY 2011 in Villach (~35‘€ Invest)
Energy-efficient products
Technical challenges particularly ultra-thin-wafer handling and adaption of standard CMOS in power substrates. Start of volume production in 300mm POWER within the next 2 to 3 years.
POWER300
& 100 125 1980 1985
150 1990
Copyright © Infineon Technologies 2011. All rights reserved.
200
2000
und
300 2010
Page 23
QPASS – Quick Personnel Safe Screening Cooperation Rohde & Schwarz and Infineon
Source: by courtesy of Rohde und Schwarz GmbH & Co. KG Copyright © Infineon Technologies 2011. All rights reserved.
Page 24
Summary of technical specifications Fully electronic personnel scanner Automatic detection of hidden objects Center Frequency 77GHz, high bandwidth Very high resolution in x,y,z Dynamic range > 40 dB 3D dataset for automatic detection of hidden objects RF-Output power much less than a Mobile phone
Sensor Active sparse array 3072 Tx and 3072 Rx SiGe-channels and antennas Modular concept with arrays and clusters
Source: by courtesy of Rohde und Schwarz GmbH & Co. KG Copyright © Infineon Technologies 2011. All rights reserved.
Page 25
Silicon Carbide (SiC) – the ideal material for highly efficient power semiconductors Power Semiconductors
Physical properties of SiC
Conduction loss Switching loss
(400V DC, 200A, 8kHz)
SiC switching elements are highly efficient, fast, able to function in high temperature and reliable. SiC significantly extends the range of applications of power semiconductors (300 …
Example: SiC JFET Oxide (ILD)
AlCu
Ti
~ 2500V).
Mo Source
The implementation of SiC products is a challenge (substrate size, crystal defects, transistor properties).
Gate
channel p-SiC topgate
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n-SiC drift layer
p-SiC buried gate
current
Drain Page 26
SiC: THE power semiconductor material of the future? SiC enables loss-less switching SiC power devices play a key role with respect to climate savings initiatives in power electronics SiC power devices are mandatory to continue on Moore‘s law of power density increase (switching frequency , losses)
SiC allows increase of physical ruggedness of power devices SiC devices can withstand very high power densities due to thermal properties SiC devices are still blocking at T>> 200°C Attractive switching devices without Gate Oxide, the main „Achilles heel“ of MOSFETs and IGBT‘s are possible
SiC breaks by far the physical limits of Si power devices (even the state of the art of compensation technology like CoolMOS) This is a key lever for further miniaturization of power devices and allows a complete new group of best in class devices
Copyright © Infineon Technologies 2011. All rights reserved.
Page 27
SiC: The competitive material & market environment Si Cheap and close to perfect base material tremendous manufacturing and application experience So called „physical limits“ are already proven to be “permeable” by smart device design (e.g. CoolMOS) Cost/performance gain has already started to slow down. Are we approaching the “wear out phase” of this very mature technology?
GaN based Power devices with high breakdown voltage (> 1000V) already demonstrated on GaNon-Si Very large scientific community is in place for this material system (opto-electronics, RF) Very high defect density, critical surface passivation and very sensitive manufacturing processes to generate 2D electron gas
SiC power devices offer a huge upside development potential compared to Si without the essential risks of GaN power technology! Copyright © Infineon Technologies 2011. All rights reserved.
Page 28
Physical Properties of Silicon Carbide 5 4,5 4
High thermal stability (>> 500°C)
Si SiC
Chemically stable
3,5 3
Mechanically hard
2,5 2
Radiation hard (excellent stability vs. cosmic radiation)
1,5 1 0,5 0 Band gap [eV]
Breakdown Thermal Field [MV/cm] Conductivity [W/cmK]
Transparent Not toxic
Silicon Carbide Ideal material for high-performance power electronics Copyright © Infineon Technologies 2011. All rights reserved.
Page 29
New approaches enable joint work between man and robots
Manu Inno fact va uring tion
Example: Kuka LBR 4+ lightweight robot
So far: Expensive safety devices keep man and robot apart!
Man-robot interaction combines:
New: “soft” robots permit man-robot interaction in the same workspace!
Fewer safety devices Save space in the cleanroom
Human strengths (creativity, problem-solving, decisions, special tasks, flexibility, …)
Reduce capital outlay Enable access for engineers and operators without system stop
Human flexibility for innovation Unusual special tasks Special processes for innovation
Robot strengths
Robot efficiency for productivity
(performing simple, recurring tasks non stop) Copyright © Infineon Technologies 2011. All rights reserved.
Page 30
Man-robot interaction, using the iRobotics pilot project as an example
ld i B
r e
s s
e B
s e
Manu Inno fact va uring tion
Key data: •3 Kuka LBR-based loading systems load 11 Mattson process lines fully automatically
• Project duration: approx. 8 months
•Process line starts fully automatically
• System 3 prepared
•Box lids are opened and closed pneumatically
• ROI: 18-24 months
•Batch identification in the box nests by RFID (based on Infineon my-d chip)
• Improvements in
•Incoming and outgoing batch conveyance by operators
• Systems 1 and 2 undergoing productive test run
• quality • plant utilization • personnel efficiency
Copyright © Infineon Technologies 2011. All rights reserved.
Page 31
Agenda Semiconductor Business - an Overview
Market Driven Innovations New Challenges in Energy, Mobility and Security
Hidden Innovations 300 MM Thin-Wafer Technology Silicon Carbide iRobotics – Cooperative Robotics in Production Lines
Management Innovations Creating a ‚Culture of Innovation‘ Enabling Innovations in Human Resource Management
Copyright © Infineon Technologies 2011. All rights reserved.
Page 32
Creating a Culture of Innovation Leadership and target setting
Personnel and management development
Top-level expertise and innovation
Innovationmanagement &-culture
Copyright © Infineon Technologies 2011. All rights reserved.
Entering new markets with energy-efficient products
Page 33
We develop and practice an integrated innovation concept! Geared towards the strategic fields of innovation
Strategy
INNOVATION AWARDS
Innovation campaign 6 areas of action 2010
iCommunities INNOVATION DAY Innovation Fab
Research partnerships
Innovation culture
Innovation management annual circle
Innovation projects € 4.5 million
Employee Copyright © Infineon Technologies 2011. All rights reserved.
Page 34
IFAT Innovation Management Model Our annual cycle Control process 4 integrated paths:
The cultural path The creative path The “visibility” path The formal path IFAT innovation culture Results & goals
Economic prospects Copyright © Infineon Technologies 2011. All rights reserved.
Page 35
Innovative Personnel Management Future-proofing Austria as a business location – promoting innovation and increasing appeal Integration: Carinthian International Club (CIC)
Cooperation between various Carinthian companies to facilitate the start and integration of international persons and their families
Women in Technology: Women encourage Women (WeW)
From women in technology to women in technology – Development and support program for women in technical professions
Ensuring new recruits: Ö3-YPD Challenge, SEMI High Tech U
Austria’s top companies provide the most exciting vacation placements – Hannes Jagerhofer initiative
The SEMI High Tech U (HTU) adopts a hands-on approach to introducing youngsters to the fascination of high tech
Employee Development
Training offensive: foreman training, technical studies at University of Applied Sciences or qualification for university entrance
Junior Talent Program (JTP): 24-month trainee program for top graduates
Technical Training: Internal training program, experts train staff Copyright © Infineon Technologies 2011. All rights reserved.
Page 36
Our Vision: Expected Business Environment 2012 Business requirements for a continued market leadership in Power Management Application know-how above our customers.
Innovation Fab Leading edge technologies in own manufacturing facilities.
World-class interaction between application
& technology platforms in next
generation power semi (GaN, Sunny switch, etc).
Copyright © Infineon Technologies 2011. All rights reserved.
Page 37
„be different“ at-a-Glance Project Mission
To foster key competencies of employees in application engineering, R&D, technical & product marketing jobs, supply chain management and manufacturing & process engineering
Target group:
Length
From 6 up to max. 24 months (individually determined)
Roadmaps
5 development platforms: R&D, application engineering, product marketing, supply chain mgmt and UPD/GP/SCM
Reporting structure
Project sponsor: IFAT Vorstand Steering Committe: A Urschitz, O Graf, T Neidhart, F Auerbach Project Manager: V Bianco
Training structure
~20 employees Screened employees from PSD and OPP area Excellent performance demonstrated High predisposition to social skills
Structured individual “Einarbeitungsplan“ and “Patensystem” Internal training via technical ladder- and senior experts Functional training roadmap: application eng., product marketing On the job training Coaching via a mentoring program for selected people Informal learning opportunities: Business Leaders’ Exchange IFAT 2020 Strategy Dialogue, Executives lunches/“Kaminabend”. Copyright © Infineon Technologies 2011. All rights reserved.
Page 38
12.0
0.0
8.9
12.0
SEMI High Tech University About the Program 7.18
7.18
6.80
6.80
6.20
5.00
6.20
SEMI (Semiconductor Equipment and Materials International) is a globally oriented industry association providing support for companies engaged in semiconductor manufacturing and related fields.
5.00
In the interest of ensuring new recruits, SEMI developed the SEMI High Tech U(niversity) program - initiated in the USA – to stimulate the interest of scholars and teachers in science and technology and to point out career opportunities in the industry. Technology is presented to scholars in a playful way so as to give a touch-and-feel experience, using modules adapted to age and interests. The SEMI HTU program consists of practical exercises which establish a link between high school mathematics, science and applications in the everyday world of industry. Examples of the offering cover topics from the areas of mathematics, statistics, basics of physics and chemistry, electronics or nanotechnology. Since 2001 over 100 SEMI HTU programs have been conducted in the USA and Asia, and in 2007 for the first time in Europe. The first event in German-speaking countries was held at Infineon and Carinthia University of Applied Sciences in Villach in April 2008. The target group is scholars aged 13-14 years who are about to choose a career. 6.40
You will find further information on the website www.semi.org
6.40
8.60 9.20
8.60
Copyright © Infineon Technologies 2011. All rights reserved.
Page 39
9.20
12.0
0.0
8.9
12.0
SEMI High Tech University Results (summary of events to date) 7.18
7.18
6.80
6.80
6.20
6.20
5.00
25% - 40% of the scholars per event stated that their career plans had changed as a result of the SEMI HTU.
5.00
All the scholars stated that taking part in the SEMI HTU had widened their knowledge of microelectronics. (knowledge enhanced by 130% to 200%) 99 % of the scholars stated that their expectations of the SEMI HTU had been met or exceeded. “I‘ll never forget this SEMI project and in many years’ time I‘ll look back on these two days with pleasure. The “SEMI High Tech U” project also changed my views on career choice. Since this project I‘m far more interested in electronics.” Feedback of one scholar
6.40
What was the best thing about the day?: “[…] that I now know that technical professions aren’t just for boys.” Feedback of one scholar
6.40
8.60 9.20
8.60
Copyright © Infineon Technologies 2011. All rights reserved.
Page 40
9.20
Hot Jobs@Infineon Austria www.infineon.com/careers Job Profiles
Automotive
■ Analog Design ■ Concept Engineering ■ Application Engineering ■ Digital Layout and Design ■ Firmware Design ■ Mixed-Signal Engineering ■ Product Engineering ■ Program Management ■ Test Engineering
Chipcard & Security
■ System Engineering ■ Mixed-Signal Design Engineering ■ Contactless System Engineering ■ Concept and Digital Design Engineering ■ Firmware Engineering ■ Marketing Management
Industrial & Multimarket
■ (Senior) Application Engineering ■ Analog and Mixed-Signal, Design ■ Layout and Circuit Design ■ Concept Engineering ■ Component Verification Engineering ■ Technology Development Engineering ■ Product Development Engineering ■ Test and Industrial Engineering ■ Product Marketing und Management
Operations & Technics
■ Quality Engineering ■ Industrial Engineering ■ Process Development Engineering ■ Test Engineering ■ Technology Engineering ■ SiC Technoloy Engineering Copyright © Infineon Technologies 2011. All rights reserved.
Open Positions
~ 25
Fields of Study For High Performers (f/m) from the areas: Electrical Engineering (Techn.) Physics (Techn.) Chemistry
~ 25
Microelectronics (and Sensor System) Semiconductor and Microsystems Technology
~ 35
Industrial Engineering Information Technology Materials Science
~ 35
Metallurgy
Page 41