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Mar 25, 2013 - Only bridge power / ground / IOs to C4 bumps. Side-by-Side Die Layout. • Minimal heat flux issues. Passive Silicon Interposer (65nm ...
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Heterogeneous 3-D stacking, can we have the best of both (technology) worlds

Liam Madden Corporate Vice President March 25th, 2013 © Copyright 2012 Xilinx .

The ‘Chameleon’ Chip Field Programmable Gate Array (FPGA)

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© Copyright 2012 Xilinx .

Moore’s Law 1965: Transistor density doubles every year 64K devices 10x doubling (actual 9X) 64 devices

10 years

Revised 1975: Transistor density doubles every two years

“Cramming more components onto integrated circuits” Gordon Moore, Electronics, Volume 38, Number 8, April 19th 1965 Page 3

© Copyright 2012 Xilinx .

A Career in One Graph Minimum Feature Size 1E-05 10um

1E-06 1um

1E-07 100nm

1E-08 10nm

1nm 1E-09 1979

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1981

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© Copyright 2012 Xilinx .

1999

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Cost Comparison: Monolithic vs Multi-Die “Moore’s Law is really about economics” – Gordon Moore

Die Cost

Monolithic

Multi-Die

Die Area

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© Copyright 2012 Xilinx .

Why is First 3D Logic Product an FPGA?

Natural partition using “long lines” Very low “opportunity cost” No 3rd party dependence

“Size matters” to customers Compelling value proposition “next generation density in this generation technology”

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Virtex 2000T: Homogeneous Stacked Silicon Interconnect Technology (SSIT)

FPGA slice

Silicon Interposer >10K routing connections betweenSilicon slices Interposer ~1ns latency

FPGA Slices Side-by-Side

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Elements of SSIT FPGA Interposer

TSV C4

Microbumps 0.04mm Microbumps • Access to power / ground / IOs Through-silicon Vias (TSV) • Only bridge power / ground / IOs to C4 bumps

0.2mm Passive Silicon Interposer (65nm Generation) • 4 conventional metal layers connect micro bumps & TSVs

Side-by-Side Die Layout Package • Minimal heat flux issues Microbumps 28nm FPGA Slice

28nm FPGA Slice

28nm FPGA Slice

28nm FPGA Slice

New!

Silicon Interposer Through-Silicon Vias Package Substrate

1mm

Package Ball

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C4 Bumps BGA Balls

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3D Supply Chain FPGA, Interposer, & Package Design

28nm FPGA & Interposer

Package Substrate IBIDEN

Bump, Die separation CoC/CoWoS, & Assembly

Final Test of Packaged Part

© Copyright 2012 Xilinx .

Co(CoS) Process Flow

Wafer with TSV u-pad/bump, Probe

Dice

Carrier

Carrier Mount Thin & TSV Reveal UBM & C4-bump

Interposer-on-Substrate

Carrier De-mount to Film frame

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Package

© Copyright 2012 Xilinx .

(CoW)oS Process Flow-1 (Courtesy of TSMC) Bottom die

Top-die

Stacking (μbump)

Wafer Molding

Carrier bonding carrier

B/S grinding

B/S C4 bumping Page 11

carrier

carrier © Copyright 2012 Xilinx .

(CoW)oS Process Flow-2 (Courtesy of TSMC) Transfer glass to tape

Tape carrier

Singulation Tape

TIS (Stacking, C4) Build up Subs.

Thermal Interface Metal (TIM) Lid Ring

TIS (Ring+Lid)

Top view

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