VOS. Input offset voltage. ± 2. ± 20. mV. IOS. Input offset current. ± 20. ± 200. nA. Po. Output power d = 0.5%, f =
TDA2030 14 W hi-fi audio amplifier Features ■
Wide-range supply voltage, up to 36 V
■
Single or split power supply
■
Short-circuit protection to ground
■
Thermal shutdown
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Description
Pentawatt (horizontal)
The TDA2030 is a monolithic integrated circuit in the Pentawatt® package, intended for use as a low frequency class-AB amplifier. Typically it provides 14 W output power (d = 0.5%) at 14 V/4 Ω. At ±14 V or 28 V, the guaranteed output power is 12 W on a 4 Ω load and 8 W on an 8 Ω (DIN45500).
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The TDA2030 provides high output current and has very low harmonic and crossover distortion.
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Table 1.
Device summary
Order code
Package
TDA2030H
Pentawatt horizontal
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Furthermore, the device incorporates an original (and patented) short-circuit protection system comprising an arrangement for automatically limiting the dissipated power so as to keep the operating point of the output transistors within their safe operating range. A conventional thermal shutdown system is also included.
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Figure 1.
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Ex: Functional block diagram
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Device overview
1
TDA2030
Device overview Figure 2.
Pin connections (top view)
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Figure 3.
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Test circuit
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TDA2030
Electrical specifications
2
Electrical specifications
2.1
Absolute maximum ratings
Table 2.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
±18 (36)
V
Vs
Supply voltage
Vi
Input voltage
Vs
Vi
Differential input voltage
±15
Io
Output peak current internally limited)
3.5
Ptot
Power dissipation at Tcase = 90 °C
20
Tstg, Tj
Storage and junction temperature
-40 to 150
2.2
Thermal data
Table 3.
Thermal data
Symbol Rth j-case
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W
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°C
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Parameter Thermal resistance junction-case
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2.3
V
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Value
Unit
max 3
C
Refer to the test circuit in Figure 3; VS = ±14 V, Tamb = 25°C unless otherwise specified.
Table 4.
Electrical characteristics
Symbol
Parameter
Vs
s b O Id
Ib
VOS IOS
Po
Test conditions
Supply voltage
Min.
Typ.
±6 12
Max.
Unit
± 18 36
V
Quiescent drain current
40
60
mA
Input bias current
0.2
2
μA
±2
± 20
mV
± 20
± 200
nA
Input offset voltage Input offset current
Vs = ± 18 (Vs = 36)
Output power
d = 0.5%, f = 40 to 15,000 Hz; GV = 30 dB RL = 4 Ω RL = 8 Ω
12 8
14 9
W W
d = 10%, f =1 kHz; GV = 30 dB RL = 4 Ω RL = 8 Ω
12 8
14 9
W W
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Electrical specifications Table 4.
Electrical characteristics (continued)
Symbol
d
TDA2030
Parameter
Distortion
Test conditions
B
Frequency response (–3 dB)
Ri
Input resistance (pin 1)
Gv
Voltage gain (open loop)
Gv
Voltage gain (closed loop)
eN
Input noise voltage
iN
Input noise current
Typ.
Max.
Unit
Po = 0.1 to 12 W, RL = 4 Ω, GV = 30 dB f = 40 to 15.000 Hz
0.2
0.5
%
Po = 0.1 to 8 W, RL = 8 Ω, GV = 30 dB f = 40 to 15.000 Hz
0.1
0.5
%
Po = 12 W, RL = 4 Ω; GV = 30 dB
Hz
5
MΩ
3
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µV
80
200
pA
90 f = 1 kHz
29.5
Supply voltage rejection
GV = 30 dB; RL = 4 Ω, Rg = 22 kΩ, fripple = 100 Hz; Vripple = 0.5 Veff
Id
Drain current
Po = 14 W, RL = 4 Ω Po = 9 W, RL = 8 Ω
Tj
Thermal shutdown junction temperature
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10 Hz to 140 0.5
B = 22 Hz to 22 kHz
SVR
Min.
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Pr 40
30
dB
30.5
dB
50
dB
900 500
mA 145
°C
TDA2030
Electrical specifications
2.4
Characterizations
Figure 4.
Output power vs. supply voltage
Figure 5.
Output power vs. supply voltage
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Figure 6.
Distortion vs. output power
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Figure 7.
Distortion vs. output power
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Electrical specifications
Figure 8.
TDA2030
Distortion vs. output power
Figure 9.
Distortion vs. frequency
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Figure 10. Distortion vs. frequency
Figure 11. Frequency response with different values of the rolloff capacitor C8 (see typical amplifier with split power supply)
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Electrical specifications
Figure 12. Quiescent current vs. supply voltage
Figure 13. Supply voltage rejection vs. voltage gain
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Figure 14. Power dissipation and efficiency vs. output power
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Figure 15. Maximum power dissipation vs. supply voltage (sine wave operation)
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Applications
3
TDA2030
Applications
Figure 16. Typical amplifier with split power supply
Figure 17. Typical amplifier with single power supply
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Figure 18. PC board and component layout for Figure 19. PC board and component layout for a typical amplifier with split power a typical amplifier with single power supply supply
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Applications
Figure 20. Bridge amplifier configuration with split power supply (Po = 28 W, Vs = ±14 V)
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Practical considerations
TDA2030
4
Practical considerations
4.1
Printed circuit board The layout shown in Figure 19 should be adopted by the designers. If different layouts are used, the ground points of input 1 and input 2 must be well decoupled from the ground return of the output in which a high current flows.
4.2
Assembly suggestion No electrical isolation is needed between the package and the heatsink with single supply voltage configuration.
4.3
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Application suggestions
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The recommended values of the components are those shown on application circuit of Figure 16. However, if different values are chosen, then the following table can be helpful. Table 5.
Recommanded
Component
Smaller than recommanded value
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Closed loop gain setting
Increase of gain
Decrease in gain(1)
R2
680 Ω
Closed loop gain setting
Decrease of gain(1)
Increase in gain
R3
22 kΩ
Non-inverting input biasing
Increase of input impedance
Decrease in input impedance
R4
1Ω
)-
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Frequency stability
Danger of oscillation at high frequencies with inductive loads
3 R2
Upper frequency cutoff
Poor high-frequency attenuation
1 µF
Input DC decoupling
Increase in lowfrequency cutoff
C2
22 µF
Inverting input DC decoupling
Increase in lowfrequency cutoff
C3C4
0.1 µF
Supply voltage bypass
Danger of oscillation
C5C6
100 µF
Supply voltage bypass
Danger of oscillation
C7
0.22 µF
Frequency stability
Danger of oscillation
C8
1 -----------------2πBR 1
D1D2
1N4001
let
C1
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Upper frequency cutoff
Smaller bandwidth
To protect the device against output voltage spikes
Closed loop gain must be higher than 24 dB
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Larger than
recommanded value
22 kΩ
so
1.
Purpose
value
R1
R5
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Variations from recommended values
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Danger of oscillation
Larger bandwidth
TDA2030
Table 6.
Practical considerations
Single supply application Recommanded
Component
Purpose
value
Larger than
Smaller than
recommanded value
recommanded value
R1
150 kΩ
Closed loop gain setting
Increase in gain
Decrease in gain(1)
R2
4.7 kΩ
Closed loop gain setting
Decrease in gain(1)
Increase in gain
R3
100 kΩ
Non-inverting input biasing
Increase of input impedance
Decrease in input Impedance
R4
1Ω
Frequency stability
Danger of oscillation at high frequencies with inductive loads
RA/RB
100 kΩ
Non-inverting input biasing
Poor high-frequency attenuation
C1
1 µF
Input DC decoupling
C2
22 µF
Inverting DC decoupling
C3
0.1 µF
Supply voltage bypass
C5
100 µF
Supply voltage bypass
C7
0.22 µF
Frequency stability
C8
1 -----------------2πBR 1
Upper frequency cutoff
D1D2
1N4001
To protect the device against output voltage spikes.
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Smaller bandwidth
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Danger of oscillation Increase in lowfrequency cutoff
Increase in lowfrequency cutoff Danger of oscillation Danger of oscillation Danger of oscillation Larger bandwidth
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1. Closed loop gain must be higher than 24 dB
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Short-circuit protection
5
TDA2030
Short-circuit protection The TDA2030 has an original circuit which limits the current of the output transistors. Figure 21 shows that the maximum output current is a function of the collector emitter voltage; hence the output transistors work within their safe operating area (Figure 5). This function can therefore be considered as being peak power limiting rather than simple current limiting. It reduces the possibility that the device gets damaged during an accidental short-circuit from AC output to ground.
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Figure 21. Maximum output current vs. Figure 22. Safe operating area and collector voltage [VCEsat] across each output characteristics of the protected transistor power transistor
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6
Thermal shutdown
Thermal shutdown The presence of a thermal limiting circuit offers the following advantages: 1.
An overload on the output (even if it is permanent), or an above limit ambient temperature can be easily supported since Tj cannot be higher than 150°C.
2.
The heatsink can have a smaller factor of safety compared with that of a conventional circuit. There is no possibility of device damage due to high junction temperature. If for any reason, the junction temperature increases to 150°C, the thermal shutdown simply reduces the power dissipation at the current consumption.
The maximum allowable power dissipation depends upon the size of the external heatsink (i.e. its thermal resistance); Figure 25 shows this power dissipation as a function of ambient temperature for different thermal resistances.
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Figure 23. Output power and drain current vs. Figure 24. Output power and drain current vs. case temperature (RL = 4 Ω) case temperature (RL = 8 Ω)
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Thermal shutdown
TDA2030
Figure 26. Example of heatsink
Figure 25. Maximum allowable power dissipation vs. ambient temperature
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The following table shows the length that the heatsink in Figure 26 must have for several values of Ptot and Rth. Table 7.
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Recommended values of heatsink
od
Dimension Ptot
Pr
Recommended values 12
8
6
W
Length of heatsink
60
40
30
mm
Rth of heatsink
4.2
6.2
8.3
°C/W
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Unit
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7
Package mechanical data
Package mechanical data Figure 27. Pentawatt (horizontal) package outline and dimensions mm
DIM.
MIN.
inch
TYP.
MAX.
A
MIN.
4.80
C
0.188
1.37
0.054
2.40
2.80
0.094
0.11
D1
1.20
1.35
0.047
0.053
E
0.35
0.55
0.014
0.022
F
0.80
1.05
0.031
0.041
F1
1.00
1.40
0.039
0.055
G
3.20
3.40
3.60
0.126
0.134
0.142
G1
6.60
6.80
7.00
0.260
0.267
0.275
10.40 10.05
10.40
0.395
L
14.20
15.00
0.56
0.59
L1
5.70
6.20
0.224
0.244
L2
14.60
15.20
0.574
0.598
L3
3.50
4.10
0.137
2.60
3.00
0.102
0.118
L6
15.10
15.80
0.594
0.622
L7
6.00
6.60
0.236
0.260
2.10
2.70
0.083
0.106
4.30
4.80
0.170
0.189
DIA
3.65
3.85
0.143
(s) L
Pr
s b O
Pentawatt H
-O
0.151
C
A
D1 L1
E
L3
ol
t e l o
bs
L9 L10
D
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.161 0.05
L5
od
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0.409
1.29
t c u
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0.41
H3
L4
OUTLINE AND MECHANICAL DATA
MAX.
D
H2
ete
TYP.
F
L2 L7 L5
L4
G G1 H2
H3 F1
Resin between leads
Dia.
L9 L6
L10 PENTHME.EPS
0015982
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.
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Revision history
8
TDA2030
Revision history Table 8.
Document revision history
Date
Revision
June 1998
2
Second issue
3
Added Features on page 1 Removed Pentawatt (vertical) package option Replaced Figure 27 with Pentawatt (horizontal) package data Updated presentation of document, minor textual changes
21-Jun-2011
Changes
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Please Read Carefully:
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